JP2023040087A5 - - Google Patents
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- Publication number
- JP2023040087A5 JP2023040087A5 JP2022208047A JP2022208047A JP2023040087A5 JP 2023040087 A5 JP2023040087 A5 JP 2023040087A5 JP 2022208047 A JP2022208047 A JP 2022208047A JP 2022208047 A JP2022208047 A JP 2022208047A JP 2023040087 A5 JP2023040087 A5 JP 2023040087A5
- Authority
- JP
- Japan
- Prior art keywords
- glass wafer
- less
- silica glass
- major surface
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 12
- 239000011521 glass Substances 0.000 claims 3
- 230000003287 optical effect Effects 0.000 claims 2
- 229910004298 SiO 2 Inorganic materials 0.000 claims 1
- 229910010413 TiO 2 Inorganic materials 0.000 claims 1
- 238000011109 contamination Methods 0.000 claims 1
- 230000003746 surface roughness Effects 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762463320P | 2017-02-24 | 2017-02-24 | |
| US62/463,320 | 2017-02-24 | ||
| JP2019545991A JP7594857B2 (ja) | 2017-02-24 | 2018-02-23 | 高アスペクト比のガラスウエハ |
| PCT/US2018/019421 WO2018156894A1 (en) | 2017-02-24 | 2018-02-23 | High aspect ratio glass wafer |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019545991A Division JP7594857B2 (ja) | 2017-02-24 | 2018-02-23 | 高アスペクト比のガラスウエハ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023040087A JP2023040087A (ja) | 2023-03-22 |
| JP2023040087A5 true JP2023040087A5 (https=) | 2023-04-21 |
Family
ID=61599639
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019545991A Active JP7594857B2 (ja) | 2017-02-24 | 2018-02-23 | 高アスペクト比のガラスウエハ |
| JP2022208047A Pending JP2023040087A (ja) | 2017-02-24 | 2022-12-26 | 高アスペクト比のガラスウエハ |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019545991A Active JP7594857B2 (ja) | 2017-02-24 | 2018-02-23 | 高アスペクト比のガラスウエハ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10935698B2 (https=) |
| EP (1) | EP3585743A1 (https=) |
| JP (2) | JP7594857B2 (https=) |
| KR (1) | KR102536919B1 (https=) |
| CN (2) | CN121878904A (https=) |
| TW (1) | TWI771375B (https=) |
| WO (1) | WO2018156894A1 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017178912A1 (en) * | 2016-04-13 | 2017-10-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device including the semiconductor device |
| CN116655238A (zh) * | 2018-08-31 | 2023-08-29 | Ａｇｃ株式会社 | 光学玻璃和光学部件 |
| US12037282B2 (en) | 2018-11-01 | 2024-07-16 | Corning Incorporated | Strengthened glass articles with reduced delayed breakage and methods of making the same |
| US11022753B2 (en) * | 2019-02-14 | 2021-06-01 | Magic Leap, Inc. | Biased total thickness variations in waveguide display substrates |
| US11279614B2 (en) * | 2019-06-28 | 2022-03-22 | Analog Devices, Inc. | Low-parasitic capacitance MEMS inertial sensors and related methods |
| EP3970193A2 (en) * | 2019-09-17 | 2022-03-23 | Google LLC | Suppressing scattering of light transmitted through oled displays |
| JP7003178B2 (ja) * | 2020-04-21 | 2022-01-20 | Hoya株式会社 | 円盤状ガラス基板の製造方法、薄板ガラス基板の製造方法、導光板の製造方法及び円盤状ガラス基板 |
| CN114180826A (zh) * | 2020-09-14 | 2022-03-15 | 肖特股份有限公司 | 低光损耗玻璃制品 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7112359B2 (en) * | 2001-08-22 | 2006-09-26 | Inphase Technologies, Inc. | Method and apparatus for multilayer optical articles |
| US7086927B2 (en) | 2004-03-09 | 2006-08-08 | Micron Technology, Inc. | Methods and systems for planarizing workpieces, e.g., microelectronic workpieces |
| CN100501932C (zh) * | 2005-04-27 | 2009-06-17 | 株式会社迪斯科 | 半导体晶片及其加工方法 |
| JP5390740B2 (ja) * | 2005-04-27 | 2014-01-15 | 株式会社ディスコ | ウェーハの加工方法 |
| US7928026B2 (en) | 2005-06-30 | 2011-04-19 | Corning Incorporated | Synthetic silica material with low fluence-dependent-transmission and method of making the same |
| US20070082179A1 (en) * | 2005-10-07 | 2007-04-12 | Wade James J | Method and apparatus for forming optical articles |
| US7691730B2 (en) | 2005-11-22 | 2010-04-06 | Corning Incorporated | Large area semiconductor on glass insulator |
| DE102006032047A1 (de) * | 2006-07-10 | 2008-01-24 | Schott Ag | Verfahren zur Herstellung optoelektronischer Bauelemente und damit hergestellte Erzeugnisse |
| US20080179755A1 (en) * | 2007-01-31 | 2008-07-31 | International Business Machines Corporation | Structure and method for creating reliable deep via connections in a silicon carrier |
| US8062986B2 (en) | 2007-07-27 | 2011-11-22 | Corning Incorporated | Fused silica having low OH, OD levels and method of making |
| US7920342B2 (en) * | 2008-07-01 | 2011-04-05 | Aptina Imaging Corporation | Over-molded glass lenses and method of forming the same |
| JP5091066B2 (ja) | 2008-09-11 | 2012-12-05 | 富士フイルム株式会社 | 固体撮像装置の製造方法 |
| JP5436876B2 (ja) * | 2009-02-02 | 2014-03-05 | 株式会社ディスコ | 研削方法 |
| JP5060571B2 (ja) * | 2010-03-08 | 2012-10-31 | 株式会社大川金型設計事務所 | ウェーハホルダフレームの製造方法 |
| WO2012056807A1 (ja) * | 2010-10-25 | 2012-05-03 | 日本碍子株式会社 | セラミックス材料、積層体、半導体製造装置用部材及びスパッタリングターゲット部材 |
| US8859103B2 (en) | 2010-11-05 | 2014-10-14 | Joseph Eugene Canale | Glass wafers for semiconductor fabrication processes and methods of making same |
| US9227295B2 (en) * | 2011-05-27 | 2016-01-05 | Corning Incorporated | Non-polished glass wafer, thinning system and method for using the non-polished glass wafer to thin a semiconductor wafer |
| DE102012103077B4 (de) * | 2012-04-10 | 2017-06-22 | Schott Ag | Infrarot-absorbierender Glas-Wafer und Verfahren zu dessen Herstellung |
| JP6395600B2 (ja) | 2012-05-30 | 2018-09-26 | オリンパス株式会社 | 撮像装置の製造方法および半導体装置の製造方法 |
| WO2013179767A1 (ja) | 2012-05-30 | 2013-12-05 | オリンパス株式会社 | 撮像装置の製造方法および半導体装置の製造方法 |
| US9221289B2 (en) * | 2012-07-27 | 2015-12-29 | Apple Inc. | Sapphire window |
| JP2014151376A (ja) | 2013-02-05 | 2014-08-25 | Seiko Instruments Inc | ウエハ研磨方法及び電子デバイス製造方法 |
| CN105164795B (zh) * | 2013-04-30 | 2020-07-14 | 康宁股份有限公司 | 具有耗尽层的玻璃和构造于其上的多晶硅tft |
| US9966293B2 (en) * | 2014-09-19 | 2018-05-08 | Infineon Technologies Ag | Wafer arrangement and method for processing a wafer |
| WO2016115685A1 (en) | 2015-01-20 | 2016-07-28 | Schott Glass Technologies (Suzhou) Co. Ltd. | Low cte glass with high uv-transmittance and solarization resistance |
| KR102508645B1 (ko) | 2015-03-10 | 2023-03-10 | 니폰 덴키 가라스 가부시키가이샤 | 반도체용 지지 유리 기판 및 이것을 사용한 적층 기판 |
-
2018
- 2018-02-22 TW TW107105940A patent/TWI771375B/zh active
- 2018-02-23 CN CN202610086877.XA patent/CN121878904A/zh active Pending
- 2018-02-23 WO PCT/US2018/019421 patent/WO2018156894A1/en not_active Ceased
- 2018-02-23 KR KR1020197027352A patent/KR102536919B1/ko active Active
- 2018-02-23 EP EP18709891.8A patent/EP3585743A1/en active Pending
- 2018-02-23 US US15/903,787 patent/US10935698B2/en active Active
- 2018-02-23 JP JP2019545991A patent/JP7594857B2/ja active Active
- 2018-02-23 CN CN201880013996.6A patent/CN110461784A/zh active Pending
-
2022
- 2022-12-26 JP JP2022208047A patent/JP2023040087A/ja active Pending
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