KR102536919B1 - 높은 가로세로 비를 갖는 유리 웨이퍼 - Google Patents

높은 가로세로 비를 갖는 유리 웨이퍼 Download PDF

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Publication number
KR102536919B1
KR102536919B1 KR1020197027352A KR20197027352A KR102536919B1 KR 102536919 B1 KR102536919 B1 KR 102536919B1 KR 1020197027352 A KR1020197027352 A KR 1020197027352A KR 20197027352 A KR20197027352 A KR 20197027352A KR 102536919 B1 KR102536919 B1 KR 102536919B1
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Prior art keywords
glass wafer
less
equal
major surface
glass
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Korean (ko)
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KR20190117018A (ko
Inventor
마이클 루시엔 게니어
존 타일러 키치
로버트 사비아
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코닝 인코포레이티드
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C1/00—Ingredients generally applicable to manufacture of glasses, glazes, or vitreous enamels
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/001—General methods for coating; Devices therefor
    • C03C17/002—General methods for coating; Devices therefor for flat glass, e.g. float glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/06—Glass compositions containing silica with more than 90% silica by weight, e.g. quartz
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11—Anti-reflection coatings
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2201/00—Glass compositions
    • C03C2201/06—Doped silica-based glasses
    • C03C2201/30—Doped silica-based glasses containing metals
    • C03C2201/40—Doped silica-based glasses containing metals containing transition metals other than rare earth metals, e.g. Zr, Nb, Ta or Zn
    • C03C2201/42—Doped silica-based glasses containing metals containing transition metals other than rare earth metals, e.g. Zr, Nb, Ta or Zn containing titanium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/70—Properties of coatings
    • C03C2217/73—Anti-reflective coatings with specific characteristics
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/70—Properties of coatings
    • C03C2217/73—Anti-reflective coatings with specific characteristics
    • C03C2217/732—Anti-reflective coatings with specific characteristics made of a single layer

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  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Glass Compositions (AREA)
  • Surface Treatment Of Glass (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020197027352A 2017-02-24 2018-02-23 높은 가로세로 비를 갖는 유리 웨이퍼 Active KR102536919B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762463320P 2017-02-24 2017-02-24
US62/463,320 2017-02-24
PCT/US2018/019421 WO2018156894A1 (en) 2017-02-24 2018-02-23 High aspect ratio glass wafer

Publications (2)

Publication Number Publication Date
KR20190117018A KR20190117018A (ko) 2019-10-15
KR102536919B1 true KR102536919B1 (ko) 2023-05-25

Family

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KR1020197027352A Active KR102536919B1 (ko) 2017-02-24 2018-02-23 높은 가로세로 비를 갖는 유리 웨이퍼

Country Status (7)

Country Link
US (1) US10935698B2 (https=)
EP (1) EP3585743A1 (https=)
JP (2) JP7594857B2 (https=)
KR (1) KR102536919B1 (https=)
CN (2) CN121878904A (https=)
TW (1) TWI771375B (https=)
WO (1) WO2018156894A1 (https=)

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WO2017178912A1 (en) * 2016-04-13 2017-10-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device including the semiconductor device
CN116655238A (zh) * 2018-08-31 2023-08-29 Ａｇｃ株式会社 光学玻璃和光学部件
US12037282B2 (en) 2018-11-01 2024-07-16 Corning Incorporated Strengthened glass articles with reduced delayed breakage and methods of making the same
US11022753B2 (en) * 2019-02-14 2021-06-01 Magic Leap, Inc. Biased total thickness variations in waveguide display substrates
US11279614B2 (en) * 2019-06-28 2022-03-22 Analog Devices, Inc. Low-parasitic capacitance MEMS inertial sensors and related methods
EP3970193A2 (en) * 2019-09-17 2022-03-23 Google LLC Suppressing scattering of light transmitted through oled displays
JP7003178B2 (ja) * 2020-04-21 2022-01-20 Hoya株式会社 円盤状ガラス基板の製造方法、薄板ガラス基板の製造方法、導光板の製造方法及び円盤状ガラス基板
CN114180826A (zh) * 2020-09-14 2022-03-15 肖特股份有限公司 低光损耗玻璃制品

Citations (1)

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JP2007019461A (ja) * 2005-04-27 2007-01-25 Disco Abrasive Syst Ltd ウェーハの加工方法及びウェーハ

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US7112359B2 (en) * 2001-08-22 2006-09-26 Inphase Technologies, Inc. Method and apparatus for multilayer optical articles
US7086927B2 (en) 2004-03-09 2006-08-08 Micron Technology, Inc. Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
CN100501932C (zh) * 2005-04-27 2009-06-17 株式会社迪斯科 半导体晶片及其加工方法
US7928026B2 (en) 2005-06-30 2011-04-19 Corning Incorporated Synthetic silica material with low fluence-dependent-transmission and method of making the same
US20070082179A1 (en) * 2005-10-07 2007-04-12 Wade James J Method and apparatus for forming optical articles
US7691730B2 (en) 2005-11-22 2010-04-06 Corning Incorporated Large area semiconductor on glass insulator
DE102006032047A1 (de) * 2006-07-10 2008-01-24 Schott Ag Verfahren zur Herstellung optoelektronischer Bauelemente und damit hergestellte Erzeugnisse
US20080179755A1 (en) * 2007-01-31 2008-07-31 International Business Machines Corporation Structure and method for creating reliable deep via connections in a silicon carrier
US8062986B2 (en) 2007-07-27 2011-11-22 Corning Incorporated Fused silica having low OH, OD levels and method of making
US7920342B2 (en) * 2008-07-01 2011-04-05 Aptina Imaging Corporation Over-molded glass lenses and method of forming the same
JP5091066B2 (ja) 2008-09-11 2012-12-05 富士フイルム株式会社 固体撮像装置の製造方法
JP5436876B2 (ja) * 2009-02-02 2014-03-05 株式会社ディスコ 研削方法
JP5060571B2 (ja) * 2010-03-08 2012-10-31 株式会社大川金型設計事務所 ウェーハホルダフレームの製造方法
WO2012056807A1 (ja) * 2010-10-25 2012-05-03 日本碍子株式会社 セラミックス材料、積層体、半導体製造装置用部材及びスパッタリングターゲット部材
US8859103B2 (en) 2010-11-05 2014-10-14 Joseph Eugene Canale Glass wafers for semiconductor fabrication processes and methods of making same
US9227295B2 (en) * 2011-05-27 2016-01-05 Corning Incorporated Non-polished glass wafer, thinning system and method for using the non-polished glass wafer to thin a semiconductor wafer
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JP6395600B2 (ja) 2012-05-30 2018-09-26 オリンパス株式会社 撮像装置の製造方法および半導体装置の製造方法
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JP2007019461A (ja) * 2005-04-27 2007-01-25 Disco Abrasive Syst Ltd ウェーハの加工方法及びウェーハ

Also Published As

Publication number Publication date
JP2023040087A (ja) 2023-03-22
TWI771375B (zh) 2022-07-21
US20180246257A1 (en) 2018-08-30
EP3585743A1 (en) 2020-01-01
JP2020511383A (ja) 2020-04-16
WO2018156894A1 (en) 2018-08-30
CN121878904A (zh) 2026-04-17
KR20190117018A (ko) 2019-10-15
TW201834223A (zh) 2018-09-16
CN110461784A (zh) 2019-11-15
US10935698B2 (en) 2021-03-02
JP7594857B2 (ja) 2024-12-05

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