JP2022543811A5 - - Google Patents
Info
- Publication number
- JP2022543811A5 JP2022543811A5 JP2022507326A JP2022507326A JP2022543811A5 JP 2022543811 A5 JP2022543811 A5 JP 2022543811A5 JP 2022507326 A JP2022507326 A JP 2022507326A JP 2022507326 A JP2022507326 A JP 2022507326A JP 2022543811 A5 JP2022543811 A5 JP 2022543811A5
- Authority
- JP
- Japan
- Prior art keywords
- edge ring
- ring system
- substrate support
- flange portion
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024206843A JP2025028997A (ja) | 2019-08-05 | 2024-11-28 | 基板処理システムのためのエッジリングシステム |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962882901P | 2019-08-05 | 2019-08-05 | |
| US62/882,901 | 2019-08-05 | ||
| PCT/US2020/044168 WO2021025934A1 (en) | 2019-08-05 | 2020-07-30 | Edge ring systems for substrate processing systems |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024206843A Division JP2025028997A (ja) | 2019-08-05 | 2024-11-28 | 基板処理システムのためのエッジリングシステム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022543811A JP2022543811A (ja) | 2022-10-14 |
| JP2022543811A5 true JP2022543811A5 (https=) | 2023-08-07 |
| JP7597788B2 JP7597788B2 (ja) | 2024-12-10 |
Family
ID=74504014
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022507326A Active JP7597788B2 (ja) | 2019-08-05 | 2020-07-30 | 基板処理システムのためのエッジリングシステム |
| JP2024206843A Pending JP2025028997A (ja) | 2019-08-05 | 2024-11-28 | 基板処理システムのためのエッジリングシステム |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024206843A Pending JP2025028997A (ja) | 2019-08-05 | 2024-11-28 | 基板処理システムのためのエッジリングシステム |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20220285136A1 (https=) |
| EP (1) | EP4010915A4 (https=) |
| JP (2) | JP7597788B2 (https=) |
| KR (2) | KR102934211B1 (https=) |
| CN (2) | CN118431063A (https=) |
| WO (1) | WO2021025934A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118398464A (zh) | 2018-08-13 | 2024-07-26 | 朗姆研究公司 | 可更换和/或可折叠的用于等离子鞘调整的并入边缘环定位和定心功能的边缘环组件 |
| CN115315775A (zh) | 2020-03-23 | 2022-11-08 | 朗姆研究公司 | 衬底处理系统中的中环腐蚀补偿 |
| CN116349002A (zh) | 2020-10-05 | 2023-06-27 | 朗姆研究公司 | 用于等离子体处理系统的可移动边缘环 |
| KR102585290B1 (ko) * | 2021-06-14 | 2023-10-10 | 하나머티리얼즈(주) | 포커스 링 및 그를 포함하는 플라즈마 장치 |
| KR20240161340A (ko) | 2023-05-04 | 2024-11-12 | 삼성전자주식회사 | 포커스 링 및 이를 포함하는 기판 처리 장치 |
| US20250253139A1 (en) * | 2024-02-01 | 2025-08-07 | Applied Materials, Inc. | Liner and edge ring to prevent gas diffusion |
| WO2026006068A1 (en) * | 2024-06-26 | 2026-01-02 | Lam Research Corporation | Seal to mitigate particle contamination in plasma chambers |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6159299A (en) * | 1999-02-09 | 2000-12-12 | Applied Materials, Inc. | Wafer pedestal with a purge ring |
| KR20020071398A (ko) * | 2001-03-06 | 2002-09-12 | 삼성전자 주식회사 | 반도체 장치의 제조에서 건식 식각 장치 |
| KR20040016693A (ko) * | 2002-08-19 | 2004-02-25 | 삼성전자주식회사 | 웨이퍼 지지대 |
| US6896765B2 (en) * | 2002-09-18 | 2005-05-24 | Lam Research Corporation | Method and apparatus for the compensation of edge ring wear in a plasma processing chamber |
| US20040241995A1 (en) * | 2003-03-27 | 2004-12-02 | Matsushita Electric Industrial Co., Ltd. | Etching apparatus and etching method |
| KR100578129B1 (ko) * | 2003-09-19 | 2006-05-10 | 삼성전자주식회사 | 플라즈마 식각 장치 |
| US20060043067A1 (en) * | 2004-08-26 | 2006-03-02 | Lam Research Corporation | Yttria insulator ring for use inside a plasma chamber |
| US7758764B2 (en) * | 2007-06-28 | 2010-07-20 | Lam Research Corporation | Methods and apparatus for substrate processing |
| JP5281811B2 (ja) * | 2008-03-13 | 2013-09-04 | 東京エレクトロン株式会社 | プラズマ処理用環状部品、プラズマ処理装置、及び外側環状部材 |
| KR200483130Y1 (ko) * | 2012-10-20 | 2017-04-18 | 어플라이드 머티어리얼스, 인코포레이티드 | 세그먼트화된 포커스 링 조립체 |
| US9425077B2 (en) * | 2013-03-15 | 2016-08-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor apparatus with transportable edge ring for substrate transport |
| JP6853038B2 (ja) * | 2013-06-26 | 2021-03-31 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Ｉｃｐプラズマ処理チャンバ内における高収率・基板最端部欠陥低減のための単一リング設計 |
| US10658222B2 (en) * | 2015-01-16 | 2020-05-19 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
| CN116110846A (zh) | 2016-01-26 | 2023-05-12 | 应用材料公司 | 晶片边缘环升降解决方案 |
| CN108369922B (zh) * | 2016-01-26 | 2023-03-21 | 应用材料公司 | 晶片边缘环升降解决方案 |
| JP7098273B2 (ja) * | 2016-03-04 | 2022-07-11 | アプライド マテリアルズ インコーポレイテッド | ユニバーサルプロセスキット |
| US10910195B2 (en) * | 2017-01-05 | 2021-02-02 | Lam Research Corporation | Substrate support with improved process uniformity |
| KR102591660B1 (ko) * | 2017-07-24 | 2023-10-19 | 램 리써치 코포레이션 | 이동가능한 에지 링 설계들 |
| WO2019103722A1 (en) * | 2017-11-21 | 2019-05-31 | Lam Research Corporation | Bottom and middle edge rings |
| US11043400B2 (en) * | 2017-12-21 | 2021-06-22 | Applied Materials, Inc. | Movable and removable process kit |
| US11387134B2 (en) * | 2018-01-19 | 2022-07-12 | Applied Materials, Inc. | Process kit for a substrate support |
| US20200234928A1 (en) * | 2019-01-17 | 2020-07-23 | Applied Materials, Inc. | Semiconductor plasma processing equipment with wafer edge plasma sheath tuning ability |
| US11018046B2 (en) * | 2019-04-12 | 2021-05-25 | Samsung Electronics Co., Ltd. | Substrate processing apparatus including edge ring |
| JP7321026B2 (ja) * | 2019-08-02 | 2023-08-04 | 東京エレクトロン株式会社 | エッジリング、載置台、基板処理装置及び基板処理方法 |
-
2020
- 2020-07-30 WO PCT/US2020/044168 patent/WO2021025934A1/en not_active Ceased
- 2020-07-30 JP JP2022507326A patent/JP7597788B2/ja active Active
- 2020-07-30 CN CN202410557195.3A patent/CN118431063A/zh active Pending
- 2020-07-30 KR KR1020227007528A patent/KR102934211B1/ko active Active
- 2020-07-30 EP EP20850609.7A patent/EP4010915A4/en active Pending
- 2020-07-30 US US17/631,984 patent/US20220285136A1/en active Pending
- 2020-07-30 CN CN202080056418.8A patent/CN114207772B/zh active Active
- 2020-07-30 KR KR1020267006213A patent/KR20260030961A/ko active Pending
-
2024
- 2024-11-28 JP JP2024206843A patent/JP2025028997A/ja active Pending
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