KR102934211B1 - 기판 프로세싱 시스템들을 위한 에지 링 시스템들 - Google Patents

기판 프로세싱 시스템들을 위한 에지 링 시스템들

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Publication number
KR102934211B1
KR102934211B1 KR1020227007528A KR20227007528A KR102934211B1 KR 102934211 B1 KR102934211 B1 KR 102934211B1 KR 1020227007528 A KR1020227007528 A KR 1020227007528A KR 20227007528 A KR20227007528 A KR 20227007528A KR 102934211 B1 KR102934211 B1 KR 102934211B1
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KR
South Korea
Prior art keywords
edge ring
paragraph
base plate
radially
annular body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227007528A
Other languages
English (en)
Korean (ko)
Other versions
KR20220038172A (ko
Inventor
휘 링 한
씬웨이 후앙
알렉산더 밀러 패터슨
사라바나프리얀 스리라만
앤 에릭슨
조안나 우
시타라만 라마찬드란
크리스토퍼 킴볼
아리스 페레즈
Original Assignee
램 리써치 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 램 리써치 코포레이션 filed Critical 램 리써치 코포레이션
Priority to KR1020267006213A priority Critical patent/KR20260030961A/ko
Publication of KR20220038172A publication Critical patent/KR20220038172A/ko
Application granted granted Critical
Publication of KR102934211B1 publication Critical patent/KR102934211B1/ko
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
KR1020227007528A 2019-08-05 2020-07-30 기판 프로세싱 시스템들을 위한 에지 링 시스템들 Active KR102934211B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020267006213A KR20260030961A (ko) 2019-08-05 2020-07-30 기판 프로세싱 시스템들을 위한 에지 링 시스템들

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962882901P 2019-08-05 2019-08-05
US62/882,901 2019-08-05
PCT/US2020/044168 WO2021025934A1 (en) 2019-08-05 2020-07-30 Edge ring systems for substrate processing systems

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020267006213A Division KR20260030961A (ko) 2019-08-05 2020-07-30 기판 프로세싱 시스템들을 위한 에지 링 시스템들

Publications (2)

Publication Number Publication Date
KR20220038172A KR20220038172A (ko) 2022-03-25
KR102934211B1 true KR102934211B1 (ko) 2026-03-04

Family

ID=74504014

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020227007528A Active KR102934211B1 (ko) 2019-08-05 2020-07-30 기판 프로세싱 시스템들을 위한 에지 링 시스템들
KR1020267006213A Pending KR20260030961A (ko) 2019-08-05 2020-07-30 기판 프로세싱 시스템들을 위한 에지 링 시스템들

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020267006213A Pending KR20260030961A (ko) 2019-08-05 2020-07-30 기판 프로세싱 시스템들을 위한 에지 링 시스템들

Country Status (6)

Country Link
US (1) US20220285136A1 (https=)
EP (1) EP4010915A4 (https=)
JP (2) JP7597788B2 (https=)
KR (2) KR102934211B1 (https=)
CN (2) CN118431063A (https=)
WO (1) WO2021025934A1 (https=)

Families Citing this family (7)

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Publication number Priority date Publication date Assignee Title
CN118398464A (zh) 2018-08-13 2024-07-26 朗姆研究公司 可更换和/或可折叠的用于等离子鞘调整的并入边缘环定位和定心功能的边缘环组件
CN115315775A (zh) 2020-03-23 2022-11-08 朗姆研究公司 衬底处理系统中的中环腐蚀补偿
CN116349002A (zh) 2020-10-05 2023-06-27 朗姆研究公司 用于等离子体处理系统的可移动边缘环
KR102585290B1 (ko) * 2021-06-14 2023-10-10 하나머티리얼즈(주) 포커스 링 및 그를 포함하는 플라즈마 장치
KR20240161340A (ko) 2023-05-04 2024-11-12 삼성전자주식회사 포커스 링 및 이를 포함하는 기판 처리 장치
US20250253139A1 (en) * 2024-02-01 2025-08-07 Applied Materials, Inc. Liner and edge ring to prevent gas diffusion
WO2026006068A1 (en) * 2024-06-26 2026-01-02 Lam Research Corporation Seal to mitigate particle contamination in plasma chambers

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WO2014209492A1 (en) 2013-06-26 2014-12-31 Applied Materials, Inc. Single ring design for high yield, substrate extreme edge defect reduction in icp plasma processing chamber
JP2019505088A (ja) 2016-01-26 2019-02-21 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ウェハエッジリングの持ち上げに関する解決
WO2019103722A1 (en) * 2017-11-21 2019-05-31 Lam Research Corporation Bottom and middle edge rings

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US6159299A (en) * 1999-02-09 2000-12-12 Applied Materials, Inc. Wafer pedestal with a purge ring
KR20020071398A (ko) * 2001-03-06 2002-09-12 삼성전자 주식회사 반도체 장치의 제조에서 건식 식각 장치
KR20040016693A (ko) * 2002-08-19 2004-02-25 삼성전자주식회사 웨이퍼 지지대
US6896765B2 (en) * 2002-09-18 2005-05-24 Lam Research Corporation Method and apparatus for the compensation of edge ring wear in a plasma processing chamber
US20040241995A1 (en) * 2003-03-27 2004-12-02 Matsushita Electric Industrial Co., Ltd. Etching apparatus and etching method
KR100578129B1 (ko) * 2003-09-19 2006-05-10 삼성전자주식회사 플라즈마 식각 장치
US20060043067A1 (en) * 2004-08-26 2006-03-02 Lam Research Corporation Yttria insulator ring for use inside a plasma chamber
US7758764B2 (en) * 2007-06-28 2010-07-20 Lam Research Corporation Methods and apparatus for substrate processing
JP5281811B2 (ja) * 2008-03-13 2013-09-04 東京エレクトロン株式会社 プラズマ処理用環状部品、プラズマ処理装置、及び外側環状部材
KR200483130Y1 (ko) * 2012-10-20 2017-04-18 어플라이드 머티어리얼스, 인코포레이티드 세그먼트화된 포커스 링 조립체
US9425077B2 (en) * 2013-03-15 2016-08-23 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor apparatus with transportable edge ring for substrate transport
US10658222B2 (en) * 2015-01-16 2020-05-19 Lam Research Corporation Moveable edge coupling ring for edge process control during semiconductor wafer processing
CN108369922B (zh) * 2016-01-26 2023-03-21 应用材料公司 晶片边缘环升降解决方案
JP7098273B2 (ja) * 2016-03-04 2022-07-11 アプライド マテリアルズ インコーポレイテッド ユニバーサルプロセスキット
US10910195B2 (en) * 2017-01-05 2021-02-02 Lam Research Corporation Substrate support with improved process uniformity
KR102591660B1 (ko) * 2017-07-24 2023-10-19 램 리써치 코포레이션 이동가능한 에지 링 설계들
US11043400B2 (en) * 2017-12-21 2021-06-22 Applied Materials, Inc. Movable and removable process kit
US11387134B2 (en) * 2018-01-19 2022-07-12 Applied Materials, Inc. Process kit for a substrate support
US20200234928A1 (en) * 2019-01-17 2020-07-23 Applied Materials, Inc. Semiconductor plasma processing equipment with wafer edge plasma sheath tuning ability
US11018046B2 (en) * 2019-04-12 2021-05-25 Samsung Electronics Co., Ltd. Substrate processing apparatus including edge ring
JP7321026B2 (ja) * 2019-08-02 2023-08-04 東京エレクトロン株式会社 エッジリング、載置台、基板処理装置及び基板処理方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014209492A1 (en) 2013-06-26 2014-12-31 Applied Materials, Inc. Single ring design for high yield, substrate extreme edge defect reduction in icp plasma processing chamber
JP2019505088A (ja) 2016-01-26 2019-02-21 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ウェハエッジリングの持ち上げに関する解決
WO2019103722A1 (en) * 2017-11-21 2019-05-31 Lam Research Corporation Bottom and middle edge rings

Also Published As

Publication number Publication date
CN114207772A (zh) 2022-03-18
EP4010915A1 (en) 2022-06-15
US20220285136A1 (en) 2022-09-08
JP2022543811A (ja) 2022-10-14
JP2025028997A (ja) 2025-03-05
CN118431063A (zh) 2024-08-02
KR20220038172A (ko) 2022-03-25
EP4010915A4 (en) 2023-12-13
KR20260030961A (ko) 2026-03-06
JP7597788B2 (ja) 2024-12-10
WO2021025934A1 (en) 2021-02-11
CN114207772B (zh) 2024-05-24

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