CN118431063A - 用于衬底处理系统的边缘环系统 - Google Patents

用于衬底处理系统的边缘环系统 Download PDF

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Publication number
CN118431063A
CN118431063A CN202410557195.3A CN202410557195A CN118431063A CN 118431063 A CN118431063 A CN 118431063A CN 202410557195 A CN202410557195 A CN 202410557195A CN 118431063 A CN118431063 A CN 118431063A
Authority
CN
China
Prior art keywords
edge ring
substrate
annular body
radially
guide sleeve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202410557195.3A
Other languages
English (en)
Chinese (zh)
Inventor
韩慧玲
黄新伟
亚历山大·米勒·帕特森
萨拉瓦纳普里亚·西里拉曼
安·埃里克森
乔安娜·吴
施萨拉曼·拉马钱德兰
克里斯托弗·金博尔
阿里斯·佩雷斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of CN118431063A publication Critical patent/CN118431063A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
CN202410557195.3A 2019-08-05 2020-07-30 用于衬底处理系统的边缘环系统 Pending CN118431063A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201962882901P 2019-08-05 2019-08-05
US62/882,901 2019-08-05
CN202080056418.8A CN114207772B (zh) 2019-08-05 2020-07-30 用于衬底处理系统的边缘环系统
PCT/US2020/044168 WO2021025934A1 (en) 2019-08-05 2020-07-30 Edge ring systems for substrate processing systems

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN202080056418.8A Division CN114207772B (zh) 2019-08-05 2020-07-30 用于衬底处理系统的边缘环系统

Publications (1)

Publication Number Publication Date
CN118431063A true CN118431063A (zh) 2024-08-02

Family

ID=74504014

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202410557195.3A Pending CN118431063A (zh) 2019-08-05 2020-07-30 用于衬底处理系统的边缘环系统
CN202080056418.8A Active CN114207772B (zh) 2019-08-05 2020-07-30 用于衬底处理系统的边缘环系统

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202080056418.8A Active CN114207772B (zh) 2019-08-05 2020-07-30 用于衬底处理系统的边缘环系统

Country Status (6)

Country Link
US (1) US20220285136A1 (https=)
EP (1) EP4010915A4 (https=)
JP (2) JP7597788B2 (https=)
KR (2) KR102934211B1 (https=)
CN (2) CN118431063A (https=)
WO (1) WO2021025934A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118398464A (zh) 2018-08-13 2024-07-26 朗姆研究公司 可更换和/或可折叠的用于等离子鞘调整的并入边缘环定位和定心功能的边缘环组件
CN115315775A (zh) 2020-03-23 2022-11-08 朗姆研究公司 衬底处理系统中的中环腐蚀补偿
CN116349002A (zh) 2020-10-05 2023-06-27 朗姆研究公司 用于等离子体处理系统的可移动边缘环
KR102585290B1 (ko) * 2021-06-14 2023-10-10 하나머티리얼즈(주) 포커스 링 및 그를 포함하는 플라즈마 장치
KR20240161340A (ko) 2023-05-04 2024-11-12 삼성전자주식회사 포커스 링 및 이를 포함하는 기판 처리 장치
US20250253139A1 (en) * 2024-02-01 2025-08-07 Applied Materials, Inc. Liner and edge ring to prevent gas diffusion
WO2026006068A1 (en) * 2024-06-26 2026-01-02 Lam Research Corporation Seal to mitigate particle contamination in plasma chambers

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6159299A (en) * 1999-02-09 2000-12-12 Applied Materials, Inc. Wafer pedestal with a purge ring
KR20020071398A (ko) * 2001-03-06 2002-09-12 삼성전자 주식회사 반도체 장치의 제조에서 건식 식각 장치
KR20040016693A (ko) * 2002-08-19 2004-02-25 삼성전자주식회사 웨이퍼 지지대
US6896765B2 (en) * 2002-09-18 2005-05-24 Lam Research Corporation Method and apparatus for the compensation of edge ring wear in a plasma processing chamber
US20040241995A1 (en) * 2003-03-27 2004-12-02 Matsushita Electric Industrial Co., Ltd. Etching apparatus and etching method
KR100578129B1 (ko) * 2003-09-19 2006-05-10 삼성전자주식회사 플라즈마 식각 장치
US20060043067A1 (en) * 2004-08-26 2006-03-02 Lam Research Corporation Yttria insulator ring for use inside a plasma chamber
US7758764B2 (en) * 2007-06-28 2010-07-20 Lam Research Corporation Methods and apparatus for substrate processing
JP5281811B2 (ja) * 2008-03-13 2013-09-04 東京エレクトロン株式会社 プラズマ処理用環状部品、プラズマ処理装置、及び外側環状部材
KR200483130Y1 (ko) * 2012-10-20 2017-04-18 어플라이드 머티어리얼스, 인코포레이티드 세그먼트화된 포커스 링 조립체
US9425077B2 (en) * 2013-03-15 2016-08-23 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor apparatus with transportable edge ring for substrate transport
JP6853038B2 (ja) * 2013-06-26 2021-03-31 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Ｉｃｐプラズマ処理チャンバ内における高収率・基板最端部欠陥低減のための単一リング設計
US10658222B2 (en) * 2015-01-16 2020-05-19 Lam Research Corporation Moveable edge coupling ring for edge process control during semiconductor wafer processing
CN116110846A (zh) 2016-01-26 2023-05-12 应用材料公司 晶片边缘环升降解决方案
CN108369922B (zh) * 2016-01-26 2023-03-21 应用材料公司 晶片边缘环升降解决方案
JP7098273B2 (ja) * 2016-03-04 2022-07-11 アプライド マテリアルズ インコーポレイテッド ユニバーサルプロセスキット
US10910195B2 (en) * 2017-01-05 2021-02-02 Lam Research Corporation Substrate support with improved process uniformity
KR102591660B1 (ko) * 2017-07-24 2023-10-19 램 리써치 코포레이션 이동가능한 에지 링 설계들
WO2019103722A1 (en) * 2017-11-21 2019-05-31 Lam Research Corporation Bottom and middle edge rings
US11043400B2 (en) * 2017-12-21 2021-06-22 Applied Materials, Inc. Movable and removable process kit
US11387134B2 (en) * 2018-01-19 2022-07-12 Applied Materials, Inc. Process kit for a substrate support
US20200234928A1 (en) * 2019-01-17 2020-07-23 Applied Materials, Inc. Semiconductor plasma processing equipment with wafer edge plasma sheath tuning ability
US11018046B2 (en) * 2019-04-12 2021-05-25 Samsung Electronics Co., Ltd. Substrate processing apparatus including edge ring
JP7321026B2 (ja) * 2019-08-02 2023-08-04 東京エレクトロン株式会社 エッジリング、載置台、基板処理装置及び基板処理方法

Also Published As

Publication number Publication date
CN114207772A (zh) 2022-03-18
EP4010915A1 (en) 2022-06-15
US20220285136A1 (en) 2022-09-08
JP2022543811A (ja) 2022-10-14
JP2025028997A (ja) 2025-03-05
KR20220038172A (ko) 2022-03-25
EP4010915A4 (en) 2023-12-13
KR20260030961A (ko) 2026-03-06
JP7597788B2 (ja) 2024-12-10
KR102934211B1 (ko) 2026-03-04
WO2021025934A1 (en) 2021-02-11
CN114207772B (zh) 2024-05-24

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