JP7597788B2 - 基板処理システムのためのエッジリングシステム - Google Patents

基板処理システムのためのエッジリングシステム Download PDF

Info

Publication number
JP7597788B2
JP7597788B2 JP2022507326A JP2022507326A JP7597788B2 JP 7597788 B2 JP7597788 B2 JP 7597788B2 JP 2022507326 A JP2022507326 A JP 2022507326A JP 2022507326 A JP2022507326 A JP 2022507326A JP 7597788 B2 JP7597788 B2 JP 7597788B2
Authority
JP
Japan
Prior art keywords
edge ring
ring system
base plate
radially
annular body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022507326A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022543811A5 (https=
JP2022543811A (ja
Inventor
ハン・フイ・リン
フアン・シンウェイ
パターソン・アレクサンダー・ミラー
スリラマン・サラヴァナプリヤン
エリクソン・アン
ウー・ジョアンナ
ラマチャンドラン・シーサーマン
キンブル・クリストファー
ペレス・アリス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of JP2022543811A publication Critical patent/JP2022543811A/ja
Publication of JP2022543811A5 publication Critical patent/JP2022543811A5/ja
Priority to JP2024206843A priority Critical patent/JP2025028997A/ja
Application granted granted Critical
Publication of JP7597788B2 publication Critical patent/JP7597788B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
JP2022507326A 2019-08-05 2020-07-30 基板処理システムのためのエッジリングシステム Active JP7597788B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024206843A JP2025028997A (ja) 2019-08-05 2024-11-28 基板処理システムのためのエッジリングシステム

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962882901P 2019-08-05 2019-08-05
US62/882,901 2019-08-05
PCT/US2020/044168 WO2021025934A1 (en) 2019-08-05 2020-07-30 Edge ring systems for substrate processing systems

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024206843A Division JP2025028997A (ja) 2019-08-05 2024-11-28 基板処理システムのためのエッジリングシステム

Publications (3)

Publication Number Publication Date
JP2022543811A JP2022543811A (ja) 2022-10-14
JP2022543811A5 JP2022543811A5 (https=) 2023-08-07
JP7597788B2 true JP7597788B2 (ja) 2024-12-10

Family

ID=74504014

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022507326A Active JP7597788B2 (ja) 2019-08-05 2020-07-30 基板処理システムのためのエッジリングシステム
JP2024206843A Pending JP2025028997A (ja) 2019-08-05 2024-11-28 基板処理システムのためのエッジリングシステム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024206843A Pending JP2025028997A (ja) 2019-08-05 2024-11-28 基板処理システムのためのエッジリングシステム

Country Status (6)

Country Link
US (1) US20220285136A1 (https=)
EP (1) EP4010915A4 (https=)
JP (2) JP7597788B2 (https=)
KR (2) KR102934211B1 (https=)
CN (2) CN118431063A (https=)
WO (1) WO2021025934A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118398464A (zh) 2018-08-13 2024-07-26 朗姆研究公司 可更换和/或可折叠的用于等离子鞘调整的并入边缘环定位和定心功能的边缘环组件
CN115315775A (zh) 2020-03-23 2022-11-08 朗姆研究公司 衬底处理系统中的中环腐蚀补偿
CN116349002A (zh) 2020-10-05 2023-06-27 朗姆研究公司 用于等离子体处理系统的可移动边缘环
KR102585290B1 (ko) * 2021-06-14 2023-10-10 하나머티리얼즈(주) 포커스 링 및 그를 포함하는 플라즈마 장치
KR20240161340A (ko) 2023-05-04 2024-11-12 삼성전자주식회사 포커스 링 및 이를 포함하는 기판 처리 장치
US20250253139A1 (en) * 2024-02-01 2025-08-07 Applied Materials, Inc. Liner and edge ring to prevent gas diffusion
WO2026006068A1 (en) * 2024-06-26 2026-01-02 Lam Research Corporation Seal to mitigate particle contamination in plasma chambers

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019505088A (ja) 2016-01-26 2019-02-21 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ウェハエッジリングの持ち上げに関する解決
WO2019103722A1 (en) 2017-11-21 2019-05-31 Lam Research Corporation Bottom and middle edge rings

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6159299A (en) * 1999-02-09 2000-12-12 Applied Materials, Inc. Wafer pedestal with a purge ring
KR20020071398A (ko) * 2001-03-06 2002-09-12 삼성전자 주식회사 반도체 장치의 제조에서 건식 식각 장치
KR20040016693A (ko) * 2002-08-19 2004-02-25 삼성전자주식회사 웨이퍼 지지대
US6896765B2 (en) * 2002-09-18 2005-05-24 Lam Research Corporation Method and apparatus for the compensation of edge ring wear in a plasma processing chamber
US20040241995A1 (en) * 2003-03-27 2004-12-02 Matsushita Electric Industrial Co., Ltd. Etching apparatus and etching method
KR100578129B1 (ko) * 2003-09-19 2006-05-10 삼성전자주식회사 플라즈마 식각 장치
US20060043067A1 (en) * 2004-08-26 2006-03-02 Lam Research Corporation Yttria insulator ring for use inside a plasma chamber
US7758764B2 (en) * 2007-06-28 2010-07-20 Lam Research Corporation Methods and apparatus for substrate processing
JP5281811B2 (ja) * 2008-03-13 2013-09-04 東京エレクトロン株式会社 プラズマ処理用環状部品、プラズマ処理装置、及び外側環状部材
KR200483130Y1 (ko) * 2012-10-20 2017-04-18 어플라이드 머티어리얼스, 인코포레이티드 세그먼트화된 포커스 링 조립체
US9425077B2 (en) * 2013-03-15 2016-08-23 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor apparatus with transportable edge ring for substrate transport
JP6853038B2 (ja) * 2013-06-26 2021-03-31 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Ｉｃｐプラズマ処理チャンバ内における高収率・基板最端部欠陥低減のための単一リング設計
US10658222B2 (en) * 2015-01-16 2020-05-19 Lam Research Corporation Moveable edge coupling ring for edge process control during semiconductor wafer processing
CN108369922B (zh) * 2016-01-26 2023-03-21 应用材料公司 晶片边缘环升降解决方案
JP7098273B2 (ja) * 2016-03-04 2022-07-11 アプライド マテリアルズ インコーポレイテッド ユニバーサルプロセスキット
US10910195B2 (en) * 2017-01-05 2021-02-02 Lam Research Corporation Substrate support with improved process uniformity
KR102591660B1 (ko) * 2017-07-24 2023-10-19 램 리써치 코포레이션 이동가능한 에지 링 설계들
US11043400B2 (en) * 2017-12-21 2021-06-22 Applied Materials, Inc. Movable and removable process kit
US11387134B2 (en) * 2018-01-19 2022-07-12 Applied Materials, Inc. Process kit for a substrate support
US20200234928A1 (en) * 2019-01-17 2020-07-23 Applied Materials, Inc. Semiconductor plasma processing equipment with wafer edge plasma sheath tuning ability
US11018046B2 (en) * 2019-04-12 2021-05-25 Samsung Electronics Co., Ltd. Substrate processing apparatus including edge ring
JP7321026B2 (ja) * 2019-08-02 2023-08-04 東京エレクトロン株式会社 エッジリング、載置台、基板処理装置及び基板処理方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019505088A (ja) 2016-01-26 2019-02-21 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ウェハエッジリングの持ち上げに関する解決
WO2019103722A1 (en) 2017-11-21 2019-05-31 Lam Research Corporation Bottom and middle edge rings

Also Published As

Publication number Publication date
CN114207772A (zh) 2022-03-18
EP4010915A1 (en) 2022-06-15
US20220285136A1 (en) 2022-09-08
JP2022543811A (ja) 2022-10-14
JP2025028997A (ja) 2025-03-05
CN118431063A (zh) 2024-08-02
KR20220038172A (ko) 2022-03-25
EP4010915A4 (en) 2023-12-13
KR20260030961A (ko) 2026-03-06
KR102934211B1 (ko) 2026-03-04
WO2021025934A1 (en) 2021-02-11
CN114207772B (zh) 2024-05-24

Similar Documents

Publication Publication Date Title
JP7678188B2 (ja) ボトムおよびミドルエッジリング
JP7597788B2 (ja) 基板処理システムのためのエッジリングシステム
KR102720332B1 (ko) 이동가능한 에지 링 설계들
JP2022163709A (ja) 基板処理システム用の静電容量の変動が低減された可動エッジリング
US20230369025A1 (en) High precision edge ring centering for substrate processing systems
CN118339646A (zh) 用于衬底处理系统中增强屏蔽的宽覆盖边缘环
TWI760111B (zh) 底部和中間邊緣環
TWI917991B (zh) 底部和中間邊緣環
TW202507918A (zh) 底部和中間邊緣環

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20221004

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230728

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230728

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20240502

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240514

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20240808

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240815

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20241105

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20241128

R150 Certificate of patent or registration of utility model

Ref document number: 7597788

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150