JP2022541417A5 - - Google Patents
Info
- Publication number
- JP2022541417A5 JP2022541417A5 JP2022501217A JP2022501217A JP2022541417A5 JP 2022541417 A5 JP2022541417 A5 JP 2022541417A5 JP 2022501217 A JP2022501217 A JP 2022501217A JP 2022501217 A JP2022501217 A JP 2022501217A JP 2022541417 A5 JP2022541417 A5 JP 2022541417A5
- Authority
- JP
- Japan
- Prior art keywords
- coating
- multilayer structure
- structure according
- adhesion
- functionalized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024108182A JP2024153658A (ja) | 2019-07-12 | 2024-07-04 | 基板上の無機放射線パターン形成組成物の安定化界面 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962873489P | 2019-07-12 | 2019-07-12 | |
| US62/873,489 | 2019-07-12 | ||
| PCT/US2020/041577 WO2021011367A1 (en) | 2019-07-12 | 2020-07-10 | Stabilized interfaces of inorganic radiation patterning compositions on substrates |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024108182A Division JP2024153658A (ja) | 2019-07-12 | 2024-07-04 | 基板上の無機放射線パターン形成組成物の安定化界面 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2022541417A JP2022541417A (ja) | 2022-09-26 |
| JP2022541417A5 true JP2022541417A5 (https=) | 2022-10-12 |
Family
ID=74103060
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022501217A Pending JP2022541417A (ja) | 2019-07-12 | 2020-07-10 | 基板上の無機放射線パターン形成組成物の安定化界面 |
| JP2024108182A Pending JP2024153658A (ja) | 2019-07-12 | 2024-07-04 | 基板上の無機放射線パターン形成組成物の安定化界面 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024108182A Pending JP2024153658A (ja) | 2019-07-12 | 2024-07-04 | 基板上の無機放射線パターン形成組成物の安定化界面 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US12360454B2 (https=) |
| EP (1) | EP3997516A4 (https=) |
| JP (2) | JP2022541417A (https=) |
| KR (1) | KR20220035149A (https=) |
| TW (1) | TWI838557B (https=) |
| WO (1) | WO2021011367A1 (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI838557B (zh) | 2019-07-12 | 2024-04-11 | 美商英培雅股份有限公司 | 輻射圖案化組合物在基板上的穩定化界面 |
| DE102019134535B4 (de) * | 2019-08-05 | 2023-09-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Materialien für unteren antireflexbelag |
| US12002675B2 (en) | 2020-06-18 | 2024-06-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist layer outgassing prevention |
| WO2022209816A1 (ja) * | 2021-04-01 | 2022-10-06 | Jsr株式会社 | 半導体基板の製造方法及びレジスト下層膜形成用組成物 |
| EP4095604A1 (en) * | 2021-05-28 | 2022-11-30 | Stichting Nederlandse Wetenschappelijk Onderzoek Instituten | Hybrid photoresist composition for extreme ultraviolet photolithography applications |
| US12601975B2 (en) * | 2021-06-17 | 2026-04-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Compositions for reducing resist consumption of extreme ultraviolet metallic type resist |
| US12334391B2 (en) * | 2021-12-17 | 2025-06-17 | Tokyo Electron Limited | Method for patterning a substrate using photolithography |
| JP7634473B2 (ja) | 2021-12-23 | 2025-02-21 | 信越化学工業株式会社 | 密着膜形成材料、パターン形成方法、及び密着膜の形成方法 |
| KR20240136383A (ko) * | 2022-01-19 | 2024-09-13 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피 장치에 사용하기 위한 레지스트 하층 |
| KR102769240B1 (ko) * | 2022-07-12 | 2025-02-21 | 유한회사 디씨티머티리얼 | 반도체 euv 리소그래피 방법 |
| JP7762634B2 (ja) * | 2022-08-17 | 2025-10-30 | 信越化学工業株式会社 | 密着膜形成用組成物、パターン形成方法、及び密着膜の形成方法 |
| KR102839122B1 (ko) | 2023-01-23 | 2025-07-28 | 닛산 가가쿠 가부시키가이샤 | 금속 산화물 레지스트 패턴 형성용 유기 수지 조성물 |
| KR20250160464A (ko) | 2023-02-28 | 2025-11-13 | 닛산 가가쿠 가부시키가이샤 | 탄소-탄소 이중 결합을 가지는 실리콘 함유 레지스트 하층막 형성용 조성물 |
Family Cites Families (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5322765A (en) * | 1991-11-22 | 1994-06-21 | International Business Machines Corporation | Dry developable photoresist compositions and method for use thereof |
| US7361444B1 (en) | 1998-02-23 | 2008-04-22 | International Business Machines Corporation | Multilayered resist systems using tuned polymer films as underlayers and methods of fabrication thereof |
| JP2000206680A (ja) | 1999-01-14 | 2000-07-28 | Mitsubishi Chemicals Corp | 感光性組成物、感光性平版印刷版及び感光性平版印刷版の製版方法 |
| US7709177B2 (en) * | 1999-02-23 | 2010-05-04 | International Business Machines Corporation | Multilayered resist systems using tuned polymer films as underlayers and methods of fabrication thereof |
| JP4299921B2 (ja) | 1999-07-05 | 2009-07-22 | 関西ペイント株式会社 | ポジ型可視光感光性樹脂組成物及びそれを用いたレジストパターン形成方法 |
| AU2001265390A1 (en) | 2000-06-06 | 2001-12-17 | Ekc Technology, Inc. | Method of making electronic materials |
| US6809127B2 (en) | 2001-10-04 | 2004-10-26 | Cognis Corporation | Radiation curable compositions with enhanced adhesion |
| EP1422565A3 (en) * | 2002-11-20 | 2005-01-05 | Shipley Company LLC | Multilayer photoresist systems |
| US20050279995A1 (en) | 2004-06-21 | 2005-12-22 | Samsung Electronics Co., Ltd. | Composition for preparing organic insulating film and organic insulating film prepared from the same |
| US20060293478A1 (en) | 2005-06-13 | 2006-12-28 | Rantala Juha T | Silane monomers and siloxane polymers for semiconductor optoelectronics |
| US7396631B2 (en) * | 2005-10-07 | 2008-07-08 | 3M Innovative Properties Company | Radiation curable thermal transfer elements |
| US20090047517A1 (en) | 2007-06-27 | 2009-02-19 | Francesco Caruso | Multilayer polymer films |
| JP2011500216A (ja) | 2007-10-17 | 2011-01-06 | プリンストン ユニバーシティー | 機能化基板とその製造方法 |
| US8163461B2 (en) | 2008-04-09 | 2012-04-24 | Cornell Research Foundation, Inc. | Photoacid generator compounds and compositions |
| US8207264B2 (en) | 2008-07-11 | 2012-06-26 | Tyco Healthcare Group Lp | Functionalized inclusion complexes as crosslinkers |
| JP5415982B2 (ja) | 2010-02-09 | 2014-02-12 | 信越化学工業株式会社 | レジスト下層膜材料、パターン形成方法 |
| US9176377B2 (en) | 2010-06-01 | 2015-11-03 | Inpria Corporation | Patterned inorganic layers, radiation based patterning compositions and corresponding methods |
| JP5820676B2 (ja) * | 2010-10-04 | 2015-11-24 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 下層組成物および下層を像形成する方法 |
| US8715907B2 (en) * | 2011-08-10 | 2014-05-06 | International Business Machines Corporation | Developable bottom antireflective coating compositions for negative resists |
| US8703386B2 (en) | 2012-02-27 | 2014-04-22 | International Business Machines Corporation | Metal peroxo compounds with organic co-ligands for electron beam, deep UV and extreme UV photoresist applications |
| US9195137B2 (en) | 2012-03-08 | 2015-11-24 | Nissan Chemical Industries, Ltd. | Composition for forming highly adhesive resist underlayer film |
| US9851639B2 (en) * | 2012-03-31 | 2017-12-26 | International Business Machines Corporation | Photoacid generating polymers containing a urethane linkage for lithography |
| IN2015DN04178A (https=) | 2012-11-05 | 2015-10-16 | Dow Global Technologies Llc | |
| US9310684B2 (en) * | 2013-08-22 | 2016-04-12 | Inpria Corporation | Organometallic solution based high resolution patterning compositions |
| WO2015037398A1 (ja) | 2013-09-11 | 2015-03-19 | Jsr株式会社 | 多層レジストプロセス用無機膜形成組成物及びパターン形成方法 |
| US9372402B2 (en) | 2013-09-13 | 2016-06-21 | The Research Foundation For The State University Of New York | Molecular organometallic resists for EUV |
| US20150234272A1 (en) | 2014-02-14 | 2015-08-20 | Intel Corporation | Metal oxide nanoparticles and photoresist compositions |
| JP6458799B2 (ja) | 2014-03-24 | 2019-01-30 | Jsr株式会社 | パターン形成方法 |
| KR102952227B1 (ko) | 2014-10-23 | 2026-04-13 | 인프리아 코포레이션 | 유기 금속 용액 기반의 고해상도 패터닝 조성물 및 상응하는 방법 |
| WO2016080226A1 (ja) * | 2014-11-19 | 2016-05-26 | 日産化学工業株式会社 | 架橋反応性シリコン含有膜形成組成物 |
| WO2017059011A1 (en) | 2015-09-30 | 2017-04-06 | E Ink Corporation | Polyurethane adhesive layers for electro-optic assemblies |
| KR102508142B1 (ko) * | 2015-10-13 | 2023-03-08 | 인프리아 코포레이션 | 유기주석 옥사이드 하이드록사이드 패터닝 조성물, 전구체 및 패터닝 |
| US9996004B2 (en) | 2015-11-20 | 2018-06-12 | Lam Research Corporation | EUV photopatterning of vapor-deposited metal oxide-containing hardmasks |
| JP6534959B2 (ja) | 2016-04-21 | 2019-06-26 | 信越化学工業株式会社 | 有機膜の形成方法及び半導体装置用基板の製造方法 |
| KR102610448B1 (ko) | 2016-08-12 | 2023-12-07 | 인프리아 코포레이션 | 금속 함유 레지스트로부터의 에지 비드 영역의 금속 잔류물 저감방법 |
| US9929012B1 (en) | 2016-12-14 | 2018-03-27 | International Business Machines Corporation | Resist having tuned interface hardmask layer for EUV exposure |
| US10082736B2 (en) * | 2017-01-13 | 2018-09-25 | International Business Machines Corporation | Approach to lowering extreme ultraviolet exposure dose for inorganic hardmasks for extreme ultraviolet patterning |
| US10096477B2 (en) | 2017-02-15 | 2018-10-09 | International Business Machines Corporation | Method to improve adhesion of photoresist on silicon substrate for extreme ultraviolet and electron beam lithography |
| WO2018179704A1 (ja) | 2017-03-27 | 2018-10-04 | Jsr株式会社 | パターン形成方法 |
| KR102634520B1 (ko) | 2017-11-20 | 2024-02-06 | 인프리아 코포레이션 | 유기주석 클러스터, 유기주석 클러스터의 용액, 및 고해상도 패턴화에 대한 적용 |
| TWI875109B (zh) | 2018-04-05 | 2025-03-01 | 美商英培雅股份有限公司 | 包含錫化合物的組合物及其應用 |
| CN112368645B (zh) * | 2018-06-13 | 2024-07-26 | 布鲁尔科技公司 | 用于euv光刻的粘附层 |
| TWI884927B (zh) | 2018-10-17 | 2025-06-01 | 美商英培雅股份有限公司 | 圖案化有機金屬光阻及圖案化的方法 |
| TWI838557B (zh) | 2019-07-12 | 2024-04-11 | 美商英培雅股份有限公司 | 輻射圖案化組合物在基板上的穩定化界面 |
-
2020
- 2020-07-10 TW TW109123314A patent/TWI838557B/zh active
- 2020-07-10 EP EP20840825.2A patent/EP3997516A4/en active Pending
- 2020-07-10 US US16/926,125 patent/US12360454B2/en active Active
- 2020-07-10 WO PCT/US2020/041577 patent/WO2021011367A1/en not_active Ceased
- 2020-07-10 KR KR1020227003941A patent/KR20220035149A/ko not_active Ceased
- 2020-07-10 JP JP2022501217A patent/JP2022541417A/ja active Pending
-
2024
- 2024-07-04 JP JP2024108182A patent/JP2024153658A/ja active Pending
-
2025
- 2025-06-05 US US19/229,740 patent/US20250298317A1/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2022541417A5 (https=) | ||
| JP7168715B2 (ja) | 半導体フォトレジスト用組成物およびこれを利用したパターン形成方法 | |
| US20250298317A1 (en) | Stabilized interfaces of inorganic radiation patterning compositions on substrates | |
| US11415885B2 (en) | Semiconductor photoresist composition, and method of forming patterns using the composition | |
| US7297616B2 (en) | Methods, photoresists and substrates for ion-implant lithography | |
| JP4297408B2 (ja) | 厚膜フォトレジストとこれらの使用方法 | |
| JP7584562B2 (ja) | 半導体フォトレジスト用組成物およびこれを用いたパターン形成方法 | |
| JP2025023814A (ja) | 半導体フォトレジスト用組成物およびこれを利用したパターン形成方法 | |
| KR20250172918A (ko) | 반도체 포토레지스트용 조성물 및 이를 이용한 패턴 형성 방법 | |
| TWI912831B (zh) | 形成圖案的方法 | |
| KR102538092B1 (ko) | 반도체 포토레지스트용 조성물 및 이를 이용한 패턴 형성 방법 | |
| JP2025155843A (ja) | 半導体フォトレジスト用組成物、およびこれを利用したパターン形成方法 | |
| JP2025026349A (ja) | 半導体フォトレジスト用組成物およびこれを利用したパターン形成方法 | |
| WO2025024290A1 (en) | Organotin photoresist composition and method of forming photolithography pattern | |
| KR20250142134A (ko) | 반도체 포토레지스트용 조성물 및 이를 이용한 패턴 형성 방법 | |
| EP0233747A2 (en) | Vapor deposited photoresists of anionically polymerizable monomers | |
| KR102908536B1 (ko) | 반도체 포토레지스트용 조성물 및 이를 이용한 패턴 형성 방법 | |
| JPH09102458A (ja) | パターン形成方法及び表面処理剤 | |
| JP3539792B2 (ja) | レジスト材料及びレジストパターンの形成方法 | |
| JP2025138568A (ja) | 半導体フォトレジスト用組成物およびこれを利用したパターン形成方法 | |
| JP2025144520A (ja) | 半導体フォトレジスト用組成物およびこれを利用したパターン形成方法 | |
| JP2025170746A (ja) | 半導体フォトレジスト用組成物、およびこれを利用したパターン形成方法 | |
| KR20250125800A (ko) | 반도체 포토레지스트용 조성물 및 이를 이용한 패턴 형성 방법 | |
| TW202045571A (zh) | 感光性樹脂組成物,及玻璃基板之蝕刻方法 | |
| JPH10270356A (ja) | パターン形成方法 |