JP2022539991A - 交互のエッチングプロセスおよび不動態化プロセス - Google Patents
交互のエッチングプロセスおよび不動態化プロセス Download PDFInfo
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- JP2022539991A JP2022539991A JP2021575911A JP2021575911A JP2022539991A JP 2022539991 A JP2022539991 A JP 2022539991A JP 2021575911 A JP2021575911 A JP 2021575911A JP 2021575911 A JP2021575911 A JP 2021575911A JP 2022539991 A JP2022539991 A JP 2022539991A
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- Prior art keywords
- tin oxide
- etch
- silicon
- plasma
- etching
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- 238000000034 method Methods 0.000 title claims abstract description 271
- 230000008569 process Effects 0.000 title claims abstract description 182
- 238000005530 etching Methods 0.000 title claims abstract description 149
- 238000002161 passivation Methods 0.000 title claims abstract description 58
- 229910001887 tin oxide Inorganic materials 0.000 claims abstract description 371
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims abstract description 362
- 239000000758 substrate Substances 0.000 claims abstract description 234
- 239000004065 semiconductor Substances 0.000 claims abstract description 115
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 112
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- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims abstract description 46
- 229910052801 chlorine Inorganic materials 0.000 claims abstract description 46
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910015844 BCl3 Inorganic materials 0.000 claims abstract description 24
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 claims abstract description 24
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- 150000002926 oxygen Chemical class 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 193
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 36
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- 230000015572 biosynthetic process Effects 0.000 claims description 20
- 229930195733 hydrocarbon Natural products 0.000 claims description 17
- 150000002430 hydrocarbons Chemical class 0.000 claims description 17
- KXCAEQNNTZANTK-UHFFFAOYSA-N stannane Chemical compound [SnH4] KXCAEQNNTZANTK-UHFFFAOYSA-N 0.000 claims description 14
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- 239000001307 helium Substances 0.000 claims description 13
- 229910052734 helium Inorganic materials 0.000 claims description 13
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 13
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- 238000006243 chemical reaction Methods 0.000 claims description 8
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- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 21
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 18
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 17
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- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 16
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- 150000002500 ions Chemical class 0.000 description 6
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 6
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- 239000012159 carrier gas Substances 0.000 description 5
- WHXTVQNIFGXMSB-UHFFFAOYSA-N n-methyl-n-[tris(dimethylamino)stannyl]methanamine Chemical compound CN(C)[Sn](N(C)C)(N(C)C)N(C)C WHXTVQNIFGXMSB-UHFFFAOYSA-N 0.000 description 5
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- QYYZHXHYNLXWAW-UHFFFAOYSA-N trimethyl(2-phenylethynyl)stannane Chemical compound C[Sn](C)(C)C#CC1=CC=CC=C1 QYYZHXHYNLXWAW-UHFFFAOYSA-N 0.000 description 1
- COHOGNZHAUOXPA-UHFFFAOYSA-N trimethyl(phenyl)stannane Chemical compound C[Sn](C)(C)C1=CC=CC=C1 COHOGNZHAUOXPA-UHFFFAOYSA-N 0.000 description 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
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Abstract
Description
本出願の一部として、本明細書と同時にPCT出願願書が提出される。この同時出願されたPCT出願願書に明記され、本出願が利益または優先権を主張する各出願は、参照によりその全体があらゆる目的で本明細書に組み込まれる。
いくつかの実施形態では、選択的酸化スズエッチングは、水素系エッチングを使用して実施される。水素系エッチングは、酸化スズを水素含有反応剤に曝露し(典型的には反応剤のプラズマ活性化を伴う)、酸化スズを揮発性水素化スズに変換することを伴う。SnH4は、-52℃の沸点を有し、プロセスチャンバから容易に除去することができる。水素含有反応剤の例には、H2、HBr、NH3、H2O、および炭化水素(CH4など)が挙げられる。水素含有反応剤の混合物もまた、使用することができる。水素系エッチングは、水素含有反応剤、および任意選択で不活性ガスを含むプロセスガスでプラズマを形成し、基板を形成されたプラズマと接触させることを伴う。不活性ガスの例には、窒素(N2)、ヘリウム(He)、アルゴン(Ar)、ネオン(Ne)、およびキセノン(Xe)が挙げられる。いくつかの実施形態では、H2が好ましい水素含有反応剤であり、いくつかの実施形態では、少なくとも50体積%、例えば少なくとも80体積%のH2を含むガスでプラズマを形成することが好ましい。他の実施形態では、HBrが水素含有反応剤として使用される。例えば、酸化スズは、HBr、N2、およびアルゴンの混合物など、本質的にHBrおよび不活性ガスからなるプロセスガスで形成されたプラズマで選択的にエッチングすることができる。水素系エッチングは、典型的には、酸素含有種およびフッ素含有種を含まないプロセスガスを用いて実行される。いくつかの実施形態では、プロセスガスは、本質的に1つまたは複数の水素含有反応剤、および任意選択で不活性ガスからなる。
いくつかの実施形態では、選択的酸化スズエッチングは、塩素系エッチングを使用して実施される。塩素系エッチングは、酸化スズを塩素含有反応剤を曝露し(典型的には反応剤のプラズマ活性化を伴う)、酸化スズを塩化スズに変換することを伴う。SnCl4は、114℃の沸点を有し、プロセスチャンバから除去することができる。適切な塩素含有反応剤の例には、Cl2およびBCl3が挙げられる。一実施形態では、Cl2とBCl3の混合物が使用される。塩素系エッチングは、一実施態様では、塩素含有反応剤、および任意選択で不活性ガスを含むプロセスガスでプラズマを形成することと、基板を形成されたプラズマと接触させることとを伴う。塩素系エッチングは、以下の材料:SiO2、SiN、SiC、SiOC、SiCN、SiON、SiCNO、スピンオングラスなどのシリコン含有化合物、炭素、フォトレジストの存在下で酸化スズを選択的に除去することができるが、シリコン含有材料についての選択性は、典型的には、水素系エッチングよりも低い。いくつかの実施形態では、半導体基板が提供され、半導体基板は、露出した酸化スズ層と、これらの材料のいずれかの層とを含む。次に、酸化スズが、塩素系エッチングを使用して、これらの材料の存在下で選択的にエッチングされる。これらの材料は、このエッチングの前に露出されてもよいし、または酸化スズエッチングの過程で露出されてもよい。一実施態様では、酸化スズは、BCl3/Cl2エッチングを使用して、これらの材料のいずれかの存在下で選択的にエッチングされる。一実施態様では、エッチング方法は、5~100sccmの流量でBCl3を、50~500sccmの流量でCl2を、100~500sccmの流量で不活性ガス(例えば、ヘリウム)を流すことと、0.14~0.71W/cm2の電力密度に対応する(1つの300mmウエハごとに)100~500WのRF電力を使用して、このプロセスガスでプラズマを形成することとを伴う。このエッチングは、基板バイアスの有無にかかわらず実行することができる。例えば、基板バイアスは、0~100Vb、例えば10~100Vbであり得る。プロセスは、100℃未満の温度で5~50mTorrの圧力において実施することができる。
いくつかの実施形態では、SiO2、SiN、SiC、SiOC、SiCN、SiON、SiCNO、スピンオングラスなどのシリコン含有化合物は、フッ化炭素系エッチングを使用して、酸化スズの存在下で選択的にエッチングされる。フッ化炭素系エッチングは、シリコン含有化合物をプラズマ活性化フッ化炭素(CxFy)に曝露し、Si-F結合を含む揮発性化合物に変換することを伴う。適切なフッ化炭素反応剤の例には、CF4、C2F6などが挙げられる。フッ化炭素系エッチングは、一実施態様では、フッ化炭素、および任意選択で不活性ガスを含むプロセスガスでプラズマを形成することと、基板を形成されたプラズマと接触させることとを伴う。フッ化炭素エッチングは、酸化スズの存在下でシリコン含有化合物を選択的に除去することができる。いくつかの実施形態では、半導体基板が提供され、半導体基板は、シリコン含有化合物の露出した層と、酸化スズの層とを含む。次に、基板はフッ化炭素プラズマと接触し、シリコン含有化合物は酸化スズの存在下で選択的にエッチングされる。酸化スズは、このエッチングの前に露出されてもよいし、またはエッチングの過程で露出されてもよい。フッ化炭素系エッチングは、フッ素系エッチングの一種である。
いくつかの実施形態では、元素シリコンおよびシリコン含有化合物(例えば、SiO2、SiN、SiC、SiOC、SiCN、SiON、SiCNO、およびスピンオングラス)は、フッ素系エッチングを使用して、酸化スズの存在下で選択的にエッチングされる。フッ素系エッチングは、シリコン含有材料をいくつかの実施形態ではプラズマ活性化されるフッ素含有試薬(例えば、NF3、SF6、またはフッ化炭素)に曝露することと、シリコン含有材料を揮発性フッ化シリコンに変換することとを含む。しかし、酸化スズは揮発性フッ化物を形成しないため、この化学物質によって実質的にエッチングされない。シリコン含有材料に加えて、酸化チタン、タングステン、およびタングステン炭素は、フッ素系エッチングを使用して、酸化スズの存在下で選択的にエッチングすることができる。フッ素系エッチングは、一実施態様では、フッ素含有反応剤(例えば、NF3)、および任意選択で不活性ガスを含むプロセスガスでプラズマを形成することと、基板を形成されたプラズマと接触させることとを伴う。フッ素系エッチングは、酸化スズの存在下でシリコン含有化合物および元素シリコンを選択的に除去することができる。いくつかの実施形態では、半導体基板が提供され、半導体基板は、シリコン含有化合物の露出した層および/または元素シリコン(Si)の層と、酸化スズの層とを含む。次に、基板は、プラズマ中のフッ素含有反応剤と接触し、シリコン含有化合物および/またはSiは酸化スズの存在下で選択的にエッチングされる。酸化スズは、このエッチングの前に露出されてもよいし、またはエッチングの過程で露出されてもよい。
いくつかの実施形態では、元素炭素、炭素含有化合物、ポリマー、およびフォトレジストからなる群から選択される1つまたは複数の材料は、酸素系エッチングを使用して、酸化スズの存在下で選択的にエッチングされる。酸素系エッチングは、上記の材料をいくつかの実施形態ではプラズマ活性化される酸素含有試薬(例えば、O2、O3、SO2、またはCO2)に曝露することと、材料を炭素-酸素結合を含む揮発性生成物(例えば、COまたはCO2)に変換することとを含む。酸素系エッチングは、一実施態様では、酸素含有反応剤(例えば、O2)、および任意選択で不活性ガスを含むプロセスガスでプラズマを形成することと、基板を形成されたプラズマと接触させることとを伴う。他の実施形態では、エッチングは、プラズマの存在なしで生じてもよい。酸素系エッチングは、酸化スズの存在下で炭素(例えば、非晶質炭素またはダイヤモンド状炭素)、炭素含有化合物、およびフォトレジストを選択的に除去することができる。いくつかの実施形態では、半導体基板が提供され、半導体基板は、炭素、炭素含有化合物、およびフォトレジストからなる群から選択される1つまたは複数の材料の露出した層と、酸化スズの層とを含む。次に、基板は、酸素含有反応剤(任意選択でプラズマで活性化)と接触して炭素含有材料を揮発性COまたはCO2に変換し、それによって酸化スズの存在下でそれらを選択的にエッチングする。酸化スズは、このエッチングの前に露出されてもよいし、またはエッチングの過程で露出されてもよい。
本明細書で参照される材料は、様々な堆積方法(例えば、CVD(PECVDを含む)、ALD(PEALDを含む)、PVD(例えば、金属および金属酸化物の堆積用)、スピンオン法(例えば、炭素、および一部の誘電体の堆積用))を使用して堆積することができる。共形堆積が必要な場合、典型的には、ALD法が好まれる。
別のハードマスクの実施態様では、酸化スズは、炭素層または別の材料のパターニングのための中間ハードマスク(中間層)として使用される。一実施形態では、基板が提供され、基板は、炭素含有層上(例えば、非晶質炭素層上)に形成された酸化スズのパターニングされた層を含み、基板は複数の凹状フィーチャを含み、凹状フィーチャは底部に露出した炭素含有材料を有する。次に、露出した炭素含有材料が酸化スズの存在下で選択的にエッチングされ、炭素含有層に凹状フィーチャを形成する。適切な選択的エッチング化学物質は、水素系エッチング化学物質(例えば、プラズマ中のH2、およびプラズマ中のHBr)と、塩素系エッチング化学物質(例えば、プラズマ中のBCl3および/またはCl2)とを含む。1つの適切なプロセスシーケンスは、図5D~図5Gに示す断面基板図によって示されている。図5Dに示す基板は、副層51(例えば、非晶質シリコンまたは本明細書に記載のターゲット層のいずれか)と、副層51の上に存在する炭素含有材料(例えば、非晶質炭素)のブランケット層53と、炭素含有層53の上に存在するブランケット酸化スズ層55とを含む。基板は、酸化スズ層55の上にパターニングされたフォトレジスト層57と、フォトレジスト57と酸化スズ層55との間に下層56とをさらに含み、下層は、例えば、スピンオングラスであってもよい。下層56は、基板の表面上のパターニングされたフォトレジスト層57に形成された凹状フィーチャの底部に露出している。フォトレジストのパターンは、フォトレジストの存在下で、例えば、フッ化炭素系プラズマエッチングによって下層を選択的にエッチングすることによって、下層56に転写される。エッチングは、図5Eに示すように、凹状フィーチャの底部に酸化スズ層55を露出させる。次に、酸化スズは、好ましくは下層材料に対して選択的であるエッチングを使用してパターニングされる。例えば、酸化スズは、水素系エッチングまたは塩素系エッチングを使用してエッチングすることができる。図5Fに示す結果として得られる構造では、パターンはフォトレジストから酸化スズ層に転写されており、炭素含有層53は凹状フィーチャの底部に露出している。次に、プロセスは、露出した炭素含有層53をエッチングすることが続く。好ましくは、酸化スズに選択的な化学物質が使用される。例えば、露出した炭素含有層53は、酸素系エッチングによってエッチングされ得る(例えば、炭素は、酸素含有ガスで形成されたプラズマによってエッチングされ得る)。残りのフォトレジストおよび下層56もまた、このステップで除去することができる。このエッチング後に得られた構造を、図5Gに示す。プロセスは、酸化スズ55の除去およびその後の露出した副層51の処理がさらに続く可能性がある。
いくつかの実施形態では、酸化スズは、様々なリバーストーンハードマスク用途で使用される。1つの例示的なプロセスフローが図8に示され、図7A~図7Cの基板の概略断面図によって示されている。プロセスは、801において、露出したパターニングされた灰化可能(ashable)層および複数の凹状フィーチャを有する基板を提供することによって開始する。灰化可能材料の例には、非晶質炭素、ダイヤモンド状炭素、フォトレジスト、および有機ポリマーなどの炭素含有材料が挙げられ、ポリマーは、金属または金属酸化物でドープされていないか、またはドープされ得る。灰化可能材料のパターニングされた層は、例えば、灰化可能材料のブランケット層を堆積することによって(例えば、PECVDまたはスピンオン法によって)、続いてフォトリソグラフィパターニングによって形成することができる。図7Aは、副層701(例えば、Si、SiN、金属窒化物、または本明細書に記載の任意のターゲットもしくは副層材料)上に存在する灰化可能材料703のパターニングされた層を有する基板を示している。基板上に複数の凹状フィーチャがあり、層701は凹状フィーチャの底部に露出している。次に、動作803において、基板上の凹状フィーチャは、酸化スズで充填される(例えば、CVDを使用して)。このステップでは、典型的には、灰化可能材料703の層の上にオーバーバーデンも形成される。得られた構造が図7Bに示され、堆積された酸化スズ705は、灰化可能材料703の間のギャップを充填し、オーバーバーデンを形成する。次に、オーバーバーデンは、例えば、化学機械研磨(CMP)動作またはバルクプラズマエッチング(例えば、水素系および/または塩素系プラズマエッチングを使用する)によって除去され、灰化可能材料703を露出させることができる。平坦化後、動作805において、灰化可能材料は、酸化スズ材料を実質的に除去することなく除去され(例えば、酸化スズの少なくとも90%が残る)、それによって図7Cに示すような酸化スズ705の相補的パターンを形成する。
交互のエッチングプロセスおよび不動態化プロセス
さらなる実施態様
Claims (21)
- 半導体基板を処理する方法であって、
(a)シリコン含有層の上に複数の突起フィーチャを有する半導体基板を設けることであって、前記半導体基板は、前記突起フィーチャにおける露出した酸化スズと、前記シリコン含有層の露出したシリコン含有材料とを含むことと、
(b)前記露出したシリコン含有材料を酸化スズエッチング化学物質に向けて不動態化することと、
(c)前記酸化スズエッチング化学物質を使用して前記露出した酸化スズをエッチングすることと、
(d)動作(b)および(c)が交互に実施されるように動作(b)および(c)を繰り返すことと
を含む、方法。 - 請求項1に記載の方法であって、
前記露出したシリコン含有材料は、非晶質シリコン、酸化シリコン、SiON、SiOC、SiONC、SiC、およびSiNからなる群から選択される、方法。 - 請求項1に記載の方法であって、
(c)は、前記半導体基板をCl2、BCl3、およびそれらの組み合わせからなる群から選択されるプラズマ活性化塩素含有反応剤に曝露することを含む、塩素系エッチング化学物質を使用して酸化スズをエッチングすることを含む、方法。 - 請求項1に記載の方法であって、
(c)は、水素系エッチング化学物質を使用して前記酸化スズをエッチングすることを含み、その結果、水素化スズが形成される、方法。 - 請求項1に記載の方法であって、
(c)は、前記半導体基板をH2、HBr、NH3、H2O、炭化水素、およびそれらの組み合わせからなる群から選択されるプラズマ活性化水素含有反応剤と接触させることによって、水素系エッチング化学物質を使用して前記酸化スズをエッチングすることを含む、方法。 - 請求項1に記載の方法であって、
(c)は、前記半導体基板をCl2、BCl3、およびそれらの組み合わせからなる群から選択される塩素含有反応剤、ならびにヘリウム、ネオン、アルゴン、キセノン、およびそれらの組み合わせからなる群から選択される希釈ガスを含むプラズマ活性化プロセスガスに曝露することを含む、塩素系エッチング化学物質を使用して酸化スズをエッチングすることを含む、方法。 - 請求項1に記載の方法であって、
(b)は、前記基板を酸素含有反応剤で処理することを含む、方法。 - 請求項1に記載の方法であって、
(b)は、前記基板をプラズマ活性化酸素含有反応剤で処理することを含む、方法。 - 請求項1に記載の方法であって、
(b)は、前記基板をO2、O3、SO2、およびCO2からなる群から選択されるガスを含むプロセスガスで形成されたプラズマで処理することを含む、方法。 - 請求項1に記載の方法であって、
(b)は、(c)の前に実施される、方法。 - 請求項1に記載の方法であって、
(c)は、(b)の前に実施される、方法。 - 請求項1に記載の方法であって、
動作(b)および(c)は、2~50回実施される、方法。 - 請求項1に記載の方法であって、
前記突起フィーチャは、水平面と、側壁とを備え、前記方法は、前記突起フィーチャの前記側壁における酸化スズフッティングを低減する、方法。 - 請求項1に記載の方法であって、
前記シリコン含有材料は、非晶質シリコン、酸化シリコン、SiON、SiOC、SiONC、SiC、およびSiNからなる群から選択され、(b)における前記不動態化は、前記基板をプラズマ活性化酸素含有反応剤で処理することを含み、(c)は、前記半導体基板をCl2、BCl3、およびそれらの組み合わせからなる群から選択されるプラズマ活性化塩素含有反応剤に曝露することを含む、塩素系エッチング化学物質を使用して前記酸化スズをエッチングすることを含む、方法。 - 請求項1に記載の方法であって、
(b)は、前記半導体基板を窒素含有反応剤で処理することを含む、方法。 - 半導体基板を処理するための装置であって、
(a)処理チャンバであって、前記半導体基板用の支持体、および1つまたは複数の反応剤を前記処理チャンバに導入するための入口を有する処理チャンバと、
(c)コントローラであって、
(i)酸化スズエッチング化学物質に向けて半導体基板上のシリコン含有層の不動態化を引き起こし、
(ii)半導体基板上に酸化スズのエッチングを引き起こし、
(iii)(i)および(ii)を交互に繰り返す
ためのプログラム命令を含むコントローラと
を備える、装置。 - 請求項16に記載の装置であって、
(i)は、プラズマ活性化酸素含有反応剤による前記半導体基板の処理を引き起こすことを含む、装置。 - 請求項16に記載の装置であって、
(i)は、プラズマ活性化O2による前記半導体基板の処理を引き起こすことを含む、装置。 - 請求項16に記載の装置であって、
(ii)は、塩素系化学物質を使用して前記酸化スズのエッチングを引き起こすことを含む、装置。 - 請求項16に記載の装置であって、
(ii)は、水素系化学物質を使用して前記酸化スズのエッチングを引き起こすことを含む、装置。 - 請求項16に記載の装置であって、
前記プログラム命令は、(i)および(ii)を2~50回交互に実施するための命令を含む、装置。
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US11551938B2 (en) | 2023-01-10 |
WO2020263757A1 (en) | 2020-12-30 |
TW202115787A (zh) | 2021-04-16 |
US20220208551A1 (en) | 2022-06-30 |
US20240087904A1 (en) | 2024-03-14 |
KR102643106B1 (ko) | 2024-02-29 |
US11848212B2 (en) | 2023-12-19 |
CN115565867A (zh) | 2023-01-03 |
CN114270479B (zh) | 2022-10-11 |
KR20240031441A (ko) | 2024-03-07 |
US20230197459A1 (en) | 2023-06-22 |
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