JP2022536259A - ステレオリソグラフィ用光硬化性組成物、その組成物を使用するステレオリソグラフィ法、そのステレオリソグラフィ法によって形成されたポリマーコンポーネント、及びそのポリマーコンポーネントを含むデバイス - Google Patents
ステレオリソグラフィ用光硬化性組成物、その組成物を使用するステレオリソグラフィ法、そのステレオリソグラフィ法によって形成されたポリマーコンポーネント、及びそのポリマーコンポーネントを含むデバイス Download PDFInfo
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- JP2022536259A JP2022536259A JP2021570968A JP2021570968A JP2022536259A JP 2022536259 A JP2022536259 A JP 2022536259A JP 2021570968 A JP2021570968 A JP 2021570968A JP 2021570968 A JP2021570968 A JP 2021570968A JP 2022536259 A JP2022536259 A JP 2022536259A
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- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 150000004654 triazenes Chemical class 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- QEDNBHNWMHJNAB-UHFFFAOYSA-N tris(8-methylnonyl) phosphite Chemical compound CC(C)CCCCCCCOP(OCCCCCCCC(C)C)OCCCCCCCC(C)C QEDNBHNWMHJNAB-UHFFFAOYSA-N 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 229960000834 vinyl ether Drugs 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
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Abstract
Description
本出願は、2019年5月30日に出願された米国特許仮出願第62/854387号の利益及び優先権を主張し、その内容全体が参照によって本明細書に組み込まれる。
脂肪族多塩基カルボン酸、例えば、コハク酸、アジピン酸、アゼライン酸、セバシン酸、1,2,4-ブタントリカルボン酸及び1,2,3,4-ブタンテトラカルボン酸。
脂環式多塩基カルボン酸、例えば、1,2-,1,3-,1,4-シクロヘキサンジカルボン酸、ヘキサヒドロフタル酸及びヘキサヒドロテレフタル酸。
芳香族多塩基カルボン酸、例えば、フタル酸、イソフタル酸、テレフタル酸、トリメリト酸、ピロメリト酸、ナフタレンジカルボン酸、4,4-ジフェニルジカルボン酸、及びジフェニルメタン-4,4'-ジカルボン酸。
無水物類、例えば、ヘキサヒドロトリメリト酸及びメチルヘキサヒドロフタル酸。
アルケニル多塩基カルボン酸、例えば、マレイン酸、フマル酸、イタコン酸、HET酸、テトラヒドロフタル酸。
脂肪族多価アルコール、例えば、エチレングリコール、プロピレングリコール、2,3-ジメチルトリメチレングリコール、1,2-,1,3-,1,4-ブタンジオール、2,3-ブタンジオール、3-メチル-1,2-ブタンジオール、1,2-,1,4-,1,5-ペンタンジオール、2,4-ペンタンジオール、3-メチル-4,5-ペンタンジオール、2,2,4-トリメチル-1,3-ペンタンジオール、ネオペンチルグリコール、1,4-,1,5-,1,6-ヘキサンジオール、2,5-ヘキサンジオール、1,2,6-ヘキサントリオール、トリメチロールプロパン、トリメチロールエタン、ペンタエリトリトール及びグリセリン。
ポリエーテル多価アルコール、例えば、ジエチレングリコール、トリエチレングリコール、テトラエチレングリコール、ジプロピレングリコール、ジペンタエリトリトール、ジグリセリン、スピログリコール及びトリグリセリン。
脂環式多価アルコール、例えば、トリシクロデカンジメタノール、1,3-,1,4-シクロヘキサンジメタノール、水素化ビスフェノールA及び水素化ビスフェノールF。
芳香族多価アルコール、例えば、テレフタル酸ビス(ヒドロキシ-エチル)。
アルケニル多価アルコール、例えば、ヒドロキシル端末ポリブタジエン。
ラクトンの開環重合に由来するポリエステルポリオール、例えば、β-プロピオラクトン、γ-ブチロラクトン、α-メチル-γ-ブチロラクトン、δ-バレロラクトン、ε-カプロラクトン、α-クロロ-ε-カプロラクトン、γ-メチル-ε-カプロラクトン、ε-ヘプタラクトン、ε-デカラクトン、ω-ペンタデカラクトン及び7-イソプロピル-4-メチルオキセパン-2-オン。
ラクトンの開環重合に由来するアルケニルポリエステルポリオール、例えば、α-メチレン-γ-ブチロラクトン、4-イソプロペニル-7-メチルオキセパン-2-オン、及びα-プロパルギル-ε-カプロラクトン。
脂肪族ジイソシアナート、例えば、ヘキサメチレンジイソシアナート(HMDI)、トリメチルヘキサメチレンジイソシアナート。
脂環式ジイソシアナート、例えば、イソホロンジイソシアナート(IPDI)、シクロヘキサン-1,4-ジイソシアナート及び4,4'-ジシクロヘキシルメタンジイソシアナート(水素化MDI)。
芳香族ジイソシアナート、例えば、2,4-トリレンジイソシアナート(2,4-TDI)、2,6-トリレンジイソシアナート(2,6-TDI)、4,4'-ジフェニルメタンジイソシアナート、1,4-フェニレンジイソシアナート、1,5-ナフタレンジイソシアナート、キシリレンジイソシアナート及びテトラメチルキシリルエンジイソシアナート。
α,β-不飽和ケトンを含有するイソシアナート、例えば、(メタ)アクリロイルイソシアナート及び(メタ)アクリル酸2-イソシアナトエチル。
イソシアナートを含有する光反応性アルケン、例えば、m-,p-イソプロペニル-α,α'-ジメチルベンジルイソシアナート及びビニルイソシアナート。
ヒドロキシ含有α,β-不飽和ケトンモノマー、例えば、(メタ)アクリル酸2-ヒドロキシ-エチル、(メタ)アクリル酸3-ヒドロキシプロピル、(メタ)アクリル酸4-ヒドロキシブチル、モノ(メタ)アクリル酸ポリエチレングリコール、及び(メタ)アクリル酸2-ヒドロキシ-3-フェノキシプロピル。
α,β-不飽和カルボン酸モノマー、例えば、(メタ)アクリル酸及び(メタ)アクリル酸β-カルボキシエチル。
R1がエチルである例には、アクリロイルオキシエチルイソシアナート及びメタクリロイルオキシエチルイソシアナートが含まれる。一態様においてR1は置換又は非置換のC6~36芳香族基、好ましくは置換C7~15芳香族基である。式(2)の化合物はジイソシアナートから誘導することができる。そのようなジイソシアナートの例には、2,4-トルエンジイソシアナート、2,6-トルエンジイソシアナート、4,4'-ジフェニルメタンジイソシアナート(MDI)、4,4'-ジシクロヘキシルジイソシアナート、m-及びp-テトラメチルキシリレンジイソシアナート、3-イソシアナトメチル-3,5,5-トリメチルシクロヘキシルイソシアナート(イソホロンジイソシアナート)、ヘキサメチレンジイソシアナート(HMDI)、1,5-ナフチレンジイソシアナート、ジアニシジンジイソシアナート、ビシクロ[2.2.1]ヘプタ-5-エン-2,3-ジカルボン酸ジ-(2-イソシアナトエチル)、2,2,4-及び2,4,4-トリメチレンヘキサメチレンジイソシアナートが含まれる。式(2)の化合物は、アクリル酸2-ヒドロキシ-エチル及びメタクリル酸2-ヒドロキシエチル等の(メタ)アクリルヒドロキシ化合物との、ジイソシアナートの反応から誘導することができる。一態様において、ジイソシアナートには、イソホロンジイソシアナート、メチレン-ビス-フェニルジイソシアナート、トルエンジイソシアナート、ヘキサメチレンジイソシアナート、m-テトラメチルキシリルエンジイソシアナート、又はその組み合わせが含まれ得る。更に、式(2)において、R2は好ましくは水素である。
下記の表に示す材料を、実施例で使用した。
粘度は、23℃でブルックフィールド粘度計を使用して求めた。
ポリブタジエンウレタンアクリラート光硬化性組成物(充填剤を含まない)の調製
光反応性オリゴマーとしてウレタンポリブタジエンメタクリル樹脂(TE-2000)を、光反応性モノマーである、メタクリル酸イソボルニル、アクリル酸イソボルニル、ジメタクリル酸エチレングリコール、ジアクリル酸1,6-ヘキサンジオール、トリメタクリル酸トリメチロールプロパン、トリアクリル酸トリメチロールプロパン、ジメタクリル酸1,6-ヘキサンジオール、アクリル酸2-エチルヘキシル、メタクリル酸2-エチルヘキシル、メタクリル酸ヒドロキシプロピル及びジメタクリル酸1,3-ブタンジオールと共に組成物の総質量に対して10~90質量%の量で使用して、一連の光硬化性組成物を調製した。各組成物はまた、組成物の総質量に対して1質量%の光開始剤BAPO(フェニルビス(2,4,6-トリメチルベンゾイル)ホスフィンオキシド)を含んでいた。
60質量%のTE-2000オリゴマー、20質量%のアクリル酸2-エチルヘキシル、及び20質量%のジメタクリル酸エチレングリコールを含む組成物を、百部あたり1部(pph)のBAPO光開始剤を加えて調製した。充填剤を含まないで、材料は、ブルックフィールド粘度計によって23℃で500センチポアズの粘度、2.3の誘電率及び10GHzで0.0064の誘電損失を有していた。
40質量%のウレタンメタクリラートポリブタジエンオリゴマー(TEAI-1000)、30質量%のメタクリル酸イソボルニル、20質量%のジメタクリル酸エチレングリコール、及び10パーセントのトリメタクリル酸トリメチロールプロパンを含む組成物を、百質量部あたり1部(pph)のBAPO光開始剤及び0.1pphのシンチレート剤2,5-ビス(5-tert-ブチル-2-ベンゾオキサゾリル)チオフェンを加えて調製した。続いて、それぞれ組成物の総体積に対して、およそ1質量%のメタクリルオキシプロピルトリメトキシシランを用いて処理された18vol%のアルミナ(Denka社からのDAW-10)と、およそ1質量%のチタン酸オレイルを用いて処理された19vol%のノナチタン酸バリウム(Trans-Tech社)とを、組成物に添加した。結果として得られた光硬化材料は、4.9の誘電率及び10GHzで0.0035の損失を有していた。
60質量%のウレタンメタクリラートポリブタジエンオリゴマー(TEAI-1000)、15質量%のメタクリル酸イソボルニル、10質量%のジメタクリル酸エチレングリコール、10質量%のトリメタクリル酸トリメチロールプロパン、及び5質量%のアクリル酸2-エチルヘキシルを含む組成物を、1pphのBAPO光開始剤及び0.1pphのシンチレート剤、2,5-ビス(5-tert-ブチル-2-ベンゾオキサゾリル)チオフェンを加えて調製した。続いて、それぞれ組成物の総体積に対して、およそ1質量%のメタクリルオキシプロピルトリメトキシシランを用いて処理された18vol%のアルミナ(Denka社からのDAW-10)と、およそ1質量%のオレイルチタン酸を用いて処理された19vol%のノナチタン酸バリウム(Trans-Tech社)とを、組成物に添加した。結果として得られた光硬化材料は、4.9の誘電率及び10GHzで0.0039の損失の測定値を示した。
50質量%のウレタンアクリル樹脂ポリブタジエンオリゴマー(TEAI-1000)と、50質量%のモノマー成分との混合物を使用し、次いで、オリゴマー及びモノマーの合計質量に対して1質量%のBAPO光開始剤を添加して、6種の試料(A-F)を配合した。試料Aにおいて、モノマー成分は100%トリメタクリル酸トリメチロールプロパンである。後続の試料B-Eにおけるその量は、20質量%の増分で減らし、試料Fにおいてモノマー成分が100質量%トリアクリル酸トリメチロールプロパンになるまで、トリアクリル酸トリメチロールプロパンで置き換えた。5及び10GHzで各試料に関して誘電率及び誘電損失を試験し、Table 6(表7)に平均の結果を示す。
Claims (25)
- ステレオリソグラフィ三次元印刷用の光硬化性組成物であって、
光反応性末端基を含む疎水性オリゴマーを含む光反応性オリゴマー成分、
光反応性末端基を有する光反応性モノマーを含む光反応性モノマー成分、及び
光開始剤を含む光開始組成物
を含み;
前記光硬化性組成物は、ブルックフィールド粘度計を使用して求めて22℃で250~10,000センチポアズの粘度を有し;
その光硬化組成物は、23℃にて10ギガヘルツでスプリットポスト誘電体共振器試験によってそれぞれ求めて、0.010未満、好ましくは0.008未満、より好ましくは0.006未満、最も好ましくは0.004未満の誘電損失を有する、光硬化性組成物。 - 35~85質量パーセントの光反応性オリゴマー成分、
15~65質量パーセントの光反応性モノマー成分、
0.01~15質量パーセントの光開始組成物を含み、
ここで、各質量パーセントは、光反応性オリゴマー成分、光反応性モノマー成分及び光開始組成物の合計質量である100質量に対するものである、請求項1に記載の光硬化性組成物。 - 光反応性オリゴマー成分の疎水性オリゴマーが、(メタ)アクリラート末端基、好ましくは2個以上のメタクリラート末端基を含む、請求項1又は請求項2に記載の光硬化性組成物。
- 光反応性オリゴマー成分の疎水性オリゴマーが、(メタ)アクリラート誘導体化ポリエステル、(メタ)アクリラート誘導体化ポリウレタン、(メタ)アクリラートウレタン誘導体化ポリブタジエンオリゴマー、又はその組み合わせである、請求項1から3のいずれか一項に記載の光硬化性組成物。
- 光反応性オリゴマー成分が、1モル当たり500~5,000グラムの数平均分子量を有するウレタン(メタ)アクリラート誘導体化ポリブタジエンオリゴマーを含む、請求項1から4のいずれか一項に記載の光硬化性組成物。
- 光反応性モノマーが、(メタ)アクリラート末端基、好ましくは2個以上のメタクリラート末端基を含む、請求項1から5のいずれか一項に記載の光硬化性組成物。
- 光反応性モノマー成分が、少なくとも50質量%、好ましくは少なくとも60質量%、より好ましくは少なくとも70質量%のメタクリラート官能性モノマーを含む、請求項6に記載の光硬化性組成物。
- アクリラート末端基を有するモノマーが、光反応性オリゴマー成分及び光反応性モノマー成分の合計質量に対して20質量パーセント以下の量で存在する、請求項6に記載の光硬化性組成物。
- 光反応性モノマー成分が、ジメタクリル酸エチレングリコール、トリメタクリル酸トリメチロールプロパン及びメタクリル酸イソボルニルの組み合わせを含む、請求項7に記載の光硬化性組成物。
- 粒状充填剤を、それぞれ光硬化性組成物の総体積に対して5~60vol%、好ましくは10~60vol%、より好ましくは10~50vol%の量で更に含む、請求項1から9のいずれか一項に記載の光硬化性組成物。
- 粒状充填剤が、シリカ、アルミナ、チタン酸カルシウム、チタン酸ストロンチウム、チタン酸バリウム、ノナチタン酸バリウム、窒化ホウ素、窒化アルミニウム又はその組み合わせを含み、
好ましくは、粒状充填剤又はその組み合わせは、5以上の誘電率を有し、
より好ましくは、粒状充填剤は、アルミナ、ノナチタン酸バリウム又はその組み合わせを含む、請求項10に記載の光硬化性組成物。 - 光開始組成物が、紫外線吸収剤を、好ましくは光反応性オリゴマー成分、光反応性モノマー成分及び光開始組成物の合計質量である100質量パーセントに対して0.01~10質量パーセントの量で更に含み、請求項1から11のいずれか一項に記載の光硬化性組成物。
- 光開始組成物が、シンチレート剤を、好ましくは光反応性オリゴマー成分、光反応性モノマー成分及び光開始組成物の合計質量である100質量パーセントに対し0.01~2質量パーセントの量で更に含む、請求項1から12のいずれか一項に記載の光硬化性組成物。
- 10ギガヘルツで2~12の比誘電率を有する、請求項1から13のいずれか一項に記載の光硬化性組成物。
- 請求項1から14のいずれか一項に記載の組成物の光硬化生成物を含む三次元構造体。
- スプリットポスト誘電体共振器試験によって23℃の温度にて10ギガヘルツで求めて、10GHzで0.004未満の誘電損失を有する、請求項15に記載の三次元構造体。
- 多孔性である、請求項15又は請求項16に記載の三次元構造体。
- 請求項15から17のいずれか一項に記載の三次元構造体を含む電子デバイス。
- インピーダンスマッチング層、誘電体導光路、レンズ、反射アレイ、アンテナマッチング構造体、スーパーストレート、カップラー、ディバイダー、レドーム又は誘電体アンテナである、請求項18に記載の電子デバイス。
- 少なくとも1つの導電体が、前記光硬化生成物の上に、又はそれに接して配置された、請求項19に記載の電子デバイス。
- 三次元ポリマー構造体を製作するためのステレオリソグラフィ法であって、
請求項1から14のいずれか一項に記載の光硬化性組成物を含むある量の組成物を用意する工程;
パターンで前記組成物の一部を活性化放射線で照射して、前記三次元ポリマー構造体の光硬化層を形成する工程;
前記光硬化層を光硬化性組成物と接触させる工程;
パターンで光硬化性組成物を活性化放射線で照射して、第1の前記光硬化層の上に第2の光硬化層を形成する工程;並びに、
接触及び照射を繰り返して、前記三次元ポリマー構造体を形成する工程
を含む方法。 - 前記三次元ポリマー構造体を熱により硬化させる工程を更に含む、請求項21に記載の方法。
- 多孔性である、請求項21又は請求項22に記載の方法によって作製された三次元構造体。
- 請求項22に規定した三次元構造体又は請求項23に記載の三次元構造体を含む電子デバイス。
- インピーダンスマッチング層、誘電体導光路、レンズ、反射アレイ、アンテナマッチング構造体、スーパーストレート、カップラー、ディバイダー、レドーム又は誘電体アンテナである、請求項24に記載の電子デバイス。
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Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4575330A (en) | 1984-08-08 | 1986-03-11 | Uvp, Inc. | Apparatus for production of three-dimensional objects by stereolithography |
US4929402A (en) | 1984-08-08 | 1990-05-29 | 3D Systems, Inc. | Method for production of three-dimensional objects by stereolithography |
US5236637A (en) | 1984-08-08 | 1993-08-17 | 3D Systems, Inc. | Method of and apparatus for production of three dimensional objects by stereolithography |
EP0747203B1 (en) | 1988-04-18 | 2001-06-27 | 3D Systems, Inc. | Stereolithographic curl reduction |
US5184307A (en) | 1988-04-18 | 1993-02-02 | 3D Systems, Inc. | Method and apparatus for production of high resolution three-dimensional objects by stereolithography |
DE68927908T2 (de) | 1988-04-18 | 1997-09-25 | 3D Systems Inc | Verringerung des stereolithographischen Verbiegens |
US5234636A (en) | 1989-09-29 | 1993-08-10 | 3D Systems, Inc. | Methods of coating stereolithographic parts |
US5192559A (en) | 1990-09-27 | 1993-03-09 | 3D Systems, Inc. | Apparatus for building three-dimensional objects with sheets |
DE59209143D1 (de) * | 1991-03-27 | 1998-02-26 | Ciba Geigy Ag | Photoempfindliches Gemisch auf Basis von Acrylaten |
TW223683B (ja) * | 1991-03-27 | 1994-05-11 | Ciba Geigy Ag | |
TW363999B (en) * | 1991-06-04 | 1999-07-11 | Vantico Ag | Photosensitive compositions |
JPH0665334A (ja) * | 1991-08-21 | 1994-03-08 | Nippon Kayaku Co Ltd | 電子部品用樹脂組成物 |
US5418112A (en) | 1993-11-10 | 1995-05-23 | W. R. Grace & Co.-Conn. | Photosensitive compositions useful in three-dimensional part-building and having improved photospeed |
KR100810546B1 (ko) | 2000-06-15 | 2008-03-18 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 삼차원 광학 소자의 가공 방법 |
JP3638889B2 (ja) | 2000-07-27 | 2005-04-13 | 大塚化学ホールディングス株式会社 | 誘電性樹脂発泡体及びそれを用いた電波レンズ |
JP4044505B2 (ja) | 2003-09-29 | 2008-02-06 | 独立行政法人科学技術振興機構 | 光酸発生剤 |
US7649029B2 (en) | 2004-05-17 | 2010-01-19 | 3M Innovative Properties Company | Dental compositions containing nanozirconia fillers |
EP1784302B1 (en) | 2004-09-01 | 2016-07-06 | Encapsys, Llc | Encapsulated cure systems |
KR100637450B1 (ko) | 2005-02-16 | 2006-10-23 | 한양대학교 산학협력단 | 플루오로알킬술폰늄염의 광산발생기가 치환된 화합물과 이를 중합한 공중합체 |
ES2322655T5 (es) | 2005-11-18 | 2019-06-27 | Agfa Nv | Método para fabricar una plancha de impresión litográfica |
US20070191506A1 (en) | 2006-02-13 | 2007-08-16 | 3M Innovative Properties Company | Curable compositions for optical articles |
WO2007124092A2 (en) | 2006-04-21 | 2007-11-01 | Cornell Research Foundation, Inc. | Photoacid generator compounds and compositions |
US7524615B2 (en) | 2006-08-14 | 2009-04-28 | Gary Ganghui Teng | Negative laser sensitive lithographic printing plate having specific photosensitive composition |
US8092735B2 (en) | 2006-08-17 | 2012-01-10 | 3M Innovative Properties Company | Method of making a light emitting device having a molded encapsulant |
US9944031B2 (en) | 2007-02-13 | 2018-04-17 | 3M Innovative Properties Company | Molded optical articles and methods of making same |
KR20100028303A (ko) | 2008-09-04 | 2010-03-12 | 삼성전기주식회사 | 저유전손실의 유전체 페이스트 및 그를 이용한 유전체의 제조방법 |
CN102159372A (zh) | 2008-09-22 | 2011-08-17 | 柯尼卡美能达精密光学株式会社 | 晶片透镜的制造方法 |
CN102715751A (zh) | 2011-03-30 | 2012-10-10 | 朱雪兵 | 凝胶垫及其紫外固化生产方法 |
MX352989B (es) | 2013-02-12 | 2017-12-14 | Carbon3D Inc | Impresión de interfase líquida continua. |
US20170225395A1 (en) | 2014-08-05 | 2017-08-10 | University Of Washington | Three-dimensional printed mechanoresponsive materials and related methods |
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
JP2018503707A (ja) * | 2014-11-18 | 2018-02-08 | オーエフエス ファイテル,エルエルシー | 低密度uv硬化性光ファイバコーティング剤、それとともに製造されるファイバ、及びファイバ製造方法 |
WO2016153711A1 (en) | 2015-03-23 | 2016-09-29 | Dow Global Technologies Llc | Photocurable compositions for three-dimensional printing |
JP7069006B2 (ja) | 2015-09-04 | 2022-05-17 | カーボン,インコーポレイテッド | 積層造形用シアネートエステル二重硬化樹脂 |
WO2017223084A1 (en) * | 2016-06-20 | 2017-12-28 | Dentsply Sirona Inc. | Three dimensional fabricating material systems and methods for producing layered dental products |
US10239255B2 (en) * | 2017-04-11 | 2019-03-26 | Molecule Corp | Fabrication of solid materials or films from a polymerizable liquid |
KR102312067B1 (ko) | 2017-06-07 | 2021-10-13 | 로저스코포레이션 | 유전체 공진기 안테나 시스템 |
US11552390B2 (en) | 2018-09-11 | 2023-01-10 | Rogers Corporation | Dielectric resonator antenna system |
TWI820237B (zh) | 2018-10-18 | 2023-11-01 | 美商羅傑斯公司 | 聚合物結構、其立體光刻製造方法以及包含該聚合物結構之電子裝置 |
EP3942366B1 (en) * | 2019-05-30 | 2023-11-15 | Rogers Corporation | Photocurable compositions for stereolithography, stereolithography methods using the compositions, polymer components formed by the stereolithography methods, and a device including the polymer components |
US11482790B2 (en) | 2020-04-08 | 2022-10-25 | Rogers Corporation | Dielectric lens and electromagnetic device with same |
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- 2020-05-29 TW TW109118034A patent/TW202043298A/zh unknown
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EP3942366C0 (en) | 2023-11-15 |
EP3942366B1 (en) | 2023-11-15 |
WO2020243429A1 (en) | 2020-12-03 |
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US20200377628A1 (en) | 2020-12-03 |
EP4279278A2 (en) | 2023-11-22 |
US20220298270A1 (en) | 2022-09-22 |
EP3942366A1 (en) | 2022-01-26 |
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