JP2022525438A5 - - Google Patents
Info
- Publication number
- JP2022525438A5 JP2022525438A5 JP2021559895A JP2021559895A JP2022525438A5 JP 2022525438 A5 JP2022525438 A5 JP 2022525438A5 JP 2021559895 A JP2021559895 A JP 2021559895A JP 2021559895 A JP2021559895 A JP 2021559895A JP 2022525438 A5 JP2022525438 A5 JP 2022525438A5
- Authority
- JP
- Japan
- Prior art keywords
- gas
- processing chamber
- processing
- substrate
- plasma
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962832571P | 2019-04-11 | 2019-04-11 | |
| US62/832,571 | 2019-04-11 | ||
| PCT/US2020/024633 WO2020210031A1 (en) | 2019-04-11 | 2020-03-25 | Plasma densification within a processing chamber |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022525438A JP2022525438A (ja) | 2022-05-13 |
| JP2022525438A5 true JP2022525438A5 (enExample) | 2023-04-06 |
| JP7564123B2 JP7564123B2 (ja) | 2024-10-08 |
Family
ID=72748921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021559895A Active JP7564123B2 (ja) | 2019-04-11 | 2020-03-25 | 処理チャンバ内でのプラズマの高密度化 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20200328066A1 (enExample) |
| JP (1) | JP7564123B2 (enExample) |
| KR (2) | KR20210138792A (enExample) |
| CN (1) | CN113853450A (enExample) |
| SG (1) | SG11202111201WA (enExample) |
| TW (1) | TW202104650A (enExample) |
| WO (1) | WO2020210031A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12211673B2 (en) * | 2020-10-22 | 2025-01-28 | Applied Materials, Inc. | Processing chamber deposition confinement |
| CN112593208B (zh) | 2020-11-25 | 2022-01-11 | 北京北方华创微电子装备有限公司 | 半导体工艺设备 |
| US12488981B2 (en) | 2020-11-25 | 2025-12-02 | Applied Materials, Inc. | Systems and methods for deposition residue control |
| CN119663249A (zh) * | 2024-12-24 | 2025-03-21 | 拓荆科技(上海)有限公司 | 薄膜沉积设备和薄膜沉积方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0936053A (ja) * | 1995-07-25 | 1997-02-07 | Sony Corp | 半導体の製造方法 |
| KR101149332B1 (ko) * | 2005-07-29 | 2012-05-23 | 주성엔지니어링(주) | 플라즈마 식각 장치 |
| KR101017163B1 (ko) * | 2008-08-06 | 2011-02-25 | 주식회사 동부하이텍 | 고밀도 플라즈마 화학기상증착장치 |
| KR101829665B1 (ko) * | 2011-12-21 | 2018-02-19 | 주식회사 원익아이피에스 | 기판 처리 장치 |
| TWI480417B (zh) * | 2012-11-02 | 2015-04-11 | Ind Tech Res Inst | 具氣幕之氣體噴灑裝置及其薄膜沉積裝置 |
| US9508547B1 (en) * | 2015-08-17 | 2016-11-29 | Lam Research Corporation | Composition-matched curtain gas mixtures for edge uniformity modulation in large-volume ALD reactors |
| US9738977B1 (en) | 2016-06-17 | 2017-08-22 | Lam Research Corporation | Showerhead curtain gas method and system for film profile modulation |
-
2020
- 2020-03-25 CN CN202080037327.XA patent/CN113853450A/zh active Pending
- 2020-03-25 JP JP2021559895A patent/JP7564123B2/ja active Active
- 2020-03-25 SG SG11202111201WA patent/SG11202111201WA/en unknown
- 2020-03-25 KR KR1020217036632A patent/KR20210138792A/ko not_active Ceased
- 2020-03-25 WO PCT/US2020/024633 patent/WO2020210031A1/en not_active Ceased
- 2020-03-25 KR KR1020267009421A patent/KR20260049677A/ko active Pending
- 2020-03-25 US US16/829,573 patent/US20200328066A1/en not_active Abandoned
- 2020-04-08 TW TW109111763A patent/TW202104650A/zh unknown
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