JP2022515327A - 潜在的反応性ポリウレタン系接着フィルム - Google Patents

潜在的反応性ポリウレタン系接着フィルム Download PDF

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JP2022515327A
JP2022515327A JP2021531257A JP2021531257A JP2022515327A JP 2022515327 A JP2022515327 A JP 2022515327A JP 2021531257 A JP2021531257 A JP 2021531257A JP 2021531257 A JP2021531257 A JP 2021531257A JP 2022515327 A JP2022515327 A JP 2022515327A
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Prior art keywords
polyurethane
adhesive film
adhesive
weight
potentially reactive
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Japanese (ja)
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JP2022515327A5 (https=
Inventor
ケルシュ、アネット
アスト、ヤナ
シントラー、ケルスティン
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ローマン ゲーエムベーハー ウント コー． カーゲー
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Publication of JP2022515327A publication Critical patent/JP2022515327A/ja
Publication of JP2022515327A5 publication Critical patent/JP2022515327A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
    • C08G18/751—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring
    • C08G18/752—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group
    • C08G18/753—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group
    • C08G18/755—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group and at least one isocyanate or isothiocyanate group linked to a secondary carbon atom of the cycloaliphatic ring, e.g. isophorone diisocyanate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7614—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring
    • C08G18/7621—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring being toluene diisocyanate including isomer mixtures
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/40—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/085—Copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/01—Magnetic additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/314—Applications of adhesives in processes or use of adhesives in the form of films or foils for carpets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
JP2021531257A 2018-11-29 2018-11-29 潜在的反応性ポリウレタン系接着フィルム Pending JP2022515327A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2018/083069 WO2020108765A1 (de) 2018-11-29 2018-11-29 Latent reaktiver klebefilm auf polyurethanbasis

Publications (2)

Publication Number Publication Date
JP2022515327A true JP2022515327A (ja) 2022-02-18
JP2022515327A5 JP2022515327A5 (https=) 2023-03-08

Family

ID=64661314

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021531257A Pending JP2022515327A (ja) 2018-11-29 2018-11-29 潜在的反応性ポリウレタン系接着フィルム

Country Status (7)

Country Link
US (1) US12139648B2 (https=)
EP (1) EP3887468B1 (https=)
JP (1) JP2022515327A (https=)
KR (1) KR102625694B1 (https=)
CN (1) CN113166602A (https=)
CA (1) CA3121223A1 (https=)
WO (1) WO2020108765A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113563824B (zh) * 2021-07-26 2023-03-14 宁波启合新材料科技有限公司 一种热增粘导热胶带及其制备方法
PL4412827T3 (pl) * 2021-10-07 2025-05-12 Lohmann Gmbh & Co. Kg Asymetryczny klej
US20250109321A1 (en) * 2023-09-29 2025-04-03 Honeywell Federal Manufacturing & Technologies, Llc Method of preparation and application of polyurethane adhesive
EP4629756A1 (de) * 2024-04-02 2025-10-08 Lohmann GmbH & Co. KG Elektronisches system und verfahren zur herstellung des elektronischen systems

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6140149A (ja) * 1984-08-01 1986-02-26 日東電工株式会社 金属板の接着方法
JPH09228079A (ja) * 1995-12-20 1997-09-02 Togo Seisakusho:Kk 金属の防食方法及び防食材料並びに導電性シート
JP2001261773A (ja) * 2000-03-16 2001-09-26 Bayer Ag 接着剤組成物
JP2014060025A (ja) * 2012-09-18 2014-04-03 Dexerials Corp 異方性導電フィルム、接続方法、及び接合体
JP2015170581A (ja) * 2014-03-11 2015-09-28 デクセリアルズ株式会社 異方性導電フィルム、並びに、接続方法及び接合体
JP2017531056A (ja) * 2014-08-12 2017-10-19 エイチ．ビー．フラー カンパニー 熱硬化性接着フィルム
WO2018002312A1 (de) * 2016-06-30 2018-01-04 Lohmann Gmbh & Co. Kg Thermisch aktivierbarer latent reaktiver klebefilm
JP2018503701A (ja) * 2014-10-31 2018-02-08 テーザ・ソシエタス・ヨーロピア 潜在反応性接着フィルムによる２つの基板の貼付
JP2018022827A (ja) * 2016-08-05 2018-02-08 藤森工業株式会社 Ｆｐｃ用導電性接着シート及びｆｐｃ

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10140206A1 (de) 2001-08-16 2003-03-06 Bayer Ag Einkomponentige isocyanatvernetzende Zweiphasen-Systeme
WO2006088127A1 (ja) 2005-02-18 2006-08-24 Toyo Ink Manufacturing Co., Ltd. 電磁波シールド性接着フィルム及びその製造方法、並びに被着体の電磁波遮蔽方法
US8256019B2 (en) * 2007-08-01 2012-09-04 Honeywell International Inc. Composite ballistic fabric structures for hard armor applications
DE102007054046A1 (de) 2007-11-13 2009-06-18 Bayer Materialscience Ag Latentreaktive Klebstoffe für Identifikations-Dokumente
WO2009090997A1 (ja) 2008-01-15 2009-07-23 Toyo Ink Manufacturing Co., Ltd. 硬化性電磁波シールド性接着性フィルム、その製造方法、及びその使用方法、並びに電磁波遮蔽物の製造方法及び電磁波遮蔽物
DE202009015262U1 (de) 2009-07-30 2010-03-11 Lohmann Gmbh & Co. Kg Latent reaktive, hitzeaktivierbare Klebmasse und damit hergestellte Klebemittel
DE102011008430A1 (de) 2011-01-12 2012-07-12 Lohmann Gmbh & Co Kg Hitzeaktivierbares, faserverstärktes strukturelles Klebemittel
DE102012203249A1 (de) 2012-03-01 2013-09-05 Tesa Se Verwendung eines latentreaktiven Klebefilms zur Verklebung von eloxiertem Aluminium mit Kunststoff
KR101758689B1 (ko) 2013-02-08 2017-07-18 쇼와 덴코 가부시키가이샤 열전도성 점착제 조성물, 열전도성 점착 시트, 난열성 열전도성 점착제 조성물, 난열성 열전도성 점착 시트, 열전도성 절연 도막 및 금속 성형품
CN103320076A (zh) * 2013-06-28 2013-09-25 苏州毫邦新材料有限公司 一种异方导电热熔胶粘剂
DE102013217880A1 (de) 2013-09-06 2015-03-12 Tesa Se Latentreaktive Klebeprodukte mit verbesserter Stanzbarkeit und latentreaktive Klebfolienstanzlinge
KR102072195B1 (ko) 2014-06-30 2020-01-31 타츠타 전선 주식회사 도전성 접착제 조성물
WO2016135341A1 (en) * 2015-02-27 2016-09-01 Henkel Ag & Co. Kgaa Debondable reactive hot melt adhesives
CN104817995A (zh) * 2015-05-20 2015-08-05 叶芳 一种新型聚氨酯导电胶及其制备方法
WO2018003704A1 (ja) 2016-06-27 2018-01-04 株式会社スリーボンド 熱硬化型導電性接着剤

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6140149A (ja) * 1984-08-01 1986-02-26 日東電工株式会社 金属板の接着方法
JPH09228079A (ja) * 1995-12-20 1997-09-02 Togo Seisakusho:Kk 金属の防食方法及び防食材料並びに導電性シート
JP2001261773A (ja) * 2000-03-16 2001-09-26 Bayer Ag 接着剤組成物
JP2014060025A (ja) * 2012-09-18 2014-04-03 Dexerials Corp 異方性導電フィルム、接続方法、及び接合体
JP2015170581A (ja) * 2014-03-11 2015-09-28 デクセリアルズ株式会社 異方性導電フィルム、並びに、接続方法及び接合体
JP2017531056A (ja) * 2014-08-12 2017-10-19 エイチ．ビー．フラー カンパニー 熱硬化性接着フィルム
JP2018503701A (ja) * 2014-10-31 2018-02-08 テーザ・ソシエタス・ヨーロピア 潜在反応性接着フィルムによる２つの基板の貼付
WO2018002312A1 (de) * 2016-06-30 2018-01-04 Lohmann Gmbh & Co. Kg Thermisch aktivierbarer latent reaktiver klebefilm
JP2018022827A (ja) * 2016-08-05 2018-02-08 藤森工業株式会社 Ｆｐｃ用導電性接着シート及びｆｐｃ

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CA3121223A1 (en) 2020-06-04
US20220025229A1 (en) 2022-01-27
EP3887468A1 (de) 2021-10-06
KR20210097753A (ko) 2021-08-09
WO2020108765A1 (de) 2020-06-04
EP3887468B1 (de) 2026-05-06
US12139648B2 (en) 2024-11-12
KR102625694B1 (ko) 2024-01-15
CN113166602A (zh) 2021-07-23

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