JP2022506796A - ポリイミド前駆体組成物及びそれを用いて製造されたポリイミドフィルム - Google Patents
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- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
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- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
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- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
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- H01L21/02107—Forming insulating materials on a substrate
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Abstract
Description
b)検出された電圧値が飽和値に到達して、これ以上変化しない時の電圧値を飽和帯電圧で得て、コロナ放電印加を中断する段階;
c)コロナ放電印加が中断されたフィルムの電位値を連続して検出して、前記飽和帯電圧に対して検出された電位値が50%になる時点の時間を測定して半減期を得る段階;及び
d)測定された飽和帯電圧と半減期とが所定値以上であるか否かからポリマーフィルムの表面特性を判断する段階。
Claims (14)
- 前記化学式1に結合された末端封止基の反応性基が、maleic系、シクロブタン系、アセチレン系、nadic系、エポキシ系またはphenylethynyl系のうちから選択される反応性構造を含む、
請求項1に記載のポリイミド前駆体組成物。 - 前記第1ポリアミド酸と第2ポリアミド酸が、20:80~80:20のmol比で混合される、
請求項1から3のいずれか1項に記載のポリイミド前駆体組成物。 - 前記第1ポリアミド酸と第2ポリアミド酸は、パラフェニレンジアミンと3,3',4,4'-ビフェニルカルボン酸二無水物との反応生成物を含み、
前記反応生成物は、パラフェニレンジアミンを3,3',4,4'-ビフェニルカルボン酸二無水物の当量比よりも過量反応させて得た、
請求項1から4のいずれか1項に記載のポリイミド前駆体組成物。 - 前記第1ポリアミド酸は、パラフェニレンジアミンと3,3',4,4'-ビフェニルカルボン酸二無水物とを、パラフェニレンジアミン100mol基準反応性末端封止剤1~10molの存在下に反応させた反応生成物である、
請求項5に記載のポリイミド前駆体組成物。 - 請求項1から請求項6のうち何れか一項に記載のポリイミド前駆体組成物をキャリア基板上に塗布する段階と、
前記ポリイミド前駆体組成物を加熱及び硬化する段階と、
を含む、
ポリイミドフィルムの製造方法。 - 請求項1から請求項6のうち何れか一項に記載のポリイミド前駆体組成物の硬化生成物を含む、
ポリイミドフィルム。 - 前記ポリイミドフィルムが6μmの厚さで、コロナ放電法で測定された飽和帯電圧が1.3kV以上であり、
半減期時間が135秒以上であり、
熱分解温度(Td_1%)が570℃以上である、
請求項8から10のいずれか1項に記載のポリイミドフィルム。 - 請求項8から11のいずれか1項に記載のポリイミドフィルムを基板として含む、
フレキシブルデバイス。 - 請求項1から請求項6のうち何れか一項に記載のポリイミド前駆体組成物をキャリア基板上に塗布する段階と、
前記ポリイミド前駆体組成物を加熱してポリアミド酸をイミド化することにより、ポリイミドフィルムを形成する段階と、
前記ポリイミドフィルム上に素子を形成する段階と、
前記素子が形成されたポリイミドフィルムを前記キャリア基板から剥離する段階と、
を含む、
フレキシブルデバイスの製造方法。 - 前記製造方法が、LTPS(低温ポリシリコン)工程、ITO工程またはOxide工程を含む、
請求項13に記載のフレキシブルデバイスの製造方法。
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KR1020200006836A KR102262507B1 (ko) | 2019-02-14 | 2020-01-17 | 폴리이미드 전구체 조성물 및 이를 이용하여 제조된 폴리이미드 필름 |
KR10-2020-0006836 | 2020-01-17 | ||
PCT/KR2020/001842 WO2020166913A1 (ko) | 2019-02-14 | 2020-02-10 | 폴리이미드 전구체 조성물 및 이를 이용하여 제조된 폴리이미드 필름 |
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TW202031731A (zh) | 2020-09-01 |
KR102262507B1 (ko) | 2021-06-08 |
US20220010069A1 (en) | 2022-01-13 |
KR20200099469A (ko) | 2020-08-24 |
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