JP2022186276A5 - - Google Patents

Download PDF

Info

Publication number
JP2022186276A5
JP2022186276A5 JP2021094415A JP2021094415A JP2022186276A5 JP 2022186276 A5 JP2022186276 A5 JP 2022186276A5 JP 2021094415 A JP2021094415 A JP 2021094415A JP 2021094415 A JP2021094415 A JP 2021094415A JP 2022186276 A5 JP2022186276 A5 JP 2022186276A5
Authority
JP
Japan
Prior art keywords
thermal resistance
region
semiconductor device
semiconductor element
clip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021094415A
Other languages
English (en)
Japanese (ja)
Other versions
JP7694167B2 (ja
JP2022186276A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2021094415A priority Critical patent/JP7694167B2/ja
Priority claimed from JP2021094415A external-priority patent/JP7694167B2/ja
Priority to PCT/JP2022/019961 priority patent/WO2022255053A1/ja
Publication of JP2022186276A publication Critical patent/JP2022186276A/ja
Publication of JP2022186276A5 publication Critical patent/JP2022186276A5/ja
Priority to US18/497,089 priority patent/US20240063150A1/en
Application granted granted Critical
Publication of JP7694167B2 publication Critical patent/JP7694167B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2021094415A 2021-06-04 2021-06-04 半導体装置 Active JP7694167B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2021094415A JP7694167B2 (ja) 2021-06-04 2021-06-04 半導体装置
PCT/JP2022/019961 WO2022255053A1 (ja) 2021-06-04 2022-05-11 半導体装置
US18/497,089 US20240063150A1 (en) 2021-06-04 2023-10-30 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021094415A JP7694167B2 (ja) 2021-06-04 2021-06-04 半導体装置

Publications (3)

Publication Number Publication Date
JP2022186276A JP2022186276A (ja) 2022-12-15
JP2022186276A5 true JP2022186276A5 (https=) 2023-07-26
JP7694167B2 JP7694167B2 (ja) 2025-06-18

Family

ID=84324336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021094415A Active JP7694167B2 (ja) 2021-06-04 2021-06-04 半導体装置

Country Status (3)

Country Link
US (1) US20240063150A1 (https=)
JP (1) JP7694167B2 (https=)
WO (1) WO2022255053A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004047800A (ja) * 2002-07-12 2004-02-12 Toyota Industries Corp 接続部材及び接続構造
JP2012069640A (ja) * 2010-09-22 2012-04-05 Toshiba Corp 半導体装置及び電力用半導体装置
US8987879B2 (en) * 2011-07-06 2015-03-24 Infineon Technologies Ag Semiconductor device including a contact clip having protrusions and manufacturing thereof
JP6238121B2 (ja) * 2013-10-01 2017-11-29 ローム株式会社 半導体装置
JP7150461B2 (ja) * 2018-04-24 2022-10-11 ローム株式会社 半導体装置
JP7419781B2 (ja) * 2019-12-10 2024-01-23 富士電機株式会社 半導体モジュール

Similar Documents

Publication Publication Date Title
JP2023011573A5 (ja) 表示装置の作製方法
JP2004111721A5 (https=)
JP2003086737A5 (https=)
JP2008507134A5 (https=)
US7737452B2 (en) Light-emitting element package and light source apparatus using the same
JP2009105297A5 (https=)
JP2000022210A5 (https=)
JP2022532154A5 (ja) 発光パッケージ及び表示装置
JPWO2019171198A5 (https=)
JPWO2023282013A5 (https=)
JP2009117819A5 (https=)
JP2022186276A5 (https=)
JPWO2023140042A5 (https=)
JPWO2023002795A5 (https=)
JP2828358B2 (ja) 半導体放熱構造
JPWO2022259873A5 (https=)
JP2021158320A5 (https=)
JP2006114732A5 (https=)
JPWO2023286432A5 (https=)
JPWO2024018790A5 (https=)
JPWO2024084621A5 (https=)
JP2003249509A5 (https=)
JP2022532155A5 (ja) 発光パッケージ
JPWO2023210642A5 (https=)
JPWO2024075514A5 (https=)