JPWO2023210642A5 - - Google Patents
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- Publication number
- JPWO2023210642A5 JPWO2023210642A5 JP2024517343A JP2024517343A JPWO2023210642A5 JP WO2023210642 A5 JPWO2023210642 A5 JP WO2023210642A5 JP 2024517343 A JP2024517343 A JP 2024517343A JP 2024517343 A JP2024517343 A JP 2024517343A JP WO2023210642 A5 JPWO2023210642 A5 JP WO2023210642A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- metal region
- collector
- semiconductor device
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022073413 | 2022-04-27 | ||
| JP2022073413 | 2022-04-27 | ||
| PCT/JP2023/016309 WO2023210642A1 (ja) | 2022-04-27 | 2023-04-25 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023210642A1 JPWO2023210642A1 (https=) | 2023-11-02 |
| JPWO2023210642A5 true JPWO2023210642A5 (https=) | 2024-08-09 |
| JP7740531B2 JP7740531B2 (ja) | 2025-09-17 |
Family
ID=88519098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024517343A Active JP7740531B2 (ja) | 2022-04-27 | 2023-04-25 | 半導体装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250022873A1 (https=) |
| JP (1) | JP7740531B2 (https=) |
| CN (1) | CN119072788A (https=) |
| TW (1) | TWI878836B (https=) |
| WO (1) | WO2023210642A1 (https=) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3522939B2 (ja) * | 1995-12-27 | 2004-04-26 | 株式会社東芝 | 半導体デバイス及びその製造方法 |
| US7868335B1 (en) * | 2008-08-18 | 2011-01-11 | Hrl Laboratories, Llc | Modulation doped super-lattice sub-collector for high-performance HBTs and BJTs |
| JP2010199558A (ja) | 2009-01-27 | 2010-09-09 | Panasonic Corp | 半導体装置およびその製造方法 |
| JP2016171172A (ja) * | 2015-03-12 | 2016-09-23 | 日本電信電話株式会社 | ヘテロ接合バイポーラトランジスタおよびその製造方法 |
| JP6447322B2 (ja) | 2015-04-02 | 2019-01-09 | 住友電気工業株式会社 | 半導体素子及び半導体素子の製造方法 |
| JP6386486B2 (ja) * | 2016-02-25 | 2018-09-05 | 日本電信電話株式会社 | ヘテロ接合バイポーラトランジスタおよびその製造方法 |
| JP2019075536A (ja) | 2017-10-11 | 2019-05-16 | 株式会社村田製作所 | パワーアンプモジュール |
| US10734310B2 (en) * | 2017-12-06 | 2020-08-04 | Murata Manufacturing Co., Ltd. | Semiconductor apparatus |
| JP2021052150A (ja) * | 2019-09-26 | 2021-04-01 | 株式会社村田製作所 | パワーアンプ単位セル及びパワーアンプモジュール |
| TWI907475B (zh) | 2020-08-07 | 2025-12-11 | 日商Ｆｌｏｓｆｉａ股份有限公司 | 半導體元件及半導體裝置 |
-
2023
- 2023-03-27 TW TW112111502A patent/TWI878836B/zh active
- 2023-04-25 JP JP2024517343A patent/JP7740531B2/ja active Active
- 2023-04-25 CN CN202380035902.6A patent/CN119072788A/zh active Pending
- 2023-04-25 WO PCT/JP2023/016309 patent/WO2023210642A1/ja not_active Ceased
-
2024
- 2024-09-30 US US18/901,620 patent/US20250022873A1/en active Pending
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