JPWO2023282013A5 - - Google Patents

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Publication number
JPWO2023282013A5
JPWO2023282013A5 JP2023533494A JP2023533494A JPWO2023282013A5 JP WO2023282013 A5 JPWO2023282013 A5 JP WO2023282013A5 JP 2023533494 A JP2023533494 A JP 2023533494A JP 2023533494 A JP2023533494 A JP 2023533494A JP WO2023282013 A5 JPWO2023282013 A5 JP WO2023282013A5
Authority
JP
Japan
Prior art keywords
semiconductor device
electrode
metal
wires
covering portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023533494A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023282013A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/024140 external-priority patent/WO2023282013A1/ja
Publication of JPWO2023282013A1 publication Critical patent/JPWO2023282013A1/ja
Publication of JPWO2023282013A5 publication Critical patent/JPWO2023282013A5/ja
Pending legal-status Critical Current

Links

JP2023533494A 2021-07-06 2022-06-16 Pending JPWO2023282013A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021112383 2021-07-06
PCT/JP2022/024140 WO2023282013A1 (ja) 2021-07-06 2022-06-16 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023282013A1 JPWO2023282013A1 (https=) 2023-01-12
JPWO2023282013A5 true JPWO2023282013A5 (https=) 2024-04-05

Family

ID=84800220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023533494A Pending JPWO2023282013A1 (https=) 2021-07-06 2022-06-16

Country Status (4)

Country Link
US (1) US20240128169A1 (https=)
JP (1) JPWO2023282013A1 (https=)
CN (1) CN117616567A (https=)
WO (1) WO2023282013A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7678773B2 (ja) * 2022-02-15 2025-05-16 三菱電機株式会社 半導体装置およびその製造方法
JPWO2024171887A1 (https=) * 2023-02-17 2024-08-22
WO2025052798A1 (ja) * 2023-09-06 2025-03-13 ローム株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5975911B2 (ja) * 2013-03-15 2016-08-23 ルネサスエレクトロニクス株式会社 半導体装置
JP6817777B2 (ja) * 2015-12-16 2021-01-20 ローム株式会社 半導体装置
JP7280261B2 (ja) * 2018-07-12 2023-05-23 ローム株式会社 半導体素子および半導体装置
JP6826665B2 (ja) * 2018-12-27 2021-02-03 三菱電機株式会社 半導体装置、半導体装置の製造方法及び電力変換装置

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