JPWO2023282013A1 - - Google Patents
Info
- Publication number
- JPWO2023282013A1 JPWO2023282013A1 JP2023533494A JP2023533494A JPWO2023282013A1 JP WO2023282013 A1 JPWO2023282013 A1 JP WO2023282013A1 JP 2023533494 A JP2023533494 A JP 2023533494A JP 2023533494 A JP2023533494 A JP 2023533494A JP WO2023282013 A1 JPWO2023282013 A1 JP WO2023282013A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/461—Leadframes specially adapted for cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/464—Additional interconnections in combination with leadframes
- H10W70/465—Bumps or wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/811—Multiple chips on leadframes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/424—Cross-sectional shapes
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021112383 | 2021-07-06 | ||
| PCT/JP2022/024140 WO2023282013A1 (ja) | 2021-07-06 | 2022-06-16 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023282013A1 true JPWO2023282013A1 (https=) | 2023-01-12 |
| JPWO2023282013A5 JPWO2023282013A5 (https=) | 2024-04-05 |
Family
ID=84800220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023533494A Pending JPWO2023282013A1 (https=) | 2021-07-06 | 2022-06-16 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240128169A1 (https=) |
| JP (1) | JPWO2023282013A1 (https=) |
| CN (1) | CN117616567A (https=) |
| WO (1) | WO2023282013A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7678773B2 (ja) * | 2022-02-15 | 2025-05-16 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| WO2024171887A1 (ja) * | 2023-02-17 | 2024-08-22 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| CN121795152A (zh) * | 2023-09-06 | 2026-04-03 | 罗姆股份有限公司 | 半导体装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014179541A (ja) * | 2013-03-15 | 2014-09-25 | Renesas Electronics Corp | 半導体装置およびその製造方法 |
| JP2017147433A (ja) * | 2015-12-16 | 2017-08-24 | ローム株式会社 | 半導体装置 |
| WO2020012958A1 (ja) * | 2018-07-12 | 2020-01-16 | ローム株式会社 | 半導体素子および半導体装置 |
| WO2020136810A1 (ja) * | 2018-12-27 | 2020-07-02 | 三菱電機株式会社 | 半導体装置、半導体装置の製造方法及び電力変換装置 |
-
2022
- 2022-06-16 JP JP2023533494A patent/JPWO2023282013A1/ja active Pending
- 2022-06-16 WO PCT/JP2022/024140 patent/WO2023282013A1/ja not_active Ceased
- 2022-06-16 CN CN202280047968.2A patent/CN117616567A/zh active Pending
-
2023
- 2023-12-08 US US18/533,721 patent/US20240128169A1/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014179541A (ja) * | 2013-03-15 | 2014-09-25 | Renesas Electronics Corp | 半導体装置およびその製造方法 |
| JP2017147433A (ja) * | 2015-12-16 | 2017-08-24 | ローム株式会社 | 半導体装置 |
| WO2020012958A1 (ja) * | 2018-07-12 | 2020-01-16 | ローム株式会社 | 半導体素子および半導体装置 |
| WO2020136810A1 (ja) * | 2018-12-27 | 2020-07-02 | 三菱電機株式会社 | 半導体装置、半導体装置の製造方法及び電力変換装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117616567A (zh) | 2024-02-27 |
| US20240128169A1 (en) | 2024-04-18 |
| WO2023282013A1 (ja) | 2023-01-12 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231019 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250609 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20260407 |