JP2022165243A - 新規不飽和基含有エポキシカルボキシレート化合物、その誘導体、それを含有する感光性樹脂組成物及びその硬化物 - Google Patents
新規不飽和基含有エポキシカルボキシレート化合物、その誘導体、それを含有する感光性樹脂組成物及びその硬化物 Download PDFInfo
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Classifications
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
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- C08G59/4292—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with monocarboxylic acids
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- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
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- C08G59/1466—Acrylic or methacrylic acids
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- C—CHEMISTRY; METALLURGY
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- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C37/00—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring
- C07C37/11—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring by reactions increasing the number of carbon atoms
- C07C37/14—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring by reactions increasing the number of carbon atoms by addition reactions, i.e. reactions involving at least one carbon-to-carbon unsaturated bond
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- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C67/00—Preparation of carboxylic acid esters
- C07C67/08—Preparation of carboxylic acid esters by reacting carboxylic acids or symmetrical anhydrides with the hydroxy or O-metal group of organic compounds
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- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C67/00—Preparation of carboxylic acid esters
- C07C67/24—Preparation of carboxylic acid esters by reacting carboxylic acids or derivatives thereof with a carbon-to-oxygen ether bond, e.g. acetal, tetrahydrofuran
- C07C67/26—Preparation of carboxylic acid esters by reacting carboxylic acids or derivatives thereof with a carbon-to-oxygen ether bond, e.g. acetal, tetrahydrofuran with an oxirane ring
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D301/00—Preparation of oxiranes
- C07D301/27—Condensation of epihalohydrins or halohydrins with compounds containing active hydrogen atoms
- C07D301/28—Condensation of epihalohydrins or halohydrins with compounds containing active hydrogen atoms by reaction with hydroxyl radicals
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
- C07D303/02—Compounds containing oxirane rings
- C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
- C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
- C07D303/20—Ethers with hydroxy compounds containing no oxirane rings
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- C07D303/27—Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds having all hydroxyl radicals etherified with oxirane containing compounds
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- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1494—Polycondensates modified by chemical after-treatment followed by a further chemical treatment thereof
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- C07—ORGANIC CHEMISTRY
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- C07C2601/00—Systems containing only non-condensed rings
- C07C2601/12—Systems containing only non-condensed rings with a six-membered ring
- C07C2601/16—Systems containing only non-condensed rings with a six-membered ring the ring being unsaturated
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- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C2603/00—Systems containing at least three condensed rings
- C07C2603/56—Ring systems containing bridged rings
- C07C2603/58—Ring systems containing bridged rings containing three rings
- C07C2603/60—Ring systems containing bridged rings containing three rings containing at least one ring with less than six members
- C07C2603/66—Ring systems containing bridged rings containing three rings containing at least one ring with less than six members containing five-membered rings
- C07C2603/68—Dicyclopentadienes; Hydrogenated dicyclopentadienes
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- Emergency Medicine (AREA)
- Epoxy Resins (AREA)
- Materials For Photolithography (AREA)
- Polyesters Or Polycarbonates (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021070517A JP2022165243A (ja) | 2021-04-19 | 2021-04-19 | 新規不飽和基含有エポキシカルボキシレート化合物、その誘導体、それを含有する感光性樹脂組成物及びその硬化物 |
| KR1020220044566A KR20220144318A (ko) | 2021-04-19 | 2022-04-11 | 신규 반응성 에폭시카복실레이트 화합물, 그의 유도체, 그것을 함유하는 감광성 수지 조성물 및 그의 경화물 |
| CN202210382271.2A CN115215994A (zh) | 2021-04-19 | 2022-04-12 | 反应性环氧羧酸酯化合物、含不饱和基的多元羧酸化合物、感光性树脂组合物及硬化物 |
| TW111113867A TW202241983A (zh) | 2021-04-19 | 2022-04-12 | 反應性環氧羧酸酯化合物、含不飽和基之多元羧酸化合物、感光性樹脂組成物及硬化物 |
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| JP2021070517A JP2022165243A (ja) | 2021-04-19 | 2021-04-19 | 新規不飽和基含有エポキシカルボキシレート化合物、その誘導体、それを含有する感光性樹脂組成物及びその硬化物 |
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| JP2022165243A true JP2022165243A (ja) | 2022-10-31 |
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| JP2021070517A Pending JP2022165243A (ja) | 2021-04-19 | 2021-04-19 | 新規不飽和基含有エポキシカルボキシレート化合物、その誘導体、それを含有する感光性樹脂組成物及びその硬化物 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2022165243A (ko) |
| KR (1) | KR20220144318A (ko) |
| CN (1) | CN115215994A (ko) |
| TW (1) | TW202241983A (ko) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2931860B2 (ja) | 1992-01-31 | 1999-08-09 | 日石三菱株式会社 | 光硬化性樹脂組成物およびソルダーレジスト用光硬化性樹脂組成物 |
| JP3290296B2 (ja) | 1994-05-13 | 2002-06-10 | 太陽インキ製造株式会社 | 多層プリント配線板及びその製造方法 |
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2021
- 2021-04-19 JP JP2021070517A patent/JP2022165243A/ja active Pending
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- 2022-04-11 KR KR1020220044566A patent/KR20220144318A/ko unknown
- 2022-04-12 CN CN202210382271.2A patent/CN115215994A/zh active Pending
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| Publication number | Publication date |
|---|---|
| TW202241983A (zh) | 2022-11-01 |
| CN115215994A (zh) | 2022-10-21 |
| KR20220144318A (ko) | 2022-10-26 |
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