CN115215994A - 反应性环氧羧酸酯化合物、含不饱和基的多元羧酸化合物、感光性树脂组合物及硬化物 - Google Patents

反应性环氧羧酸酯化合物、含不饱和基的多元羧酸化合物、感光性树脂组合物及硬化物 Download PDF

Info

Publication number
CN115215994A
CN115215994A CN202210382271.2A CN202210382271A CN115215994A CN 115215994 A CN115215994 A CN 115215994A CN 202210382271 A CN202210382271 A CN 202210382271A CN 115215994 A CN115215994 A CN 115215994A
Authority
CN
China
Prior art keywords
compound
epoxy
resin composition
group
formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210382271.2A
Other languages
English (en)
Chinese (zh)
Inventor
加贺大树
水口贵文
川野裕介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kayaku Co Ltd
Original Assignee
Nippon Kayaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Co Ltd filed Critical Nippon Kayaku Co Ltd
Publication of CN115215994A publication Critical patent/CN115215994A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4292—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461—Unsaturated monoacids
    • C08G59/1466—Acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C37/00—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring
    • C07C37/11—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring by reactions increasing the number of carbon atoms
    • C07C37/14—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring by reactions increasing the number of carbon atoms by addition reactions, i.e. reactions involving at least one carbon-to-carbon unsaturated bond
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C67/00—Preparation of carboxylic acid esters
    • C07C67/08—Preparation of carboxylic acid esters by reacting carboxylic acids or symmetrical anhydrides with the hydroxy or O-metal group of organic compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C67/00—Preparation of carboxylic acid esters
    • C07C67/24—Preparation of carboxylic acid esters by reacting carboxylic acids or derivatives thereof with a carbon-to-oxygen ether bond, e.g. acetal, tetrahydrofuran
    • C07C67/26—Preparation of carboxylic acid esters by reacting carboxylic acids or derivatives thereof with a carbon-to-oxygen ether bond, e.g. acetal, tetrahydrofuran with an oxirane ring
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D301/00—Preparation of oxiranes
    • C07D301/27—Condensation of epihalohydrins or halohydrins with compounds containing active hydrogen atoms
    • C07D301/28—Condensation of epihalohydrins or halohydrins with compounds containing active hydrogen atoms by reaction with hydroxyl radicals
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
    • C07D303/20—Ethers with hydroxy compounds containing no oxirane rings
    • C07D303/24—Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds
    • C07D303/27—Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds having all hydroxyl radicals etherified with oxirane containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1494—Polycondensates modified by chemical after-treatment followed by a further chemical treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C2601/00—Systems containing only non-condensed rings
    • C07C2601/12—Systems containing only non-condensed rings with a six-membered ring
    • C07C2601/16—Systems containing only non-condensed rings with a six-membered ring the ring being unsaturated
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C2603/00—Systems containing at least three condensed rings
    • C07C2603/56—Ring systems containing bridged rings
    • C07C2603/58—Ring systems containing bridged rings containing three rings
    • C07C2603/60—Ring systems containing bridged rings containing three rings containing at least one ring with less than six members
    • C07C2603/66—Ring systems containing bridged rings containing three rings containing at least one ring with less than six members containing five-membered rings
    • C07C2603/68—Dicyclopentadienes; Hydrogenated dicyclopentadienes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Emergency Medicine (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
CN202210382271.2A 2021-04-19 2022-04-12 反应性环氧羧酸酯化合物、含不饱和基的多元羧酸化合物、感光性树脂组合物及硬化物 Pending CN115215994A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-070517 2021-04-19
JP2021070517A JP2022165243A (ja) 2021-04-19 2021-04-19 新規不飽和基含有エポキシカルボキシレート化合物、その誘導体、それを含有する感光性樹脂組成物及びその硬化物

Publications (1)

Publication Number Publication Date
CN115215994A true CN115215994A (zh) 2022-10-21

Family

ID=83606160

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210382271.2A Pending CN115215994A (zh) 2021-04-19 2022-04-12 反应性环氧羧酸酯化合物、含不饱和基的多元羧酸化合物、感光性树脂组合物及硬化物

Country Status (4)

Country Link
JP (1) JP2022165243A (ko)
KR (1) KR20220144318A (ko)
CN (1) CN115215994A (ko)
TW (1) TW202241983A (ko)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2931860B2 (ja) 1992-01-31 1999-08-09 日石三菱株式会社 光硬化性樹脂組成物およびソルダーレジスト用光硬化性樹脂組成物
JP3290296B2 (ja) 1994-05-13 2002-06-10 太陽インキ製造株式会社 多層プリント配線板及びその製造方法

Also Published As

Publication number Publication date
JP2022165243A (ja) 2022-10-31
TW202241983A (zh) 2022-11-01
KR20220144318A (ko) 2022-10-26

Similar Documents

Publication Publication Date Title
TWI635109B (zh) 反應性環氧羧酸酯化合物的製造方法、樹脂組成物及其硬化物、物品
CN108373532B (zh) 反应性多元羧酸化合物、活性能量线硬化型树脂组合物、硬化物及物品
TWI770188B (zh) 反應性多元羧酸化合物、使用該化合物之活性能量線硬化型樹脂組成物、該組成物之硬化物及該硬化物之用途
JP5843372B2 (ja) ポリウレタン化合物、それを含有する活性エネルギー線硬化型樹脂組成物及びその用途
JP2009256622A (ja) 難燃性を有する反応性化合物を用いた活性エネルギー線硬化型樹脂組成物並びにその硬化物
TW201619228A (zh) 反應性環氧羧酸酯化合物及含有該化合物之樹脂組成物以及該樹脂組成物之硬化物
WO2003078494A1 (fr) Resines durcissables et compositions de resines durcissables les contenant
JP2022166092A (ja) 反応性ポリカルボン酸化合物、それを用いた活性エネルギー線硬化型樹脂組成物、その硬化物及びその用途
JP5473208B2 (ja) 新規エポキシカルボキシレート化合物、その誘導体、それを含有する活性エネルギー線硬化型樹脂組成物及びその硬化物
TWI422608B (zh) A reactive carboxylic acid ester compound, a hardening type resin composition using the same, and a use thereof
TWI749153B (zh) 聚胺酯化合物、含有該化合物的活性能量線硬化型樹脂組成物及該組成物的用途
TWI576363B (zh) 新穎環氧羧酸酯化合物、其衍生物、含有其的活性能量線硬化型樹脂組成物及其硬化物
TWI821398B (zh) 反應性多羧酸樹脂混合物、使用其之活性能量線硬化型樹脂組成物及其硬化物、以及反應性環氧羧酸酯樹脂混合物
CN115215994A (zh) 反应性环氧羧酸酯化合物、含不饱和基的多元羧酸化合物、感光性树脂组合物及硬化物
CN107641191B (zh) 环氧羧酸酯化合物、多元羧酸化合物、树脂组合物、硬化物及物品
JP7177748B2 (ja) ポリウレタン樹脂、それを含有する活性エネルギー線硬化型樹脂組成物及びその用途
TW201945844A (zh) 硬化性樹脂組成物、乾膜、硬化物，及電子零件
KR20140115988A (ko) 에폭시아크릴레이트 수지, 에폭시아크릴레이트 산무수물 부가체, 경화성 수지 조성물, 알칼리 현상형 감광성 수지 조성물 및 이들의 경화물
JP2018168329A (ja) 硬化性樹脂組成物、ドライフィルム、硬化物、プリント配線板、および、カルボキシル基含有樹脂の製造方法
CN107022062B (zh) 环氧树脂、反应性环氧羧酸酯化合物、反应性多元羧酸化合物、树脂组合物、硬化物、物品
CN105968001B (zh) 含有羧基的反应性化合物、使用该化合物的硬化型树脂组合物及硬化物
JP2024121983A (ja) ポリウレタン化合物、それを含有する活性エネルギー線硬化型樹脂組成物及びその用途
JP2024121984A (ja) ポリウレタン化合物、それを含有する活性エネルギー線硬化型樹脂組成物及びその用途
CN115926162A (zh) 含不饱和基的多元羧酸树脂及其制法、感光性树脂组合物及其硬化物

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination