JP2022157693A5 - - Google Patents

Download PDF

Info

Publication number
JP2022157693A5
JP2022157693A5 JP2021062055A JP2021062055A JP2022157693A5 JP 2022157693 A5 JP2022157693 A5 JP 2022157693A5 JP 2021062055 A JP2021062055 A JP 2021062055A JP 2021062055 A JP2021062055 A JP 2021062055A JP 2022157693 A5 JP2022157693 A5 JP 2022157693A5
Authority
JP
Japan
Prior art keywords
resin layer
polyphenylene ether
melt viscosity
curable resin
curable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021062055A
Other languages
English (en)
Japanese (ja)
Other versions
JP7705267B2 (ja
JP2022157693A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2021062055A external-priority patent/JP7705267B2/ja
Priority to JP2021062055A priority Critical patent/JP7705267B2/ja
Priority to TW111112568A priority patent/TWI862911B/zh
Priority to US18/552,743 priority patent/US12447725B2/en
Priority to KR1020237028278A priority patent/KR20230164007A/ko
Priority to PCT/JP2022/016760 priority patent/WO2022211071A1/ja
Publication of JP2022157693A publication Critical patent/JP2022157693A/ja
Publication of JP2022157693A5 publication Critical patent/JP2022157693A5/ja
Publication of JP7705267B2 publication Critical patent/JP7705267B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2021062055A 2021-03-31 2021-03-31 硬化性樹脂積層体、ドライフィルムおよび硬化物、電子部品 Active JP7705267B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2021062055A JP7705267B2 (ja) 2021-03-31 2021-03-31 硬化性樹脂積層体、ドライフィルムおよび硬化物、電子部品
PCT/JP2022/016760 WO2022211071A1 (ja) 2021-03-31 2022-03-31 硬化性樹脂積層体、ドライフィルム、硬化物及び電子部品
US18/552,743 US12447725B2 (en) 2021-03-31 2022-03-31 Curable resin multilayer body, dry film, cured product and electronic component
KR1020237028278A KR20230164007A (ko) 2021-03-31 2022-03-31 경화성 수지 적층체, 드라이 필름, 경화물 및 전자부품
TW111112568A TWI862911B (zh) 2021-03-31 2022-03-31 硬化性樹脂積層體、乾薄膜、硬化物及電子零件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021062055A JP7705267B2 (ja) 2021-03-31 2021-03-31 硬化性樹脂積層体、ドライフィルムおよび硬化物、電子部品

Publications (3)

Publication Number Publication Date
JP2022157693A JP2022157693A (ja) 2022-10-14
JP2022157693A5 true JP2022157693A5 (enExample) 2024-03-08
JP7705267B2 JP7705267B2 (ja) 2025-07-09

Family

ID=83559975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021062055A Active JP7705267B2 (ja) 2021-03-31 2021-03-31 硬化性樹脂積層体、ドライフィルムおよび硬化物、電子部品

Country Status (1)

Country Link
JP (1) JP7705267B2 (enExample)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11227077A (ja) * 1998-02-13 1999-08-24 Mitsubishi Eng Plast Corp 多層中空体
JP2003017861A (ja) * 2001-06-28 2003-01-17 Kyocera Corp 多層配線基板及びその製造方法
JP4276137B2 (ja) * 2003-08-08 2009-06-10 積水化成品工業株式会社 自動車内装材用発泡シート
JP7418985B2 (ja) * 2018-09-28 2024-01-22 太陽ホールディングス株式会社 硬化性組成物、ドライフィルム、硬化物および電子部品
JP7497143B2 (ja) * 2019-05-31 2024-06-10 太陽ホールディングス株式会社 ポリフェニレンエーテル、硬化性組成物、ドライフィルム、プリプレグ、硬化物および電子部品

Similar Documents

Publication Publication Date Title
JP7201029B2 (ja) エポキシ樹脂組成物、樹脂シート、プリプレグ、樹脂付金属箔、金属基板、及びパワー半導体装置
TWI616334B (zh) 樹脂組成物、以及使用該樹脂組成物而成之樹脂薄片、預浸體、積層板、金屬基板、印刷線路板及功率半導體裝置
TW201936849A (zh) 接著劑組合物、熱硬化性接著片材及印刷配線板
JP2013018991A5 (enExample)
JP2015059170A5 (enExample)
CN103400665B (zh) 一种纳米增强高导热多胶粉云母带及其应用
JP2021138916A5 (enExample)
JPWO2022163569A5 (enExample)
JPWO2022255078A5 (enExample)
JPWO2020116596A5 (enExample)
JP2022157695A5 (enExample)
JP2022157693A5 (enExample)
CN107286325B (zh) 树脂组合物及其应用
JP2018125378A5 (enExample)
WO2016093593A1 (ko) 접착용 수지 조성물, 접착용 필름 및 연성 금속 적층체
JP2022157694A5 (enExample)
TW201912419A (zh) 含纖維之樹脂基板、密封後半導體元件安裝基板、密封後半導體元件形成晶圓、密封後半導體元件安裝薄片、半導體裝置、及半導體裝置的製造方法
TWI628229B (zh) 薄膜用樹脂組成物、絕緣膜及半導體裝置
JP2015010098A (ja) 熱接着シート及び物品
TW201109406A (en) Lamination method of adhesive tape and lead frame
CN105623592A (zh) 一种基于改性环氧树脂的柔性绝缘灌封胶
JP2022158886A5 (enExample)
JP2016138276A (ja) 樹脂組成物、並びにそれを用いた樹脂シート、プリプレグ、積層板、金属基板及びプリント配線板
KR20120044199A (ko) 전자부품용 접착 조성물 및 전자부품용 접착 테이프
KR102141722B1 (ko) 열전도성 시트용 점착제 조성물 및 이로부터 제조된 열전도성 시트