JP2022142782A5 - - Google Patents

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Publication number
JP2022142782A5
JP2022142782A5 JP2022040869A JP2022040869A JP2022142782A5 JP 2022142782 A5 JP2022142782 A5 JP 2022142782A5 JP 2022040869 A JP2022040869 A JP 2022040869A JP 2022040869 A JP2022040869 A JP 2022040869A JP 2022142782 A5 JP2022142782 A5 JP 2022142782A5
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JP
Japan
Prior art keywords
semiconductor
semiconductor device
layer
semiconductor layer
contact layer
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Pending
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JP2022040869A
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English (en)
Japanese (ja)
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JP2022142782A (ja
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Priority claimed from US17/203,293 external-priority patent/US11894489B2/en
Application filed filed Critical
Publication of JP2022142782A publication Critical patent/JP2022142782A/ja
Publication of JP2022142782A5 publication Critical patent/JP2022142782A5/ja
Pending legal-status Critical Current

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JP2022040869A 2021-03-16 2022-03-16 半導体素子、該半導体素子を含む半導体装置及び表示パネル Pending JP2022142782A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/203293 2021-03-16
US17/203,293 US11894489B2 (en) 2021-03-16 2021-03-16 Semiconductor device, semiconductor component and display panel including the same

Publications (2)

Publication Number Publication Date
JP2022142782A JP2022142782A (ja) 2022-09-30
JP2022142782A5 true JP2022142782A5 (enExample) 2025-03-19

Family

ID=83114734

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022040869A Pending JP2022142782A (ja) 2021-03-16 2022-03-16 半導体素子、該半導体素子を含む半導体装置及び表示パネル

Country Status (6)

Country Link
US (2) US11894489B2 (enExample)
JP (1) JP2022142782A (enExample)
KR (1) KR20220129490A (enExample)
CN (1) CN115084182A (enExample)
DE (1) DE102022105994A1 (enExample)
TW (1) TW202239017A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115172557A (zh) * 2022-08-03 2022-10-11 天津三安光电有限公司 发光二极管,发光二极管封装体和发光装置
CN116130572A (zh) * 2023-04-18 2023-05-16 江西兆驰半导体有限公司 发光二极管外延片及其制备方法、发光二极管

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6586762B2 (en) * 2000-07-07 2003-07-01 Nichia Corporation Nitride semiconductor device with improved lifetime and high output power
TWI378573B (en) * 2007-10-31 2012-12-01 Young Lighting Technology Corp Light emitting diode package
US8592847B2 (en) 2011-04-15 2013-11-26 Epistar Corporation Light-emitting device
KR20140146467A (ko) 2013-06-17 2014-12-26 한국전자통신연구원 발광 다이오드 및 그 제조 방법
KR102512027B1 (ko) * 2016-03-08 2023-03-21 엘지이노텍 주식회사 반도체 소자, 표시패널, 표시장치 및 표시패널 제조방법
KR102552655B1 (ko) * 2018-08-10 2023-07-06 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 광원 모듈
KR102616245B1 (ko) * 2018-10-05 2023-12-21 삼성디스플레이 주식회사 디스플레이 장치
JP7603260B2 (ja) * 2019-03-29 2024-12-20 パナソニックIpマネジメント株式会社 光デバイス、光電変換装置、および燃料生成装置
US11152540B2 (en) * 2019-07-29 2021-10-19 Lextar Electronics Corporation Light emitting diode structure and method of manufacturing thereof
TWI715437B (zh) * 2020-02-12 2021-01-01 光鋐科技股份有限公司 紫外光發光二極體及其製造方法
WO2021188920A1 (en) * 2020-03-20 2021-09-23 Sensor Electronic Technology, Inc. Optoelectronic device with reduced optical loss

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