JP2022096298A5 - - Google Patents

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Publication number
JP2022096298A5
JP2022096298A5 JP2020209332A JP2020209332A JP2022096298A5 JP 2022096298 A5 JP2022096298 A5 JP 2022096298A5 JP 2020209332 A JP2020209332 A JP 2020209332A JP 2020209332 A JP2020209332 A JP 2020209332A JP 2022096298 A5 JP2022096298 A5 JP 2022096298A5
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JP
Japan
Prior art keywords
resin particles
group
hollow
monomer
hollow resin
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JP2020209332A
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English (en)
Japanese (ja)
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JP2022096298A (ja
JP7503487B2 (ja
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Priority claimed from JP2020209332A external-priority patent/JP7503487B2/ja
Priority to JP2020209332A priority Critical patent/JP7503487B2/ja
Priority to PCT/JP2021/043435 priority patent/WO2022130938A1/ja
Priority to CN202180084299.1A priority patent/CN116685611B/zh
Priority to KR1020237018450A priority patent/KR102886838B1/ko
Priority to TW110147435A priority patent/TWI864357B/zh
Publication of JP2022096298A publication Critical patent/JP2022096298A/ja
Publication of JP2022096298A5 publication Critical patent/JP2022096298A5/ja
Publication of JP7503487B2 publication Critical patent/JP7503487B2/ja
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JP2020209332A 2020-12-17 2020-12-17 半導体部材用樹脂組成物に用いる中空樹脂粒子 Active JP7503487B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2020209332A JP7503487B2 (ja) 2020-12-17 2020-12-17 半導体部材用樹脂組成物に用いる中空樹脂粒子
PCT/JP2021/043435 WO2022130938A1 (ja) 2020-12-17 2021-11-26 半導体部材用樹脂組成物に用いる中空樹脂粒子
CN202180084299.1A CN116685611B (zh) 2020-12-17 2021-11-26 用于半导体构件用树脂组合物的中空树脂颗粒
KR1020237018450A KR102886838B1 (ko) 2020-12-17 2021-11-26 반도체 부재용 수지 조성물에 사용되는 중공 수지 입자
TW110147435A TWI864357B (zh) 2020-12-17 2021-12-17 用於半導體構件用樹脂組合物之中空樹脂粒子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020209332A JP7503487B2 (ja) 2020-12-17 2020-12-17 半導体部材用樹脂組成物に用いる中空樹脂粒子

Publications (3)

Publication Number Publication Date
JP2022096298A JP2022096298A (ja) 2022-06-29
JP2022096298A5 true JP2022096298A5 (https=) 2023-07-07
JP7503487B2 JP7503487B2 (ja) 2024-06-20

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ID=82059080

Family Applications (1)

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JP2020209332A Active JP7503487B2 (ja) 2020-12-17 2020-12-17 半導体部材用樹脂組成物に用いる中空樹脂粒子

Country Status (5)

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JP (1) JP7503487B2 (https=)
KR (1) KR102886838B1 (https=)
CN (1) CN116685611B (https=)
TW (1) TWI864357B (https=)
WO (1) WO2022130938A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20260027346A (ko) * 2023-09-19 2026-02-27 세키스이가세이힝코교가부시키가이샤 중공 수지 입자, 그 용도, 및 그 제조 방법
WO2025205284A1 (ja) * 2024-03-29 2025-10-02 積水化成品工業株式会社 中空樹脂粒子とその用途
KR20260040251A (ko) * 2024-09-10 2026-03-24 세키스이가세이힝코교가부시키가이샤 중공 수지 입자, 그 제조 방법, 및 그 용도
WO2026058453A1 (ja) * 2024-09-10 2026-03-19 積水化成品工業株式会社 中空樹脂粒子、その製造方法、およびその用途
WO2026058454A1 (ja) * 2024-09-10 2026-03-19 積水化成品工業株式会社 中空樹脂粒子、その製造方法、およびその用途

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5824748A (en) * 1996-06-03 1998-10-20 Minnesota Mining And Manufacturing Company Composite pressure sensitive adhesive microspheres
JP2000313818A (ja) 1999-03-03 2000-11-14 Jsr Corp 架橋樹脂粒子、有機絶縁材用組成物、有機絶縁材、封止材、および回路基板
JP2000311518A (ja) 1999-04-28 2000-11-07 Jsr Corp 有機絶縁材用組成物、有機絶縁材、封止材および回路基板
JP4448930B2 (ja) 2000-09-04 2010-04-14 財団法人新産業創造研究機構 中空高分子微粒子及びその製造法
JP5576752B2 (ja) 2009-09-29 2014-08-20 積水化成品工業株式会社 単中空粒子及びその製造方法
JP5401553B2 (ja) * 2009-09-29 2014-01-29 積水化成品工業株式会社 光拡散用単中空粒子
JP6231030B2 (ja) 2014-09-30 2017-11-15 積水化成品工業株式会社 重合体粒子、重合体粒子の製造方法、及びその用途
WO2018159080A1 (ja) * 2017-03-02 2018-09-07 パナソニックIpマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
KR102537249B1 (ko) * 2017-03-30 2023-05-26 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 가용성 다관능 비닐 방향족 공중합체, 그 제조 방법, 경화성 수지 조성물 및 그 경화물
JP6513273B1 (ja) 2018-08-31 2019-05-15 三井化学株式会社 樹脂粒子
US12031017B2 (en) * 2019-10-29 2024-07-09 Sekisui Kasei Co., Ltd. Hollow resin particle and method for producing same

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