JP2022069368A - 回路基板に接続された電子部品を除去するための方法及び装置 - Google Patents
回路基板に接続された電子部品を除去するための方法及び装置 Download PDFInfo
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- 238000010438 heat treatment Methods 0.000 claims abstract description 31
- 239000000835 fiber Substances 0.000 claims description 5
- 230000002950 deficient Effects 0.000 abstract description 23
- 238000004093 laser heating Methods 0.000 abstract description 2
- 239000007789 gas Substances 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
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- 238000004519 manufacturing process Methods 0.000 description 2
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- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
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- 229910052786 argon Inorganic materials 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
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- 239000007788 liquid Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
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- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
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- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
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Abstract
Description
Claims (15)
- 接触領域(5)において回路基板(6)に接続された電子部品(4x)を除去する方法であって、
a)除去すべき前記電子部品(4x)と、前記電子部品(4x)と前記回路基板(6)との前記接触領域(5)とをレーザビーム(12)により選択的に加熱する工程と、
b)前記回路基板(6)から前記電子部品(4x)を除去する工程と、
を備え、
前記工程b)は、前記電子部品(4x)の近傍に真空吸引ノズル(8)を位置決めして、前記電子部品(4x)を真空吸引により除去する工程を含む、方法。 - 請求項1に記載の方法であって、
前記レーザビーム(12)は、前記真空吸引ノズル(8)を介して前記除去すべき電子部品(4x)に方向付けられる、方法。 - 請求項1又は請求項2に記載の方法であって、さらに、
前記加熱する工程a)の間の温度を制御するために前記工程a)の間の温度を測定する工程を備える、方法。 - 請求項3に記載の方法であって、
前記測定される温度が変化したとき、前記工程a)の加熱を停止する、方法。 - 請求項1から請求項4までのいずれか一項に記載の方法であって、
前記除去すべき電子部品(4x)とその接触領域(5)とをプロセスガスに曝す、方法。 - 請求項1から請求項5までのいずれか一項に記載の方法であって、
前記接触領域(5)には、前記レーザビーム(12)によって加熱されるコンタクトパッドが設けられている、方法。 - 請求項1から請求項6までのいずれか一項に記載の方法であって、
前記除去すべき電子部品(4x)は、回路基板(6)に半田付けされている、方法。 - 請求項1から請求項7までのいずれか一項に記載の方法であって、
前記除去すべき電子部品は、LEDであり、特にマイクロLED(4x)である、方法。 - 請求項1から請求項8までのいずれか一項に記載の方法を実行する装置であって、
レーザビームエミッタ(11)と、
前記回路基板(6)から電子部品(4x)を除去する除去手段(2)と、
前記レーザビームエミッタ(11)から前記レーザビーム(12)を前記除去すべき電子部品(4x)に方向付けて前記除去すべき電子部品(4x)を加熱し、前記除去手段(2)を制御して前記加熱された電子部品(4x)を前記回路基板(6)から除去する制御及び駆動手段(14)と、
を備え、
前記除去手段(2)は、吸引口(10)を有する真空吸引ノズル(8)である、装置。 - 請求項9に記載の装置であって、
前記レーザビームエミッタ(11)からのレーザビーム(12)は、前記真空吸引ノズル(8)及び前記吸引口(10)を介して前記除去すべき電子部品(4x)に方向付けられる、装置。 - 請求項9に記載の装置であって、
前記レーザビームエミッタ(11)は、前記真空吸引ノズル(8)の外側に固定的に取り付けられている、装置。 - 請求項9から請求項11までのいずれか一項に記載の装置であって、さらに、
前記除去すべき電子部品(4x)の温度と前記接触領域(5)の温度とを測定する温度センサ(16)を備え、
前記温度センサ(16)は、前記制御及び駆動手段(14)に接続されている、装置。 - 請求項12に記載の装置であって、
前記温度センサは、IR温度センサ(16)である、装置。 - 請求項13に記載の装置であって、
前記IR温度センサ(16)は、前記除去すべき電子部品(4x)の近傍に終端を有する導光ファイバ(20)を含む、装置。 - 請求項9から請求項14までのいずれか一項に記載の装置であって、
前記制御及び駆動手段(14)は、前記真空吸引ノズル(8)と前記レーザビーム(12)とを平面内に位置決めするよう構成されている、装置。
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JP2021172072A Active JP7277540B2 (ja) | 2020-10-23 | 2021-10-21 | 回路基板に接続された電子部品を除去及び/又は再配置するための方法及び装置 |
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JP (2) | JP7177863B2 (ja) |
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JP2022069419A (ja) * | 2020-10-23 | 2022-05-11 | パック テック-パッケージング テクノロジーズ ゲーエムベーハー | 回路基板に接続された電子部品を除去及び/又は再配置するための方法及び装置 |
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DE102018002714A1 (de) * | 2017-04-18 | 2018-10-18 | Gabriele Trinkel | Memristor Effekt System Netzwerk und Verfahren mit funktionalem Werkstoff |
KR102038521B1 (ko) * | 2017-11-28 | 2019-10-30 | 주식회사 코세스 | 엘이디 기판의 재생 장치 및 방법 |
KR101890934B1 (ko) | 2017-12-01 | 2018-08-22 | 한국광기술원 | 픽셀형 led 공정 |
JP7177863B2 (ja) * | 2020-10-23 | 2022-11-24 | パック テック-パッケージング テクノロジーズ ゲーエムベーハー | 回路基板に接続された電子部品を除去するための方法及び装置 |
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2021
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- 2021-01-08 KR KR1020210002469A patent/KR20220054152A/ko active Application Filing
- 2021-01-26 CN CN202110106068.8A patent/CN114501977A/zh active Pending
- 2021-02-01 US US17/164,159 patent/US20220126398A1/en active Pending
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- 2021-10-21 DE DE102021127347.1A patent/DE102021127347A1/de active Pending
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JP2022069419A (ja) * | 2020-10-23 | 2022-05-11 | パック テック-パッケージング テクノロジーズ ゲーエムベーハー | 回路基板に接続された電子部品を除去及び/又は再配置するための方法及び装置 |
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JP7277540B2 (ja) | 2023-05-19 |
KR20230077713A (ko) | 2023-06-01 |
KR102639422B1 (ko) | 2024-02-21 |
JP2022069419A (ja) | 2022-05-11 |
KR20220054152A (ko) | 2022-05-02 |
JP7177863B2 (ja) | 2022-11-24 |
CN114501978B (zh) | 2024-03-01 |
CN114501977A (zh) | 2022-05-13 |
DE102021127347A1 (de) | 2022-04-28 |
US20220126398A1 (en) | 2022-04-28 |
KR20220054219A (ko) | 2022-05-02 |
CN114501978A (zh) | 2022-05-13 |
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