JP2022060370A - 発光装置 - Google Patents

発光装置 Download PDF

Info

Publication number
JP2022060370A
JP2022060370A JP2022023889A JP2022023889A JP2022060370A JP 2022060370 A JP2022060370 A JP 2022060370A JP 2022023889 A JP2022023889 A JP 2022023889A JP 2022023889 A JP2022023889 A JP 2022023889A JP 2022060370 A JP2022060370 A JP 2022060370A
Authority
JP
Japan
Prior art keywords
adhesive
optical member
light emitting
region
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022023889A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022060370A5 (https=
Inventor
龍也 金澤
Tatsuya Kanazawa
一真 ▲高▼鶴
Ryo Takayasu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Chemical Industries Ltd
Original Assignee
Nichia Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2020171614A external-priority patent/JP7157346B2/ja
Application filed by Nichia Chemical Industries Ltd filed Critical Nichia Chemical Industries Ltd
Publication of JP2022060370A publication Critical patent/JP2022060370A/ja
Publication of JP2022060370A5 publication Critical patent/JP2022060370A5/ja
Priority to JP2024198271A priority Critical patent/JP2025013695A/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H01S5/02234—Resin-filled housings; the housings being made of resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0236—Fixing laser chips on mounts using an adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0239—Combinations of electrical or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4018—Lasers electrically in series

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
JP2022023889A 2019-12-16 2022-02-18 発光装置 Pending JP2022060370A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024198271A JP2025013695A (ja) 2019-12-16 2024-11-13 発光装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019226575 2019-12-16
JP2019226575 2019-12-16
JP2020171614A JP7157346B2 (ja) 2019-12-16 2020-10-12 発光装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2020171614A Division JP7157346B2 (ja) 2019-12-16 2020-10-12 発光装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024198271A Division JP2025013695A (ja) 2019-12-16 2024-11-13 発光装置

Publications (2)

Publication Number Publication Date
JP2022060370A true JP2022060370A (ja) 2022-04-14
JP2022060370A5 JP2022060370A5 (https=) 2023-10-12

Family

ID=76320504

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022023889A Pending JP2022060370A (ja) 2019-12-16 2022-02-18 発光装置
JP2024198271A Pending JP2025013695A (ja) 2019-12-16 2024-11-13 発光装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024198271A Pending JP2025013695A (ja) 2019-12-16 2024-11-13 発光装置

Country Status (2)

Country Link
US (4) US11476637B2 (https=)
JP (2) JP2022060370A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12560309B2 (en) 2023-03-27 2026-02-24 Nichia Corporation Light-emitting device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12394956B2 (en) * 2018-05-11 2025-08-19 Lg Innotek Co., Ltd. Surface emitting laser package having a diffusion part having glass and polymer layers and light emitting device including the same
US11476637B2 (en) * 2019-12-16 2022-10-18 Nichia Corporation Light-emitting device
JP2024042909A (ja) * 2022-09-16 2024-03-29 日亜化学工業株式会社 発光モジュール、配線基板の製造方法、及び、発光モジュールの製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000155251A (ja) * 1998-09-16 2000-06-06 Rohm Co Ltd 部材の結合方法およびこれを用いた光学部品
JP2006190783A (ja) * 2005-01-05 2006-07-20 Sumitomo Electric Ind Ltd 光モジュール、および光モジュールを製造する方法
JP2009290010A (ja) * 2008-05-29 2009-12-10 Pearl Lighting Co Ltd 反射型発光ダイオードの製造方法
JP2013151093A (ja) * 2012-01-24 2013-08-08 Seiko Epson Corp 液体噴射ヘッド及び液体噴射装置
JP2017035992A (ja) * 2015-08-11 2017-02-16 株式会社レニアス 車載窓の取付構造及び方法
US20190103723A1 (en) * 2017-10-02 2019-04-04 Nichia Corporation Light emitting device and optical device

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06124455A (ja) 1992-08-25 1994-05-06 Toshiba Corp 光学装置及び光学装置の組立方法
JPH06331869A (ja) 1993-05-25 1994-12-02 Fuji Film Micro Device Kk 光学装置とその製造方法
JPH08234059A (ja) 1995-02-24 1996-09-13 Hamamatsu Photonics Kk 光モジュール装置
US6354747B1 (en) 1996-08-26 2002-03-12 Sumitomo Electric Industries, Ltd. Optical module
JPH11186609A (ja) 1997-12-25 1999-07-09 Sumitomo Electric Ind Ltd 光モジュール
KR19980042931A (ko) * 1996-11-29 1998-08-17 쿠라우찌 노리타카 광모듈 및 그 제조방법과 광모듈의 광학적반사부재와 그 위치결정방법 및 위치결정장치
JP3779049B2 (ja) 1996-11-29 2006-05-24 住友電気工業株式会社 光モジュールとその製造方法、並びに、光学的反射部材とその位置決め方法及び装置
JPH11176851A (ja) 1997-12-05 1999-07-02 Sony Corp 半導体チップパッケージ
DE19964228B4 (de) * 1998-09-08 2008-11-13 Fujitsu Ltd., Kawasaki Verfahren zur Herstellung eines Reflexionsfilms und Herstellung optischer Vorrichtungen die einen Reflexionsfilm verwenden
US20020020493A1 (en) * 1998-09-16 2002-02-21 Rohm Co., Ltd. Method of coupling members
JP3990090B2 (ja) 2000-03-31 2007-10-10 日本オプネクスト株式会社 光電子装置およびその製造方法
JP2002090587A (ja) 2000-07-07 2002-03-27 Nippon Sheet Glass Co Ltd 光モジュールの製造方法
US6812057B2 (en) 2000-07-07 2004-11-02 Nippon Sheet Glass Co., Ltd. Method of producing an optical module
JP2004289010A (ja) * 2003-03-24 2004-10-14 Sony Corp 発光装置
JP3655916B2 (ja) * 2003-04-04 2005-06-02 新光電気工業株式会社 半導体装置用キャップ
JP2006085003A (ja) 2004-09-17 2006-03-30 Ricoh Co Ltd 半導体装置、並びに、半導体装置のレンズ位置調整方法、半導体装置の組立方法、画像読取ユニット、及び、画像形成装置
JP4765563B2 (ja) 2005-11-07 2011-09-07 セイコーエプソン株式会社 光モジュール
JP5143771B2 (ja) * 2009-03-11 2013-02-13 株式会社日立製作所 熱アシスト磁気ヘッドアセンブリ及び磁気ディスク装置
WO2011074215A1 (ja) * 2009-12-14 2011-06-23 パナソニック株式会社 波長変換レーザ光源、光学素子及び画像表示装置
JP2017032871A (ja) 2015-08-04 2017-02-09 オリンパス株式会社 光学組立体の接着固定方法および光学組立体
JP6648712B2 (ja) 2016-04-28 2020-02-14 日亜化学工業株式会社 発光装置の製造方法
US10439358B2 (en) 2016-04-28 2019-10-08 Nichia Corporation Manufacturing method of light-emitting device
JP2018112302A (ja) * 2017-01-08 2018-07-19 正雄 佐藤 Ｌ型一つ穴式一段ボルト。
JP6504193B2 (ja) 2017-03-30 2019-04-24 日亜化学工業株式会社 発光装置
JP6866843B2 (ja) 2017-12-26 2021-04-28 日亜化学工業株式会社 発光装置の製造方法
US11476637B2 (en) * 2019-12-16 2022-10-18 Nichia Corporation Light-emitting device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000155251A (ja) * 1998-09-16 2000-06-06 Rohm Co Ltd 部材の結合方法およびこれを用いた光学部品
JP2006190783A (ja) * 2005-01-05 2006-07-20 Sumitomo Electric Ind Ltd 光モジュール、および光モジュールを製造する方法
JP2009290010A (ja) * 2008-05-29 2009-12-10 Pearl Lighting Co Ltd 反射型発光ダイオードの製造方法
JP2013151093A (ja) * 2012-01-24 2013-08-08 Seiko Epson Corp 液体噴射ヘッド及び液体噴射装置
JP2017035992A (ja) * 2015-08-11 2017-02-16 株式会社レニアス 車載窓の取付構造及び方法
US20190103723A1 (en) * 2017-10-02 2019-04-04 Nichia Corporation Light emitting device and optical device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12560309B2 (en) 2023-03-27 2026-02-24 Nichia Corporation Light-emitting device

Also Published As

Publication number Publication date
US11476637B2 (en) 2022-10-18
JP2025013695A (ja) 2025-01-24
US20210184423A1 (en) 2021-06-17
US20230006415A1 (en) 2023-01-05
US12166330B2 (en) 2024-12-10
US11811190B2 (en) 2023-11-07
US20240014627A1 (en) 2024-01-11
US20250055252A1 (en) 2025-02-13

Similar Documents

Publication Publication Date Title
JP7761860B2 (ja) 発光装置
JP7518459B2 (ja) 発光装置、及び、基部
JP2022060370A (ja) 発光装置
JP7157346B2 (ja) 発光装置
TWI802700B (zh) 發光裝置
JP7152689B2 (ja) 発光装置
JP7698227B2 (ja) 発光装置
JP7701653B2 (ja) 発光装置
JP7791418B2 (ja) 発光装置の製造方法、発光装置
JP7319517B2 (ja) 発光装置、パッケージ、及び、基部
JP7381905B2 (ja) 発光装置、及び、発光装置の製造方法
US20250105585A1 (en) Plurality of light-emitting devices and manufacturing method of a plurality of light-emitting devices
JP2026022109A (ja) 発光装置
TW202520593A (zh) 發光裝置及發光模組
CN118630001A (zh) 发光装置
CN120604409A (zh) 发光装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231003

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231003

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240326

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20240426

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20240820