JP2022039889A - 多層基板表面処理層構造及びその製造方法 - Google Patents
多層基板表面処理層構造及びその製造方法 Download PDFInfo
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- 239000002335 surface treatment layer Substances 0.000 title claims abstract description 78
- 238000004519 manufacturing process Methods 0.000 title claims description 50
- 239000010410 layer Substances 0.000 claims abstract description 736
- 229910052751 metal Inorganic materials 0.000 claims abstract description 226
- 239000002184 metal Substances 0.000 claims abstract description 226
- 230000001681 protective effect Effects 0.000 claims abstract description 223
- 239000000758 substrate Substances 0.000 claims abstract description 94
- 229910000679 solder Inorganic materials 0.000 claims abstract description 75
- 238000000034 method Methods 0.000 claims description 75
- 229920002120 photoresistant polymer Polymers 0.000 claims description 50
- 239000000463 material Substances 0.000 claims description 46
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 28
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 28
- 238000009713 electroplating Methods 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 14
- 239000004642 Polyimide Substances 0.000 claims description 14
- 229910052804 chromium Inorganic materials 0.000 claims description 14
- 239000011651 chromium Substances 0.000 claims description 14
- 238000007772 electroless plating Methods 0.000 claims description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 14
- 229910052737 gold Inorganic materials 0.000 claims description 14
- 239000010931 gold Substances 0.000 claims description 14
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- 229910052763 palladium Inorganic materials 0.000 claims description 14
- 229920001721 polyimide Polymers 0.000 claims description 14
- 238000005240 physical vapour deposition Methods 0.000 claims description 11
- 238000000059 patterning Methods 0.000 claims description 10
- 239000011148 porous material Substances 0.000 claims 3
- 238000003466 welding Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 46
- 238000001020 plasma etching Methods 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 230000004907 flux Effects 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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Abstract
Description
100、300、400、500、600、800、900、1000 誘電体層
102 導電性シード層
104、302、402、502、602、802、902、1002、1102、1202 パッド層
106、304、404、504、604、804、904、1004、1104、1204 保護金属層
108、306、406、506、806、906、1106、1206 ソルダーレジスト層
110、822、922、1022、1122、1222 凹溝
308、408、508、808、908、1108 開孔
820、920、1220 フォトレジスト層
1100、1200 感光性誘電体層
1130、1230 基板
S70~S76 ステップ
Claims (40)
- 誘電体層と、
該誘電体層に形成されるか又は一部が該誘電体層に内嵌される少なくとも1つのパッド層と、
該少なくとも1つのパッド層に形成されて該パッド層と接合され、主に該少なくとも1つのパッド層の上面のみを被覆し、外部素子と溶接又は接触する領域とする少なくとも1つの保護金属層と、
該誘電体層に形成されて該少なくとも1つの保護金属層を露出するために少なくとも1つの開孔を有するソルダーレジスト層と、を含む多層基板表面処理層構造。 - 該ソルダーレジスト層が該少なくとも1つの保護金属層の上面の一部を被覆する請求項1に記載の構造。
- 該少なくとも1つの開孔の面積が該少なくとも1つの保護金属層の面積と等しい又はより広い請求項1に記載の構造。
- 該ソルダーレジスト層の上面が該少なくとも1つのパッド層の該上面よりも低い請求項1に記載の構造。
- 該ソルダーレジスト層の上面が該少なくとも1つの保護金属層の上面よりも低く且つ該少なくとも1つのパッド層の該上面よりも高い請求項1に記載の構造。
- 該誘電体層の材質がポリイミドである請求項1に記載の構造。
- 該少なくとも1つのパッド層の材質が銅である請求項1に記載の構造。
- 該少なくとも1つの保護金属層の材質がクロム、ニッケル、パラジウム及び金からなる群から選ばれる1つである請求項1に記載の構造。
- 下から上に積層されてなる複数のパッド層を含み、該ソルダーレジスト層の上面がこれらのパッド層の該上面よりも低い請求項1に記載の構造。
- 誘電体層と、
該誘電体層に内嵌される少なくとも1つのパッド層と、
該少なくとも1つのパッド層に形成されて該パッド層と接合され、主に該少なくとも1つのパッド層の上面のみを被覆し、外部素子と溶接又は接触する領域とし、該誘電体層にも内嵌される少なくとも1つの保護金属層と、を含む多層基板表面処理層構造。 - 該誘電体層に形成されて該少なくとも1つの保護金属層を露出するために開孔を有するソルダーレジスト層をさらに含む請求項10に記載の構造。
- 該誘電体層の材質がポリイミドである請求項10に記載の構造。
- 該少なくとも1つのパッド層の材質が銅である請求項10に記載の構造。
- 該少なくとも1つの保護金属層の材質がクロム、ニッケル、パラジウム及び金からなる群から選ばれる1つである請求項10に記載の構造。
- 誘電体層を提供するステップと、
該誘電体層に少なくとも1つのパッド層を形成するステップと、
該少なくとも1つのパッド層に少なくとも1つの保護金属層を形成するステップであって、該少なくとも1つの保護金属層が主に該少なくとも1つのパッド層の上面のみを被覆し、該少なくとも1つの保護金属層は外部素子と溶接又は接触する領域とするステップと、
該誘電体層にソルダーレジスト層を形成するステップであって、該ソルダーレジスト層が該少なくとも1つの保護金属層を露出するために少なくとも1つの開孔を有するステップと、を含む多層基板表面処理層構造の製造方法。 - 該誘電体層に該少なくとも1つのパッド層を形成するステップは、
該誘電体層にフォトレジスト層を形成することと、
該フォトレジスト層をパターン化し、該フォトレジスト層に少なくとも1つの凹溝を形成することと、該少なくとも1つの凹溝に該少なくとも1つのパッド層を形成することと、を含み、
該少なくとも1つのパッド層に該少なくとも1つの保護金属層を形成するステップは、
該少なくとも1つのパッド層に少なくとも1つの保護金属層を形成することと、
該フォトレジスト層を除去することと、を含む請求項15に記載の方法。 - 該フォトレジスト層をパターン化し、該フォトレジスト層に該少なくとも1つの凹溝を形成するステップの後に、
該少なくとも1つのパッド層の一部を該誘電体層に形成させるように、該少なくとも1つの凹溝の下方の該誘電体層の一部又は全部を除去するステップをさらに含む請求項16に記載の方法。 - 該誘電体層に該少なくとも1つのパッド層を形成するステップは、
該誘電体層に少なくとも1つの凹溝を形成することと、
該少なくとも1つの凹溝を形成した誘電体層にフォトレジスト層を形成することと、
該フォトレジスト層をパターン化して、該誘電体層の凹溝の上方のフォトレジストを除去することと、
該誘電体層及び該フォトレジスト層により形成された凹溝に少なくとも1つのパッド層を形成することと、を含み、
該少なくとも1つのパッド層に該少なくとも1つの保護金属層を形成するステップは、
該少なくとも1つのパッド層に少なくとも1つの保護金属層を形成することと、
該フォトレジスト層を除去することと、を含む請求項15に記載の方法。 - 該少なくとも1つのパッド層及び該少なくとも1つの保護金属層が電解めっき、無電解めっき又は物理気相成長法により形成される請求項15に記載の方法。
- 該誘電体層に該ソルダーレジスト層を形成するステップは、
該誘電体層及び該少なくとも1つの保護金属層に該ソルダーレジスト層を形成することであって、該ソルダーレジスト層が該誘電体層及び該少なくとも1つの保護金属層を被覆することと、
該ソルダーレジスト層に該少なくとも1つの保護金属層を露出させるように、該ソルダーレジスト層に該少なくとも1つの開孔を形成することと、を含む請求項15に記載の方法。 - 該ソルダーレジスト層が該少なくとも1つの保護金属層の上面の一部を被覆する請求項15に記載の方法。
- 該少なくとも1つの開孔の面積が該少なくとも1つの保護金属層の面積と等しい又はより広い請求項15に記載の方法。
- 該ソルダーレジスト層の上面が該少なくとも1つのパッド層の該上面よりも低い請求項15に記載の方法。
- 該ソルダーレジスト層の上面が該少なくとも1つの保護金属層の上面よりも低く且つ該少なくとも1つのパッド層の該上面よりも高い請求項15に記載の方法。
- 該誘電体層の材質がポリイミドである請求項15に記載の方法。
- 該少なくとも1つのパッド層の材質が銅である請求項15に記載の方法。
- 該少なくとも1つの保護金属層の材質がクロム、ニッケル、パラジウム及び金からなる群から選ばれる1つである請求項15に記載の方法。
- 該誘電体層に該少なくとも1つのパッド層を形成するステップは、
該誘電体層に下から上に積層されてなる複数のパッド層を形成することであって、該ソルダーレジスト層の上面がこれらのパッド層の上面よりも低いことを含む請求項15に記載の方法。 - 誘電体層を提供するステップと、
該誘電体層に少なくとも1つの凹溝を形成するステップと、
該少なくとも1つの凹溝にパッド層を形成するステップであって、該パッド層が該誘電体層に内嵌されるステップと、
該少なくとも1つのパッド層に少なくとも1つの保護金属層を形成するステップであって、該少なくとも1つの保護金属層が主に該少なくとも1つのパッド層の上面のみを被覆し、該少なくとも1つの保護金属層は外部素子と溶接又は接触する領域とし、該少なくとも1つの保護金属層が該誘電体層にも内嵌されるステップと、を含む多層基板表面処理層構造の製造方法。 - 該少なくとも1つの保護金属層を形成するステップの後に、
該誘電体層にソルダーレジスト層を形成するステップであって、該ソルダーレジスト層が該少なくとも1つの保護金属層を露出するために少なくとも1つの開孔を有するステップをさらに含む請求項29に記載の方法。 - 該誘電体層の材質がポリイミドである請求項29に記載の方法。
- 該少なくとも1つのパッド層の材質が銅である請求項29に記載の方法。
- 該少なくとも1つの保護金属層の材質がクロム、ニッケル、パラジウム及び金からなる群から選ばれる1つである請求項29に記載の方法。
- 基板を提供するステップと、
該基板に感光性誘電体層を形成するステップと、
該感光性誘電体層をパターン化し、該感光性誘電体層に少なくとも1つの凹溝を形成するステップと、
該少なくとも1つの凹溝に少なくとも1つのパッド層を形成するステップと、
該パッド層に少なくとも1つの保護金属層を形成するステップであって、該少なくとも1つの保護金属層が主に該少なくとも1つのパッド層の上面のみを被覆し、該少なくとも1つの保護金属層は外部素子と溶接又は接触する領域とするステップと、を含む多層基板表面処理層構造の製造方法。 - 該感光性誘電体層に該少なくとも1つの凹溝を形成するステップの後に、
該感光性誘電体層にフォトレジスト層を形成するステップと、
該フォトレジスト層をパターン化して、該感光性誘電体層の該凹溝の上方のフォトレジストを除去するステップと、をさらに含み、
該少なくとも1つの凹溝に該少なくとも1つのパッド層を形成するステップは、
該感光性誘電体層及び該フォトレジスト層により形成された少なくとも1つの凹溝において、該少なくとも1つのパッド層に少なくとも別のパッド層を形成することであって、該少なくとも別のパッド層の上面が該感光性誘電体層の上面よりも高いことを含み、
該パッド層に該少なくとも1つの保護金属層を形成するステップは、
該別のパッド層に少なくとも1つの保護金属層を形成することと、
該フォトレジスト層を除去することと、を含む請求項34に記載の方法。 - 該少なくとも1つの保護金属層を形成するステップの後に、
該感光性誘電体層にソルダーレジスト層を形成するステップであって、該ソルダーレジスト層が該少なくとも1つの保護金属層を露出するために少なくとも1つの開孔を有するステップをさらに含む請求項34に記載の方法。 - 該少なくとも1つのパッド層及び該少なくとも1つの保護金属層が電解めっき、無電解めっき又は物理気相成長法により形成される請求項34に記載の方法。
- 該感光性誘電体層の主な材質がポリイミドである請求項34に記載の方法。
- 該少なくとも1つのパッド層の材質が銅である請求項34に記載の方法。
- 該少なくとも1つの保護金属層の材質がクロム、ニッケル、パラジウム及び金からなる群から選ばれる1つである請求項34に記載の方法。
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JP2004063929A (ja) * | 2002-07-31 | 2004-02-26 | Kyocera Corp | 配線基板およびこれを用いた電子装置 |
JP2006093271A (ja) * | 2004-09-22 | 2006-04-06 | Toppan Printing Co Ltd | 配線基板の製造方法 |
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