JP2022034907A - Board processing device and board transfer method - Google Patents

Abstract

To provide a board processing device and a board transfer method that suppress deterioration of a structure provided at an opening.SOLUTION: A board processing device includes a board loading/unloading module that has an internal space controlled by the atmospheric pressure environment when the board is carried out to an external space controlled by positive pressure rather than atmospheric pressure, an opening 42 provided in the board loading/unloading module and communicating the internal space and the external space, a gate valve 5 provided at the opening and having a transport space, an ejection portion 61 that ejects purge gas from the external space side toward the edge of the opening, and an exhaust port that exhausts the transport space by a route different from the opening.SELECTED DRAWING: Figure 6

Description

The present disclosure relates to a substrate processing apparatus and a substrate transport method.

In the substrate processing apparatus, a structure such as a gate valve is provided in the opening through which the substrate passes when the substrate is carried out (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2019-220588

The present disclosure provides a technique for suppressing deterioration of a structure provided in an opening.

The substrate processing apparatus according to one aspect of the present disclosure includes a substrate loading / unloading module having an internal space controlled by the atmospheric pressure environment and passing through the substrate when the substrate is carried out to an external space controlled to a positive pressure rather than an atmospheric pressure. An opening provided in the substrate loading / unloading module that communicates between the internal space and the external space, a gate valve provided in the opening and having a transport space, and a purge gas from the external space side toward the edge of the opening. It is provided with an ejection portion for ejecting the space and an exhaust port for exhausting the transport space by a route different from the opening.

According to the present disclosure, deterioration of the structure provided in the opening can be suppressed.

FIG. 1 is a diagram showing an example of a schematic configuration of a substrate processing apparatus 1 according to an embodiment. FIG. 2 is a diagram showing an example of a schematic configuration of the load lock chamber 4. FIG. 3 is a diagram showing an example of a schematic configuration of the load lock chamber 4 and the gate valve 5. FIG. 4 is a diagram showing an example of a schematic configuration of the load lock chamber 4 and the gate valve 5. FIG. 5 is a diagram schematically showing a schematic configuration of a substrate G, a gate valve 5, and a load lock chamber 4. FIG. 6 is a diagram showing an example of a schematic configuration of the load lock panel 6. FIG. 7 is a diagram showing an example of a schematic configuration of the load lock panel 6. FIG. 8 is a diagram schematically showing the flow of the ejected purge gas. FIG. 9 is a diagram schematically showing the flow of the ejected purge gas. FIG. 10 is a diagram showing an example of a schematic configuration of the nozzle 61. FIG. 11 is a view of the load lock panel 6 viewed from the load lock chamber 4 side. FIG. 12 is a diagram schematically showing the flow of exhaust gas. FIG. 13 is a diagram schematically showing the flow of exhaust gas. FIG. 14 is a diagram schematically showing the flow of exhaust gas. FIG. 15 is a diagram schematically showing the flow of exhaust gas. FIG. 16 is a diagram schematically showing the flow of exhaust gas. FIG. 17 is a diagram schematically showing the flow of exhaust gas. FIG. 18 is a flowchart showing an example of a process (board transfer method) executed in the board processing device 1. FIG. 19 is a diagram showing an example of a schematic configuration of a load lock chamber 4, a gate valve 5, a nozzle 61, and an exhaust pipe 64A.

Hereinafter, embodiments of the substrate processing apparatus and the substrate transport method disclosed in the present application will be described in detail with reference to the drawings. It should be noted that the present embodiment does not limit the disclosed substrate processing apparatus and substrate transport method.

In the substrate processing apparatus, when the treated substrate is carried out to the outside, the processing gas adhering to the substrate adheres to the structure provided in the opening for carrying out the substrate, and corrosion occurs. It may deteriorate. Therefore, a technique for suppressing deterioration of the structure provided in the opening for carrying out the substrate is expected.

FIG. 1 is a diagram showing an example of a schematic configuration of a substrate processing apparatus 1 according to an embodiment. In the figure, the XYZ coordinate system is shown. The X-axis direction and the Y-axis direction correspond to the left-right direction and the front-back direction of the board processing apparatus when the side having the opening for carrying out the board is the front. The Z-axis direction corresponds to the vertical direction (height direction) of the horizontally arranged substrate processing apparatus, that is, the vertical direction.

The substrate processing apparatus 1 includes a process chamber 2, a transfer chamber 3, a load lock chamber 4, a gate valve 5, a load lock panel 6, and a control unit 7. In FIG. 1, the load lock panel 6 is shown in a state of being removed from the gate valve 5. The control unit 7 is illustrated by a functional block. The load lock chamber 4 of the substrate processing apparatus 1 is configured to be connectable to the loader 8 on the side opposite to the transport chamber 3. The loader 8 may not be a component of the board processing device 1 or may be a component of the board processing device 1.

In the substrate processing apparatus 1, each of the process chamber 2, the transfer chamber 3, and the load lock chamber 4 has an internal space for accommodating the substrate. Adjacent internal spaces communicate with each other through an opening. A structure for opening and closing is provided at the opening. An example of an opening / closing structure is a gate valve, one of which is illustrated as a gate valve 5. By closing the opening to make the internal space airtight, it is possible to control the internal spaces to different atmospheric pressure environments. Examples of controllable barometric environments are atmospheric and depressurized environments. The depressurized environment is an environment in which the pressure is lower than the atmospheric pressure environment (for example, a vacuum pressure environment).

Hereinafter, the components of the substrate processing apparatus 1 will be described in order. The substrate to be processed by the substrate processing apparatus 1 is shown as the substrate G in FIG. 5 described later, and is therefore referred to as the substrate G below.

The process chamber 2 is a portion (module) for processing the substrate G. The process chamber 2 is exemplified as a plurality of process chambers 21 to 23 capable of performing processing on the substrate G. The processes applied to the substrate G in the process chambers 21 to 23 may be the same process or different processes. An example of the substrate G is a glass substrate for an FPD (Flat Panel Display). Examples of FPDs are liquid crystal displays, organic EL displays and the like. Another example of the substrate G is a sheet or film made of a bendable material made of a synthetic resin such as polyimide. An example of substrate processing is plasma processing. Examples of plasma treatment are plasma treatments such as etching treatment, ashing treatment, and film formation treatment. Various processing gases are used in substrate processing. Examples of the treatment gas are a chlorine-based gas containing a chlorine atom and a fluorine-based gas containing a fluorine atom. Such a processing gas can be, for example, a corrosive gas for some components of the substrate processing apparatus 1. In particular, its corrosiveness becomes more pronounced when mixed with a moist atmosphere.

The transfer chamber 3 is a portion (module) for transporting the substrate G between the process chamber 2 and the load lock chamber 4. The substrate G is conveyed by, for example, a vacuum robot. Although not shown, the transfer chamber 3 has a transfer robot having a two-stage configuration, and transfers the processed substrate G to the process chamber 2 while carrying out and holding the processed substrate G from the process chamber 2. ..

The load lock chamber 4 is a substrate loading / unloading module that mediates the transport of the substrate G between the transport chamber 3 and the external space by temporarily holding the substrate G in a buffer (not shown) installed inside. In this example, the space of the loader 8 corresponds to the external space, and the load lock chamber 4 carries in and out the substrate G with and from the loader 8. Carrying in the board G includes taking (carrying in) the board G (unprocessed board) before being processed in the process chamber 2 from the loader 8 into the internal space of the load lock chamber 4. Carrying out the substrate G includes taking out (unloading) the processed substrate G (processed substrate) in the process chamber 2 from the load lock chamber 4 to the loader 8. Since the transfer robot has a two-stage configuration as described above, the load lock chamber 4 also has a two-stage configuration. The load lock chamber 4 will be described with reference to FIG.

FIG. 2 is a diagram showing an example of a schematic configuration of the load lock chamber 4. The load lock chamber 4 includes a main body 41 and an opening 42. The main body 41 defines the internal space S. The opening 42 communicates the internal space S with the external space, that is, the loader 8. When the substrate G passes through the internal space S and is carried out to the loader 8, the internal space S is controlled to atmospheric pressure, and the loader 8 is controlled to have a positive pressure rather than atmospheric pressure. The control is performed by the control unit 7 described later.

The internal space S includes an internal space SU (upper internal space) and an internal space SL (lower internal space) separated from each other. Correspondingly, the opening 42 includes the opening 42U and the opening 42L.

The opening 42U communicates the internal space SU and the loader 8. Of the openings 42U, an edge extending in the vertical direction (Z-axis direction) is referred to as an edge portion 421U and is shown in the drawing. The edge portion 421U is a pair of edge portions located on the left and right sides of the opening portion 42U. Of the openings 42U, an edge extending in the left-right direction (X-axis direction) is referred to as an edge portion 422U and is shown in the drawing. The edge portion 422U is a pair of edge portions located above and below the opening portion 42U.

The opening 42L communicates the internal space SL with the loader 8. Of the openings 42L, an edge extending in the vertical direction (Z-axis direction) is referred to as an edge portion 421L and is shown in the drawing. The edge portion 421L is a pair of edge portions located on the left and right sides of the opening portion 42L. Of the openings 42L, the edges extending in the left-right direction (X-axis direction) are referred to as edge portions 422L and are shown in the drawing. The edge portion 422L is a pair of edge portions located above and below the opening portion 42L.

Returning to FIG. 1, the gate valve 5 is provided for the opening of the load lock chamber 4 on the side opposite to the transport chamber 3 with the load lock chamber 4 interposed therebetween, that is, on the loader 8 side. The gate valve 5 provided for the load lock chamber 4 in this way will be further described with reference to FIGS. 3 and 4.

3 and 4 are views showing an example of a schematic configuration of the load lock chamber 4 and the gate valve 5. FIG. 3 is a half cross-sectional view. The white arrows in FIG. 4 schematically indicate the opening / closing direction of the gate.

The main body 41 of the load lock chamber 4 is illustrated as a wall portion that defines the upper and lower surfaces and side surfaces of the internal space S. Some wall portions are labeled and are illustrated as an upper wall 411, an intermediate wall 412 and a lower wall 413. The upper wall 411 defines the upper surface of the internal space SU in the internal space S. The intermediate wall 412 defines the lower surface of the internal space SU and the upper surface of the internal space SL in the internal space S. The lower wall 413 defines the lower surface of the internal space SL in the internal space S.

The gate valve 5 is provided in the opening 42. More specifically, the gate valve 5 includes a gate valve 5U, a gate valve 5L, and a partition wall 56. The gate valve 5U is an upper gate valve corresponding to the opening 42U. The opening of the gate valve 5U communicates with the opening 42U when the gate valve 5U is opened. The opening of the gate valve 5U may define an upper transfer space between the load lock chamber 4 and the load lock panel 6 that is continuous with the internal space SU and communicates with the inside of the loader 8. The gate valve 5L is a lower gate valve corresponding to the opening 42L. When the gate valve 5L is opened, its opening communicates with the opening 42L. The opening of the gate valve 5L may define a lower transport space between the load lock chamber 4 and the load lock panel 6 that is continuous with the internal space SL and communicates with the inside of the loader 8. The partition wall 56 is provided between the gate valve 5U and the gate valve 5L in connection with the intermediate wall 412 of the load lock chamber 4. The partition wall 56 may define a part of the upper transport space and the lower transport space. Hereinafter, the upper transport space and the lower transport space are collectively referred to as a transport space.

The gate valve 5U includes a gate cover 51U, a valve body 52U, an air cylinder 53U, a guide block 54U, and a guide rail 55U. The gate cover 51U moves up and down together with the valve body 52U provided inside the gate cover 51U. The gate cover 51U moves along the edge portion 421U of the opening 42U of the load lock chamber 4 as the valve body 52U moves up and down. The valve body 52U moves up and down in conjunction with the air cylinder 53U. The air cylinder 53U is, for example, an actuator configured to be able to control the movement in the vertical direction. Further, the valve body 52U is slidably connected to the guide rail 55U via the guide block 54U. The guide rail 55U guides the moving direction of the valve body 52U. The guide rails 55U are a pair of guide rails provided at the edge portion 421U of the opening 42U, and extend in the vertical direction. By moving the valve body 52U along the guide rail 55U, the vertical movement of the valve body 52U is stabilized. Since the guide rail 55U is also a portion that supports the movement of the valve body 52U, higher strength than other portions is required. An example of the material of the guide rail 55U for imparting such high strength is SUS440C.

The gate valve 5L includes a gate cover 51L, a valve body 52L, an air cylinder 53L, a guide block 54L, and a guide rail 55L. Since these elements are the same as the corresponding parts of the gate valve 5U, the description thereof will be omitted. The guide rail 55U and the guide rail 55L are collectively referred to as a guide rail 55 (see FIG. 6 described later).

FIG. 5 is a diagram schematically showing a schematic configuration of a substrate G, a gate valve 5, and a load lock chamber 4. The load lock panel 6 is not shown. The white arrows extending in the horizontal direction (Y-axis direction) schematically indicate the moving direction of the substrate G. The white arrow extending in the vertical direction (Z-axis direction) schematically indicates the opening / closing direction of the gate valve 5. For example, when the valve body 52U moves upward and the opening 42U is open, the substrate G supported by the arm A is carried from the loader 8 into the internal space SU via the upper transport space. Further, the substrate G is carried out from the internal space SU to the loader 8 via the upper transport space. The same can be said for the valve body 52L. In the load lock chamber 4 and the gate valve 5, the seal member for improving the airtightness is shown by a black circle.

Returning to FIG. 1, the load lock panel 6 is attached to the gate valve 5. The details of the load lock panel 6 will be described later with reference to FIGS. 6 and later.

The control unit 7 controls the operation of each unit of the substrate processing device 1. The control unit 7 includes a controller 71, a user interface 72, a storage unit 73, and the like. The controller 71 includes a CPU, and controls the operation of, for example, the process chamber 2, the transfer chamber 3, the load lock chamber 4, the gate valve 5, and the nozzle 61 (described later) attached to the load lock panel 6. The user interface 72 has, for example, a keyboard on which a process manager performs a command input operation for managing the board processing device 1, and a display that visualizes and displays the operating status of the board processing device 1. The storage unit 73 stores a recipe in which a control program (software) for realizing various processes executed by the substrate processing device 1 under the control of the controller 71, processing condition data, and the like are recorded. The user interface 72 and the storage unit 73 are connected to the controller 71. Then, if necessary, an arbitrary recipe is called from the storage unit 73 by an instruction from the user interface 72 or the like and executed by the controller 71, so that the desired recipe in the board processing device 1 can be executed under the control of the controller 71. Processing is done. As the recipes such as the control program and the processing condition data, those stored in a computer-readable recording medium such as a CD-ROM, a hard disk, a flexible disk, or a flash memory can be used. It is also possible to transmit from another device at any time via a dedicated line, for example, and use it online.

The loader 8 is a portion (module) for loading and unloading the substrate G to and from the load lock chamber 4. The loader 8 includes, for example, an indexer and a pair of cassettes arranged on the indexer and accommodating the substrate G. In the cassette, the substrates G are arranged in multiple stages with an interval at the top and bottom. For example, one cassette contains an unprocessed substrate and the other cassette contains a processed substrate.

Among the operations of the substrate processing apparatus 1 described above, the outline of the operation relating to the transfer of the substrate G will be described. The gate valve 5 opens, and the substrate G is carried from the loader 8 into the load lock chamber 4. The gate valve 5 is closed, and the load lock chamber 4 is controlled from atmospheric pressure to a reduced pressure environment. The substrate G carried into the load lock chamber 4 is conveyed to the process chamber 2 via the transfer chamber 3. The transfer chamber 3 and the process chamber 2 are also controlled in a reduced pressure environment. When the substrate G is transferred from the load lock chamber 4 to the transport chamber 3, the load lock chamber 4 and the transport chamber 3 are controlled to a reduced pressure environment of the same degree. In the process chamber 2, the substrate G is processed using the processing gas. After the processing is completed, the substrate G is transported to the load lock chamber 4 via the transport chamber 3. After the load lock chamber 4 is boosted to atmospheric pressure, the gate valve 5 opens and the substrate G is carried out from the load lock chamber 4 to the loader 8.

Here, when the substrate G (processed substrate) processed in the process chamber 2 is carried out to the loader 8 through the transfer chamber 3 and the load lock chamber 4, the load lock chamber 4 is pressure-boosted controlled to atmospheric pressure. , The loader 8 is controlled to have a positive pressure rather than an atmospheric pressure. Therefore, an air flow from the loader 8 to the load lock chamber 4 is generated. Further, the processing gas is attached to the substrate G (processed substrate). Therefore, the processing gas adhering to the carried-out substrate G diffuses from the loader 8 toward the load lock chamber 4, and rides on the airflow to be provided at the edge of the opening 42 of the load lock chamber 4. It hits and adheres to an object (for example, the guide rail 55 of the gate valve 5). Since the structure provided at the edge of the opening 42 is also exposed to the atmosphere, there is a possibility of corrosion (deterioration) due to the reaction between the components of the processing gas and the moisture in the atmosphere.

In order to suppress the adhesion of the processing gas to the structure provided at the edge of the opening 42 (that is, deterioration of the structure), in the substrate processing apparatus 1 according to the embodiment, the edge of the opening 42 is from the loader 8 side. Gas is ejected toward the part. Examples of the ejection means (spouting portion) are a nozzle that blows the purge gas supplied from the purge gas supply line as a gas, a fan that blows the surrounding gas from the loader 8 side, and the like. In the following, an example in which the ejection portion is a nozzle will be described. An example of a means for realizing purge gas ejection by a nozzle is a load lock panel 6. The load lock panel 6 is configured, for example, by incorporating a nozzle or the like into a partition between the load lock chamber 4 and the external space.

6 and 7 are views showing an example of a schematic configuration of the load lock panel 6. FIG. 6 is an exploded perspective view of the load lock chamber 4, the gate valve 5, and the load lock panel 6. FIG. 7 is a view of the load lock panel 6 from the loader 8 side. The load lock panel 6 is provided on the side opposite to the load lock chamber 4 with the gate valve 5 interposed therebetween, facing the load lock chamber 4 and the gate valve 5. 6 and 7 show a nozzle 61, an opening 62, an air supply pipe 63, and a partition wall 66 among the components of the load lock panel 6.

The nozzle 61 is provided facing the edge of the opening 42 so as to eject the purge gas from the loader 8 side toward the edge of the opening 42 of the load lock chamber 4. Since the guide rail 55 is provided as a structure at the edge of the opening 42, the nozzle 61 is provided so as to face the guide rail 55 so as to eject the purge gas toward the guide rail 55. Specifically, the nozzle 61 includes a nozzle 61U and a nozzle 61L. The nozzle 61U is a pair of nozzles provided so as to face the edge portion 421U of the opening 42U, that is, the pair of guide rails 55U. The nozzle 61L is a pair of nozzles provided so as to face the edge portion 421L of the opening 42L, that is, the pair of guide rails 55L.

The opening 62 is provided so as to communicate with the opening 42 of the load lock chamber 4 and the opening of the gate valve 5. The opening 62 includes the opening 62U and the opening 62L. The opening 62U is provided so as to communicate with the opening of the opening 42U and the gate valve 5U. The opening 62U may define the end of the upper transport space. The opening 62L is provided so as to communicate with the opening 42L and the opening of the gate valve 5L. The opening 62L may define the end of the lower transport space.

The air supply pipe 63 is an air supply flow path (supply flow path) for supplying the purge gas to the nozzle 61. An example of a purge gas is dry air. The air supply pipe 63 includes the air supply pipe 63U and the air supply pipe 63L. The air supply pipe 63U supplies purge gas to the nozzle 61U. The air supply pipe 63L supplies purge gas to the nozzle 61L.

The partition wall 66 is provided so as to partition the opening 62U and the opening 62L and to be connected to the partition wall 56 of the gate valve 5. The partition wall 66 may define an end of the upper transport space and a portion of the end of the lower transport space.

Since the nozzle 61 is provided so as to face the guide rail 55, the nozzle 61 ejects the purge gas toward the front surface of the guide rail 55. As a result, the purge gas can be efficiently applied to the guide rail 55. This will be described with reference to FIGS. 8 and 9.

8 and 9 are diagrams schematically showing the flow of the ejected purge gas. When the purge gas is ejected toward the side surface of the guide rail 55 as shown in FIG. 8, the flow of the purge gas is unlikely to occur in the portion of the guide rail 55 opposite to the side surface. Therefore, the processing gas diffused from the loader 8 may adhere to the guide rail 55 in a place where the flow of the purge gas is unlikely to occur. When the purge gas is ejected toward the front surface of the guide rail 55 as shown in FIG. 9, a flow of the purge gas is generated in both the front surface portion and both side portions of the guide rail 55. Therefore, the processing gas diffused from the loader 8 is removed by the flow of the purge gas before reaching the guide rail 55, and is unlikely to adhere to the guide rail 55. Therefore, it is desirable that the purge gas is ejected toward the front surface of the guide rail 55 instead of the side surface of the guide rail 55.

FIG. 10 is a diagram showing an example of a schematic configuration of a nozzle. In this example, the nozzle 61 is a shower plate that ejects purge gas from a plurality of holes, and includes a plate 611, a plate 612, and a sealing member 613. The plate 611 includes ports 611a, 611b and 611c provided at different locations. By selectively connecting the air supply pipe 63 to any of these ports, the connection point of the air supply pipe 63 is adjusted. In this example, the air supply pipe 63 is connected to the port 611b, and the other ports 611a and 611c are closed. The number of ports to which the air supply pipe 63 is connected does not necessarily have to be three, and only one port may be provided if the optimum position for gas ejection from the plate 12 to the guide rail 55 is determined, and depending on the situation. A plurality of them may be provided in order to appropriately select the optimum position.

The plate 612 has a plurality of ejection holes 612a. The plurality of ejection holes 612a are provided so as to obtain a desired flow rate, for example, a flow rate of about several tens L / min to several hundreds L / min. The plurality of ejection holes 612a are provided, for example, in a grid pattern in the vertical direction (Z-axis direction) and the left-right direction (X-axis direction). Each ejection hole 612a has, for example, a circular shape having a diameter of about several mm. Not limited to the above, the plurality of ejection holes 612a may be arranged in an oblique shape or a concentric circle shape, and each ejection hole may have a rectangular shape or an oval shape.

The plate 611 and the plate 612 are coupled via a sealing member 613 so as to airtightly form an internal space that guides the purge gas supplied to the port of the plate 611 (port 611b in this example) to each ejection hole 612a of the plate 612. Will be done.

By using the nozzle 61 as a shower plate, for example, the ejection range of the purge gas can be easily adjusted. For example, a configuration for exhausting the purge gas ejected by the nozzle 61 as described above is also incorporated in the load lock panel 6. This will be described with reference to FIG.

FIG. 11 is a view of the load lock panel 6 viewed from the load lock chamber 4 side. In addition to the nozzle 61, the opening 62, the air supply pipe 63, and the partition wall 66 described above, the load lock panel 6 includes an exhaust pipe 64, an exhaust port 641U to an exhaust port 646U, an exhaust port 641L to an exhaust port 646L, and a purge gas. Includes controller 65. In this example, the air supply pipe 63U of the air supply pipe 63 branches at the branch point 63Ua at the upper center of the load lock panel 6 and extends in the left-right direction (X-axis direction) and is connected to the nozzle 61U. The air supply pipe 63L of the air supply pipe 63 branches at the branch point 63La at the lower center of the load lock panel 6 and extends in the left-right direction, and is connected to the nozzle 61L.

The exhaust pipe 64 is an exhaust flow path for exhausting the transport space. The exhaust pipe 64 includes an exhaust pipe 64U and an exhaust pipe 64L.

The exhaust pipe 64U is connected to the exhaust port 641U to the exhaust port 646U. The exhaust ports 641U to 646U exhaust the upper transport space by a route different from the opening 42U, the opening of the gate valve 5U, and the opening 62U of the load lock panel 6. The exhaust port 641U to the exhaust port 646U are provided in the vicinity of the edge portion 422U of the opening 42U of the load lock chamber 4 (for example, within a range of several mm to several cm), and are provided along the edge portion 422U (in the X-axis direction). To be provided.

The exhaust pipe 64L is connected to the exhaust port 641L to the exhaust port 646L. The exhaust ports 641L to 646L exhaust the lower transport space by a route different from the opening 42L, the opening of the gate valve 5L, and the opening 62L of the load lock panel 6. The exhaust port 641L to the exhaust port 646L are provided in the vicinity of the edge portion 422L of the opening 42L of the load lock chamber 4 and are provided along the edge portion 422L (in the X-axis direction).

The exhaust pipe 64U and the exhaust pipe 64L will be further described. The exhaust pipe 64U branches at a branch point 64Ua at the upper center of the load lock panel 6 and extends in the left-right direction, and is connected to each of the exhaust port 641U to the exhaust port 646U. The exhaust ports 641U to 646U are provided above in the upper transport space. The exhaust port 641U to the exhaust port 646U have a central axis direction (in this example, the central axis direction in the Z-axis direction) that intersects the opening center axis direction (Y-axis direction) of the opening 42U. The exhaust port 641U to the exhaust port 646U are located between a pair of guide rails 55U provided at the left and right edge portions 421U of the opening 42U. The exhaust port 641U and the exhaust port 646U are provided in the vicinity of the guide rail 55U. The exhaust port 643U and the exhaust port 644U are provided near the center of the upper transport space. The exhaust port 642U is provided between the exhaust ports 641U and 643U. The exhaust port 645U is provided between the exhaust port 644U and the exhaust port 646U.

The exhaust pipe 64L branches at a branch point 64La at the lower center of the load lock panel 6 and extends in the left-right direction, and is connected to each of the exhaust port 641L to the exhaust port 646L. The exhaust ports 641L to 646L are provided below in the lower transport space. The exhaust port 641L to the exhaust port 646L have a central axis direction (in this example, the central axis direction in the Z-axis direction) that intersects the opening center axis direction (Y-axis direction) of the opening 42L. The exhaust port 641L to the exhaust port 646L are located between a pair of guide rails 55L provided on the left and right edge portions 421L of the opening 42L. The exhaust port 641L and the exhaust port 646L are provided in the vicinity of the guide rail 55L. The exhaust port 643L and the exhaust port 644L are provided near the center of the lower transport space. The exhaust port 642L is provided between the exhaust ports 641L and 643L. The exhaust port 645L is provided between the exhaust port 644L and the exhaust port 646L.

As described above, by providing the exhaust port not only in the vicinity of the guide rail 55 but also in the vicinity of the center of the upper transport space and the lower transport space, the entire transport space can be easily exhausted. This will be described with reference to FIGS. 12 to 17.

12 to 17 are diagrams schematically showing the flow of exhaust gas. As shown in FIGS. 12 and 13, when the exhaust port is provided only in the vicinity of the guide rail 55, the exhaust flow of the purge gas is formed only in the vicinity of the guide rail 55. As shown in FIGS. 14 and 15, when an exhaust port is also provided between the vicinity of the guide rail 55 and the vicinity of the center of the transport space (intermediate position), the flow of exhaust gas of the purge gas is also formed at the intermediate position. .. As shown in FIGS. 16 and 17, when an exhaust port is also provided in the center of the transport space, an exhaust flow of the purge gas is also formed in the vicinity of the center. Therefore, it is desirable that the exhaust port is provided not only near the guide rail 55 but also near the center of the transport space.

Returning to FIG. 11, the purge gas controller 65 controls the supply of purge gas by the air supply pipe 63. Examples of air supply control for purge gas are ON / OFF of supply air, adjustment of flow rate, and the like. Further, the purge gas controller 65 controls the exhaust gas by the exhaust pipe 64. Examples of exhaust gas control of the purge gas are ON / OFF of the exhaust gas, adjustment of the flow rate, and the like. For these air supply control and exhaust control, the purge gas controller 65 may be configured to include a variable valve, a flow meter, etc. provided for the air supply pipe 63 and the exhaust pipe 64.

An example of ON / OFF control of air supply and exhaust gas by the purge gas controller 65 will be described. When the unprocessed board is carried from the loader 8 into the load lock chamber 4, air supply and exhaust are controlled to OFF. When the processed board is carried out from the load lock chamber 4 to the loader 8, supply air and exhaust are controlled to be ON. Although not performed by normal processing, when the unprocessed board is carried out from the load lock chamber 4 to the loader 8 for some reason, the supply air and the exhaust are controlled to OFF. When the substrate processing device 1 is activated (idle state), air supply and exhaust are controlled to be ON. When the board processing device 1 is not started (down state), the supply air and the exhaust are controlled to OFF. When the supply and / or exhaust of the purge gas does not operate normally, the supply and / or exhaust are controlled to OFF. The air supply control and the exhaust gas control by the purge gas controller 65 may be performed under the control of the control unit 7 (FIG. 1). When the supply and / or exhaust of the purge gas by the purge gas controller 65 does not operate normally (for example, when the flow rate drops), the control unit 7 may perform control so as to generate an alarm.

Among the operations of the substrate processing apparatus 1 described above, the operation when the substrate G is carried out from the load lock chamber 4 to the loader 8 will be described with reference to FIG.

FIG. 18 is a flowchart showing an example of a process (board transfer method) executed in the substrate processing apparatus. Unless otherwise specified, each process is performed under the control of the control unit 7. Initially, it is assumed that the substrate G is in the process chamber 2 in the state before processing.

In step S1, the substrate is processed. That is, in the process chamber 2, the processing of the substrate G using the processing gas (for example, chlorine-based gas) is executed. The remaining processing gas that is not consumed in the processing adheres to the substrate G.

In step S2, the load lock chamber is controlled to a reduced pressure environment. That is, the load lock chamber 4 is controlled to a reduced pressure environment rather than an atmospheric pressure. The reduced pressure environment may be maintained from the time when the untreated substrate G is carried from the load lock chamber 4 into the process chamber 2.

In step S3, the purge gas is ejected and exhausted. That is, the purge gas is supplied to the nozzle 61 via the air supply pipe 63 and is ejected toward the guide rail 55U and the guide rail 55L. At the same time, the transport space is exhausted through the exhaust ports 641U to the exhaust port 646U and 641L to the exhaust port 646L and the exhaust pipe 64.

In step S4, the substrate G is carried out. That is, in a state where the purge gas is ejected and exhausted as in step S3, the substrate G is carried out from the process chamber 2 through the transfer chamber 3 and the load lock chamber 4 to the loader 8. At this time, the substrate G transferred from the transport chamber 3 to the load lock chamber 4 is temporarily held in the load lock chamber 4, the load lock chamber 4 is boosted to atmospheric pressure, and then the gate valve 5 is opened and the loader 8 is opened. Will be carried out to. The ejection / exhaust of the purge gas may be started in parallel with the transfer of the substrate G from the process chamber 2 to the transfer chamber 3, or the gate valve 5 is opened after the transfer of the substrate G to the transfer chamber 3. It may be started in the meantime.

In the above processing, when the substrate G is carried out from the load lock chamber 4 to the loader 8, the transport space is exhausted together with the ejection of the purge gas (steps S3 and S4). Therefore, as described above, deterioration of the structure due to adhesion of the processing gas to the structure provided in the opening 42 (for example, the guide rail 55) is suppressed.

The embodiments described above should be considered to be exemplary in all respects and not restrictive. The above embodiment can be embodied in various forms. The above-described embodiment may be omitted, replaced or modified in various forms without departing from the scope and purpose of the claims.

In the above embodiment, an example of exhausting the upper transport space on the upper side from above has been described. However, the upper transport space may be exhausted from below. In this case, the exhaust port is provided below the upper transport space. Further, the upper transport space may be exhausted from both the upper side and the lower side. In this case, the exhaust port is provided above and below in the upper transport space.

In the above embodiment, an example of exhausting the lower lower transport space from below from below has been described. However, the lower transport space may be exhausted from above. In this case, the exhaust port is provided above in the lower transport space. Further, the lower transport space may be exhausted from both above and below. In this case, for example, the exhaust port is provided above and below in the lower transport space.

For example, when the processing gas exhausted together with the purge gas is lighter than air, the gas easily moves above the upper transport space and the lower transport space, so the upper exhaust is the lower exhaust. It is more likely that the gas can be exhausted more efficiently. If the processing gas exhausted together with the purge gas is heavier than air (for example, in the case of chlorine-based gas), the gas tends to move below the upper transport space and the lower transport space. However, there is a higher possibility that the gas can be exhausted more efficiently than the upper exhaust. An example in which the upper transport space is also exhausted downward will be described with reference to FIG.

FIG. 19 is a diagram (semi-cross-sectional view) showing an example of a schematic configuration of a load lock chamber 4, a gate valve 5, a nozzle 61, and an exhaust pipe 64A. The load lock panel 6 is omitted except for the nozzle 61 and the exhaust pipe 64A. The exhaust pipe 64A, which is an exhaust flow path, includes an exhaust pipe 64UA and an exhaust pipe 64LA. The exhaust pipe 64UA passes through the edge of the gate valve 5 on the partition wall 56 and is connected to a plurality of exhaust ports. Among the plurality of exhaust ports, the exhaust port 646UA and the exhaust port 645UA are exemplified. These exhaust ports provided on the partition wall 56 are provided below in the upper transport space, and exhaust the upper transport space from below. Like the exhaust pipe 64L, the exhaust pipe 64LA is connected to the lower exhaust port in the lower transport space, and therefore the lower transport space is also exhausted from below.

In the above embodiment, an example in which elements related to the ejection and exhaust of the purge gas, for example, the nozzle 61, the exhaust port 641U, and the like are incorporated into the load lock panel 6 has been described. However, not limited to such an aspect, the elements relating to the ejection and exhaust of the purge gas may be provided in the substrate processing apparatus 1 in any aspect.

In the above embodiment, an example in which the process chamber 2 is three process chambers of the process chamber 21 to the process chamber 23 has been described. However, the process chamber 2 may be a single process chamber, or may be two or four or more process chambers.

In the above embodiment, an example in which the board loading / unloading module is the load lock chamber 4 has been described. However, in addition to the load lock chamber 4, any module capable of loading and unloading the substrate G in the substrate processing device 1 may be used as the substrate loading / unloading module.

The substrate processing apparatus 1 described above is specified as follows, for example. As described with reference to FIGS. 1 to 17, the substrate processing apparatus 1 includes a substrate loading / unloading module (for example, a load lock chamber 4), an opening 42, a gate valve 5, and an ejection portion (for example, a nozzle 61). ) And an exhaust port (exhaust port 641U, etc.). The substrate loading / unloading module has an internal space S controlled by the atmospheric pressure environment and through which the substrate G passes when the substrate G is carried out to an external space controlled to a positive pressure rather than an atmospheric pressure (for example, a loader 8). The opening 42 is provided in the board loading / unloading module, and communicates the internal space S with the external space. The gate valve 5 is provided for the opening 42 and has a transport space. The ejection portion ejects purge gas from the external space side toward the edge portion of the opening 42. The exhaust port (641U or the like) exhausts the transport space by a route different from that of the opening 42.

According to the substrate processing apparatus 1, the purge gas is ejected from the external space side of the opening 42 toward the edge of the opening 42. Further, the transport space is exhausted by a route different from that of the opening 42. As a result, it is possible to suppress the adhesion of the processing gas adhering to the substrate G to the structure provided at the edge of the opening 42 when the substrate G is carried out. Therefore, deterioration of the structure provided in the opening 42 can be suppressed.

As described with reference to FIG. 11 and the like, a plurality of exhaust ports may be provided along the edge portion 422U and the edge portion 422L of the opening 42 (exhaust port 641U to exhaust port 646U and exhaust port 641L to exhaust port). 646L etc.). This makes it easier to exhaust the entire transport space.

As described with reference to FIG. 11 and the like, the exhaust port may have a central axis direction (for example, a central axis direction in the Z axis direction) that intersects the opening central axis direction (Y axis direction) of the opening 42. .. For example, in this way, the transport space can be exhausted in a direction different from that of the opening 42.

As described with reference to FIGS. 11 and 19, the exhaust port may include an exhaust port provided below the transport space (exhaust port 641L or the like, exhaust port 646UA or the like). By exhausting the transport space downward, gas heavier than air can be efficiently exhausted.

As described with reference to FIGS. 2, 3, 6, 11 and the like, the internal space S includes an upper internal space (internal space SU) and a lower internal space (internal space SL), and the transport space is a transport space. The upper transport space communicating with the upper internal space and the lower transport space communicating with the lower internal space are included, and the exhaust port may be provided in either the upper transport space or the lower transport space (exhaust port 641U or the like). And exhaust port 641L etc.). As a result, both the upper transport space and the lower transport space can be exhausted.

As described with reference to FIG. 10 and the like, the ejection portion may be a shower plate. This makes it easier to adjust, for example, the ejection range of the purge gas.

As described with reference to FIGS. 3, 4, 6, 7, and the like, the gate valve 5 includes a valve body 52U and the like that move along the edge portion 421U and the like of the opening 42, and a valve body 52U and the like. The ejection portion may eject the purge gas toward the guide rail 55, including the guide rail 55 that guides the moving direction of the guide rail 55. The substrate processing apparatus 1 may include a process chamber 2 for processing the substrate G using a processing gas (for example, a processing gas containing chlorine atoms) that may corrode the guide rail 55. As a result, corrosion of the guide rail 55 can be suppressed.

The substrate transport method described with reference to FIG. 18 is also an aspect of the present disclosure. That is, in the substrate transfer method, in the substrate processing device 1, the purge gas is ejected from the external space side (loader 8 side) of the opening 42 toward the edge of the opening 42, and the purge gas is conveyed by a route different from that of the opening 42. The step S3 for exhausting the space is included. As described above, this substrate transfer method can also suppress the deterioration of the structure provided in the opening 42.

1 Board processing equipment 2 Process chamber 3 Conveyance chamber 4 Load lock chamber 5 Gate valve 6 Load lock panel 7 Control unit 8 Loader 42 Opening 51U Gate cover 51L Gate cover 55 Guide rail 61 Nozzle (spouting part)
421U Edge 421L Edge 422U Edge 422L Edge 641U Exhaust port 642U Exhaust port 643U Exhaust port 644U Exhaust port 645U Exhaust port 646U Exhaust port 641L Exhaust port 642L Exhaust port 464L Exhaust port 644L

Claims (11)

A board loading / unloading module having an internal space controlled by the atmospheric pressure environment and through which the board passes when the board is carried out to an external space controlled to a positive pressure rather than an atmospheric pressure.
An opening provided in the substrate loading / unloading module and communicating the internal space and the external space,
A gate valve provided for the opening and having a transport space,
An ejection portion that ejects purge gas from the external space side toward the edge of the opening, and a ejection portion.
An exhaust port that exhausts the transport space by a route different from the opening,
To prepare
Board processing equipment. A plurality of the exhaust ports are provided along the edge of the opening.
The substrate processing apparatus according to claim 1. The exhaust port has a central axial direction that intersects the opening central axial direction of the opening.
The substrate processing apparatus according to claim 1 or 2. The exhaust port includes an exhaust port provided below the transport space.
The substrate processing apparatus according to any one of claims 1 to 3. The internal space includes an upper internal space and a lower internal space.
The transport space includes an upper transport space communicating with the upper internal space and a lower transport space communicating with the lower internal space.
The substrate processing apparatus according to any one of claims 1 to 4, wherein the exhaust port is provided in both the upper transport space and the lower transport space. The ejection part is a shower plate.
The substrate processing apparatus according to any one of claims 1 to 5. The board loading / unloading module is a load lock chamber configured to be connectable to a loader having the external space.
The substrate processing apparatus according to any one of claims 1 to 6. The gate valve includes a valve body that moves along a first edge extending in the first direction of the edge portion of the opening, and a guide rail that guides the moving direction of the valve body.
The ejection portion ejects the purge gas toward the guide rail.
The substrate processing apparatus according to any one of claims 1 to 7. A process chamber for processing the substrate with a processing gas that can corrode the guide rails.
The substrate processing apparatus according to claim 8. The processing gas contains chlorine atoms.
The substrate processing apparatus according to claim 9. A board loading / unloading module having an internal space controlled by the atmospheric pressure environment and having an internal space through which the board passes when the board is carried out to an external space controlled by a positive pressure rather than an atmospheric pressure, and a board loading / unloading module provided in the board loading / unloading module. In a substrate processing apparatus including an opening that communicates with the internal space and the external space, and a gate valve provided for the opening and having a transport space.
A step of ejecting purge gas from the external space side of the opening toward the edge of the opening and exhausting the transport space by a route different from that of the opening.
including,
Board transfer method.

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