JP2022032965A5 - - Google Patents

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Publication number
JP2022032965A5
JP2022032965A5 JP2021103362A JP2021103362A JP2022032965A5 JP 2022032965 A5 JP2022032965 A5 JP 2022032965A5 JP 2021103362 A JP2021103362 A JP 2021103362A JP 2021103362 A JP2021103362 A JP 2021103362A JP 2022032965 A5 JP2022032965 A5 JP 2022032965A5
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JP
Japan
Prior art keywords
substrate
gas
etching
etching method
plasma
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JP2021103362A
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English (en)
Japanese (ja)
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JP2022032965A (ja
JP7325477B2 (ja
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Priority to TW110127810A priority Critical patent/TW202213502A/zh
Priority to CN202110891135.1A priority patent/CN114078699A/zh
Priority to KR1020210103007A priority patent/KR20220020776A/ko
Priority to US17/398,601 priority patent/US11637020B2/en
Publication of JP2022032965A publication Critical patent/JP2022032965A/ja
Priority to US18/129,628 priority patent/US20230245897A1/en
Publication of JP2022032965A5 publication Critical patent/JP2022032965A5/ja
Application granted granted Critical
Publication of JP7325477B2 publication Critical patent/JP7325477B2/ja
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JP2021103362A 2020-08-12 2021-06-22 エッチング方法及びプラズマエッチング装置 Active JP7325477B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW110127810A TW202213502A (zh) 2020-08-12 2021-07-29 蝕刻方法及電漿蝕刻裝置
CN202110891135.1A CN114078699A (zh) 2020-08-12 2021-08-04 蚀刻方法和等离子体蚀刻装置
KR1020210103007A KR20220020776A (ko) 2020-08-12 2021-08-05 에칭 방법 및 플라즈마 에칭 장치
US17/398,601 US11637020B2 (en) 2020-08-12 2021-08-10 Etching method and plasma etching apparatus
US18/129,628 US20230245897A1 (en) 2020-08-12 2023-03-31 Etching method and plasma etching apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020136392 2020-08-12
JP2020136392 2020-08-12

Publications (3)

Publication Number Publication Date
JP2022032965A JP2022032965A (ja) 2022-02-25
JP2022032965A5 true JP2022032965A5 (de) 2023-04-19
JP7325477B2 JP7325477B2 (ja) 2023-08-14

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Application Number Title Priority Date Filing Date
JP2021103362A Active JP7325477B2 (ja) 2020-08-12 2021-06-22 エッチング方法及びプラズマエッチング装置

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JP (1) JP7325477B2 (de)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06168914A (ja) * 1992-05-13 1994-06-14 Tokyo Electron Ltd エッチング処理方法
JPH07147273A (ja) * 1993-11-24 1995-06-06 Tokyo Electron Ltd エッチング処理方法

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