JP2021521326A5 - - Google Patents
Info
- Publication number
- JP2021521326A5 JP2021521326A5 JP2020555056A JP2020555056A JP2021521326A5 JP 2021521326 A5 JP2021521326 A5 JP 2021521326A5 JP 2020555056 A JP2020555056 A JP 2020555056A JP 2020555056 A JP2020555056 A JP 2020555056A JP 2021521326 A5 JP2021521326 A5 JP 2021521326A5
- Authority
- JP
- Japan
- Prior art keywords
- approximately
- degrees
- processing chamber
- ring
- range
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862655599P | 2018-04-10 | 2018-04-10 | |
| US62/655,599 | 2018-04-10 | ||
| US201962795242P | 2019-01-22 | 2019-01-22 | |
| US62/795,242 | 2019-01-22 | ||
| PCT/US2019/026576 WO2019199822A2 (en) | 2018-04-10 | 2019-04-09 | Resolving spontaneous arcing during thick film deposition of high temperature amorphous carbon deposition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2021521326A JP2021521326A (ja) | 2021-08-26 |
| JP2021521326A5 true JP2021521326A5 (enExample) | 2022-04-19 |
Family
ID=68164867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020555056A Pending JP2021521326A (ja) | 2018-04-10 | 2019-04-09 | 高温アモルファスカーボン堆積の厚膜堆積中の自発的アークの解決 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20210017645A1 (enExample) |
| JP (1) | JP2021521326A (enExample) |
| KR (1) | KR20200130745A (enExample) |
| CN (1) | CN112041480A (enExample) |
| SG (1) | SG11202009444QA (enExample) |
| WO (1) | WO2019199822A2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024259292A1 (en) * | 2023-06-16 | 2024-12-19 | Lam Research Corporation | Enhanced carbon film edge thickness profile tunability by focus ring |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000040694A (ja) * | 1998-07-23 | 2000-02-08 | Advanced Display Inc | ドライエッチング装置及びドライエッチング方法 |
| US20030106646A1 (en) * | 2001-12-11 | 2003-06-12 | Applied Materials, Inc. | Plasma chamber insert ring |
| US20040083976A1 (en) * | 2002-09-25 | 2004-05-06 | Silterra Malaysia Sdn. Bhd. | Modified deposition ring to eliminate backside and wafer edge coating |
| US7501161B2 (en) * | 2004-06-01 | 2009-03-10 | Applied Materials, Inc. | Methods and apparatus for reducing arcing during plasma processing |
| JP4507120B2 (ja) * | 2005-11-11 | 2010-07-21 | エルピーダメモリ株式会社 | 半導体集積回路装置の製造方法 |
| JP2007250967A (ja) * | 2006-03-17 | 2007-09-27 | Tokyo Electron Ltd | プラズマ処理装置および方法とフォーカスリング |
| US20070283884A1 (en) * | 2006-05-30 | 2007-12-13 | Applied Materials, Inc. | Ring assembly for substrate processing chamber |
| US8562785B2 (en) * | 2011-05-31 | 2013-10-22 | Lam Research Corporation | Gas distribution showerhead for inductively coupled plasma etch reactor |
| US9245717B2 (en) * | 2011-05-31 | 2016-01-26 | Lam Research Corporation | Gas distribution system for ceramic showerhead of plasma etch reactor |
| US9236305B2 (en) * | 2013-01-25 | 2016-01-12 | Applied Materials, Inc. | Wafer dicing with etch chamber shield ring for film frame wafer applications |
| KR101605721B1 (ko) * | 2014-05-29 | 2016-03-23 | 세메스 주식회사 | 베이크 장치 및 기판 처리 장치 |
| US9412753B2 (en) * | 2014-09-30 | 2016-08-09 | Sandisk Technologies Llc | Multiheight electrically conductive via contacts for a multilevel interconnect structure |
| CN107112275B (zh) * | 2014-12-19 | 2020-10-30 | 应用材料公司 | 用于基板处理腔室的边缘环 |
| US10950477B2 (en) * | 2015-08-07 | 2021-03-16 | Applied Materials, Inc. | Ceramic heater and esc with enhanced wafer edge performance |
| CN116631865A (zh) * | 2016-01-20 | 2023-08-22 | 应用材料公司 | 用于侧向硬模凹槽减小的混合碳硬模 |
| KR102632725B1 (ko) * | 2016-03-17 | 2024-02-05 | 에이에스엠 아이피 홀딩 비.브이. | 기판 지지 플레이트 및 이를 포함하는 박막 증착 장치 및 박막 증착 방법 |
| US10249495B2 (en) * | 2016-06-28 | 2019-04-02 | Applied Materials, Inc. | Diamond like carbon layer formed by an electron beam plasma process |
-
2019
- 2019-04-09 JP JP2020555056A patent/JP2021521326A/ja active Pending
- 2019-04-09 CN CN201980028655.0A patent/CN112041480A/zh active Pending
- 2019-04-09 KR KR1020207032037A patent/KR20200130745A/ko not_active Ceased
- 2019-04-09 WO PCT/US2019/026576 patent/WO2019199822A2/en not_active Ceased
- 2019-04-09 SG SG11202009444QA patent/SG11202009444QA/en unknown
- 2019-04-09 US US17/040,788 patent/US20210017645A1/en not_active Abandoned
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