JP2021518994A - 半導体層の上のグラフェン及びボロン窒化物ヘテロ構造デバイスの統合 - Google Patents
半導体層の上のグラフェン及びボロン窒化物ヘテロ構造デバイスの統合 Download PDFInfo
- Publication number
- JP2021518994A JP2021518994A JP2020568951A JP2020568951A JP2021518994A JP 2021518994 A JP2021518994 A JP 2021518994A JP 2020568951 A JP2020568951 A JP 2020568951A JP 2020568951 A JP2020568951 A JP 2020568951A JP 2021518994 A JP2021518994 A JP 2021518994A
- Authority
- JP
- Japan
- Prior art keywords
- region
- layer
- contact field
- gate
- field region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 160
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 95
- 239000004065 semiconductor Substances 0.000 title claims abstract description 51
- 229910052582 BN Inorganic materials 0.000 title claims description 6
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 title claims description 6
- 230000010354 integration Effects 0.000 title 1
- 238000004377 microelectronic Methods 0.000 claims abstract description 58
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 57
- 239000010439 graphite Substances 0.000 claims abstract description 57
- 239000000463 material Substances 0.000 claims abstract description 50
- 238000000034 method Methods 0.000 claims description 68
- 239000000758 substrate Substances 0.000 claims description 42
- 239000002019 doping agent Substances 0.000 claims description 32
- 238000002955 isolation Methods 0.000 claims description 20
- 229910052710 silicon Inorganic materials 0.000 claims description 11
- 239000010703 silicon Substances 0.000 claims description 11
- 238000009826 distribution Methods 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 10
- 230000001186 cumulative effect Effects 0.000 claims description 6
- 229910044991 metal oxide Inorganic materials 0.000 claims description 6
- 150000004706 metal oxides Chemical class 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 description 81
- 239000002184 metal Substances 0.000 description 80
- 230000008569 process Effects 0.000 description 37
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 32
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 24
- 238000002347 injection Methods 0.000 description 21
- 239000007924 injection Substances 0.000 description 21
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 20
- 229910052796 boron Inorganic materials 0.000 description 20
- 229910052757 nitrogen Inorganic materials 0.000 description 16
- 125000006850 spacer group Chemical group 0.000 description 14
- 239000000377 silicon dioxide Substances 0.000 description 12
- 235000012239 silicon dioxide Nutrition 0.000 description 12
- 229910052581 Si3N4 Inorganic materials 0.000 description 11
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 238000001556 precipitation Methods 0.000 description 9
- 229910052799 carbon Inorganic materials 0.000 description 8
- 230000004888 barrier function Effects 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000003989 dielectric material Substances 0.000 description 5
- -1 gallium hydride Chemical class 0.000 description 5
- 229910021332 silicide Inorganic materials 0.000 description 5
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 5
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 4
- 238000000137 annealing Methods 0.000 description 4
- 238000000231 atomic layer deposition Methods 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 229910000449 hafnium oxide Inorganic materials 0.000 description 3
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 3
- 229910002601 GaN Inorganic materials 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 125000001475 halogen functional group Chemical group 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910001936 tantalum oxide Inorganic materials 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- GZNZJEVIXJPJSJ-UHFFFAOYSA-N [O--].[O--].[Zr+4].[Ta+5] Chemical compound [O--].[O--].[Zr+4].[Ta+5] GZNZJEVIXJPJSJ-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- YZYDPPZYDIRSJT-UHFFFAOYSA-K boron phosphate Chemical compound [B+3].[O-]P([O-])([O-])=O YZYDPPZYDIRSJT-UHFFFAOYSA-K 0.000 description 1
- 229910000149 boron phosphate Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000005365 phosphate glass Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical group [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02614—Transformation of metal, e.g. oxidation, nitridation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/8258—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using a combination of technologies covered by H01L21/8206, H01L21/8213, H01L21/822, H01L21/8252, H01L21/8254 or H01L21/8256
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
- H01L27/0922—Combination of complementary transistors having a different structure, e.g. stacked CMOS, high-voltage and low-voltage CMOS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1606—Graphene
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/26—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, elements provided for in two or more of the groups H01L29/16, H01L29/18, H01L29/20, H01L29/22, H01L29/24, e.g. alloys
- H01L29/267—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, elements provided for in two or more of the groups H01L29/16, H01L29/18, H01L29/20, H01L29/22, H01L29/24, e.g. alloys in different semiconductor regions, e.g. heterojunctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4908—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66015—Multistep manufacturing processes of devices having a semiconductor body comprising semiconducting carbon, e.g. diamond, diamond-like carbon, graphene
- H01L29/66037—Multistep manufacturing processes of devices having a semiconductor body comprising semiconducting carbon, e.g. diamond, diamond-like carbon, graphene the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66045—Field-effect transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78645—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate
- H01L29/78648—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate arranged on opposing sides of the channel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78681—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising AIIIBV or AIIBVI or AIVBVI semiconductor materials, or Se or Te
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78684—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising semiconductor materials of Group IV not being silicon, or alloys including an element of the group IV, e.g. Ge, SiN alloys, SiC alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02378—Silicon carbide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02389—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02395—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02488—Insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02527—Carbon, e.g. diamond-like carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
Claims (20)
- マイクロ電子デバイスであって、
半導体材料を有する基板、
ゲートグラフェン構成要素であって、前記基板上のグラフェンの少なくとも1つの層を含むグラファイト層であって、チャネル領域と、前記チャネル領域に隣接する第1のコンタクト領域と、前記チャネル領域に隣接する第2のコンタクト領域とを有する前記グラファイト層、及び、前記チャネル領域上のゲートを含む、前記ゲートグラフェン構成要素、
前記第1のコンタクト領域における前記グラファイト層上の第1の接続、
前記第2のコンタクト領域における前記グラファイト層上の第2の接続、
前記チャネル領域の下の前記半導体材料における、第1の導電型を有するバックゲート領域、
前記グラファイト層の前記第1のコンタクト領域の下の前記半導体材料における第1のコンタクトフィールド領域、及び
前記グラファイト層の前記第2コンタクト領域の下の前記半導体材料における第2コンタクトフィールド領域、
を含み、
前記グラファイト層が、前記バックゲート領域、前記第1のコンタクトフィールド領域、及び前記第2コンタクトフィールド領域から隔離され、
前記第1のコンタクトフィールド領域及び前記第2コンタクトフィールド領域の少なくとも一方が、第2の、逆の導電型を有する、
マイクロ電子デバイス。 - 請求項1に記載のマイクロ電子デバイスであって、前記第1のコンタクトフィールド領域及び前記第2のコンタクトフィールド領域のうちの前記少なくとも一方が、1×1019cm-3より大きい平均ドーパント密度を有する、マイクロ電子デバイス。
- 請求項1に記載のマイクロ電子デバイスであって、前記バックゲート領域がp型であり、前記第1のコンタクトフィールド領域がn型であり、前記第2のコンタクトフィールド領域がn型である、マイクロ電子デバイス。
- 請求項3に記載のマイクロ電子デバイスであって、前記半導体材料が主としてシリコンを含み、前記マイクロ電子デバイスが、nチャネル金属酸化物半導体(NMOS)トランジスタを更に含む、マイクロ電子デバイス。
- 請求項4に記載のマイクロ電子デバイスであって、前記第1のコンタクトフィールド領域のドーパント分布が、前記NMOSトランジスタのn型ソース領域のドーパント分布と実質的に等しい、マイクロ電子デバイス。
- 請求項4に記載のマイクロ電子デバイスであって、pチャネル金属酸化物半導体(PMOS)トランジスタを更に含む、マイクロ電子デバイス。
- 請求項1に記載のマイクロ電子デバイスであって、
前記ゲートグラフェン構成要素が、前記バックゲート領域と、前記第1のコンタクトフィールド領域と、前記第2のコンタクトフィールド領域との上に隔離誘電体層を更に含み、
前記グラファイト層が、前記隔離誘電体層によって、前記バックゲート領域と、前記第1のコンタクトフィールド領域と、前記第2のコンタクトフィールド領域とから隔離されている、
マイクロ電子デバイス。 - 請求項7に記載のゲート誘電体層であって、ゲート誘電体層を有する金属酸化物半導体(MOS)トランジスタを更に含み、前記隔離誘電体層の厚み及び組成が、前記ゲート誘電体層の厚み及び組成と実質的に等しい、マイクロ電子デバイス。
- 請求項1に記載のマイクロ電子デバイスであって、前記ゲートグラフェン構成要素が、前記グラファイト層の下の下側六方晶ボロン窒化物(hBN)層を更に含み、前記グラファイト層が前記下側hBN層上に直接に配置される、マイクロ電子デバイス。
- 請求項1に記載のマイクロ電子デバイスであって、前記ゲートグラフェン構成要素が、
前記バックゲート領域とは反対の前記チャネル領域の上のグラファイト層上に直接にパターン化されたhBN層と、
前記パターン化されたhBN層の上のゲートと、
を更に含む、マイクロ電子デバイス。 - マイクロ電子デバイスを形成する方法であって、
半導体材料を含む基板を提供することであって、前記半導体材料が、前記半導体材料において第1の導電型を有するバックゲート領域を含む、前記基板を提供すること、
前記バックゲート領域に隣接する前記半導体材料において第1のコンタクトフィールド領域を形成すること、
前記バックゲート領域に隣接する前記半導体材料において、第2の、逆の導電型を有する第2のコンタクトフィールド領域を形成すること、
前記基板の上にゲートグラフェン構成要素のグラファイト層を形成することであって、前記グラファイト層がグラフェンの少なくとも1つの層を含み、前記グラファイト層が、前記バックゲート領域と、前記第1のコンタクトフィールド領域と、前記第2のコンタクトフィールド領域との上に延在し、前記グラファイト層が、前記バックゲート領域と、前記第1のコンタクトフィールド領域と、前記第2のコンタクトフィールド領域とから分離される、前記グラファイト層を形成すること、
前記第1のコンタクトフィールド領域の上の前記グラファイト層上に第1の接続を形成すること、及び
前記第2のコンタクトフィールド領域の上の前記グラファイト層上に第2の接続を形成すること、
を含む、方法。 - 請求項11に記載の方法であって、前記第2の導電型を有する前記第1のコンタクトフィールド領域及び前記第2のコンタクトフィールド領域のうちの前記少なくとも1つと同時に、前記第2の導電型を有する金属酸化物半導体(MOS)トランジスタのソース領域を形成することを更に含む、方法。
- 請求項11に記載の方法であって、前記第2の導電型を有する前記第1のコンタクトフィールド領域及び前記第2のコンタクトフィールド領域のうちの前記少なくとも1つを形成することが、1×1014cm-2〜1×1016cm-2の累積ドーズ量で前記第2の導電型のドーパントを注入することを含む、方法。
- 請求項11に記載の方法であって、前記第2の導電型を有する前記第1のコンタクトフィールド領域及び前記第2のコンタクトフィールド領域のうちの前記少なくとも1つを形成することが、前記第2の導電型を有する前記第1のコンタクトフィールド領域及び前記第2のコンタクトフィールド領域のうちの前記少なくとも1つが、1×1019cm-3より大きい平均ドーパント密度を有するように行われる、方法。
- 請求項11に記載の方法であって、前記基板の上に隔離誘電体層を形成することを更に含み、その結果、前記グラファイト層が、前記隔離誘電体層によって、前記バックゲート領域、前記第1のコンタクトフィールド領域、及び前記第2のコンタクトフィールド領域から隔離される、方法。
- 請求項15に記載の方法であって、前記隔離誘電体層と同時にMOSトランジスタのゲート誘電体層を形成することを更に含む、方法。
- 請求項11に記載の方法であって、前記半導体材料が主としてシリコンを含む、方法。
- 請求項11に記載の方法であって、前記グラファイト層を形成する前に下側六方晶ボロン窒化物(hBN)層を形成することを更に含み、その結果、前記グラファイト層が、前記下側hBN層の直接上に形成される、方法。
- 請求項11に記載の方法であって、パターン化されたhBN層を前記バックゲート領域の上の前記グラファイト層の直接上に形成することを更に含む、方法。
- 請求項11に記載の方法であって、前記チャネル領域の上の前記グラファイト層の上にゲートを形成することを更に含む、方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/910,854 | 2018-03-02 | ||
US15/910,854 US10304967B1 (en) | 2018-03-02 | 2018-03-02 | Integration of graphene and boron nitride hetero-structure device over semiconductor layer |
PCT/US2019/020558 WO2019169392A1 (en) | 2018-03-02 | 2019-03-04 | Integration of graphene and boron nitride hetero-structure device over semiconductor layer |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2021518994A true JP2021518994A (ja) | 2021-08-05 |
JPWO2019169392A5 JPWO2019169392A5 (ja) | 2022-03-15 |
JP7293258B2 JP7293258B2 (ja) | 2023-06-19 |
Family
ID=66636213
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020568951A Active JP7293258B2 (ja) | 2018-03-02 | 2019-03-04 | 半導体層の上のグラフェン及びボロン窒化物ヘテロ構造デバイスの統合 |
Country Status (5)
Country | Link |
---|---|
US (2) | US10304967B1 (ja) |
EP (1) | EP3759732A4 (ja) |
JP (1) | JP7293258B2 (ja) |
CN (1) | CN111801780A (ja) |
WO (1) | WO2019169392A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10490673B2 (en) | 2018-03-02 | 2019-11-26 | Texas Instruments Incorporated | Integration of graphene and boron nitride hetero-structure device |
CN110676169B (zh) * | 2019-09-05 | 2023-02-28 | 中国电子科技集团公司第十三研究所 | 石墨烯胶囊封装晶体管制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170032977A1 (en) * | 2015-07-31 | 2017-02-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Redistribution lines having stacking vias |
JP2017225100A (ja) * | 2015-07-31 | 2017-12-21 | 株式会社半導体エネルギー研究所 | 半導体装置、表示モジュール、及び電子機器 |
JP2020508587A (ja) * | 2017-02-21 | 2020-03-19 | 日本テキサス・インスツルメンツ合同会社 | 高周波数応用例のためのヘテロ構造相互接続 |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7732859B2 (en) | 2007-07-16 | 2010-06-08 | International Business Machines Corporation | Graphene-based transistor |
US8659009B2 (en) | 2007-11-02 | 2014-02-25 | The Trustees Of Columbia University In The City Of New York | Locally gated graphene nanostructures and methods of making and using |
WO2009132165A2 (en) | 2008-04-24 | 2009-10-29 | President And Fellows Of Harvard College | Microfabrication of carbon-based devices such as gate-controlled graphene devices |
US8698226B2 (en) | 2008-07-31 | 2014-04-15 | University Of Connecticut | Semiconductor devices, methods of manufacture thereof and articles comprising the same |
US7858990B2 (en) | 2008-08-29 | 2010-12-28 | Advanced Micro Devices, Inc. | Device and process of forming device with pre-patterned trench and graphene-based device structure formed therein |
US7858989B2 (en) | 2008-08-29 | 2010-12-28 | Globalfoundries Inc. | Device and process of forming device with device structure formed in trench and graphene layer formed thereover |
WO2010113518A1 (ja) | 2009-04-01 | 2010-10-07 | 国立大学法人北海道大学 | 電界効果トランジスタ |
KR101156620B1 (ko) | 2009-04-08 | 2012-06-14 | 한국전자통신연구원 | 그라핀 채널층을 가지는 전계 효과 트랜지스터 |
US8673703B2 (en) | 2009-11-17 | 2014-03-18 | International Business Machines Corporation | Fabrication of graphene nanoelectronic devices on SOI structures |
JP5904734B2 (ja) | 2010-09-16 | 2016-04-20 | 三星電子株式会社Samsung Electronics Co.,Ltd. | グラフェン発光素子及びその製造方法 |
CN102054869B (zh) | 2010-09-17 | 2012-12-19 | 中国科学院微电子研究所 | 一种石墨烯器件及其制造方法 |
KR101791938B1 (ko) * | 2010-12-29 | 2017-11-02 | 삼성전자 주식회사 | 복수의 그래핀 채널층을 구비하는 그래핀 전자소자 |
KR101813176B1 (ko) * | 2011-04-07 | 2017-12-29 | 삼성전자주식회사 | 그래핀 전자 소자 및 제조방법 |
CN102842603B (zh) * | 2011-06-23 | 2015-03-25 | 中国科学院微电子研究所 | Mosfet及其制造方法 |
US8633055B2 (en) | 2011-12-13 | 2014-01-21 | International Business Machines Corporation | Graphene field effect transistor |
KR101920710B1 (ko) | 2012-01-03 | 2018-11-21 | 삼성전자주식회사 | 인버터 소자, nand 소자, nor 소자, 및 이를 포함하는 논리 장치 |
CN103258849A (zh) * | 2012-02-15 | 2013-08-21 | 西安电子科技大学 | 一种石墨烯场效应晶体管及其制备方法 |
KR101910579B1 (ko) | 2012-10-29 | 2018-10-22 | 삼성전자주식회사 | 튜너블 배리어를 구비한 그래핀 스위칭 소자 |
EP2959514A4 (en) * | 2013-02-22 | 2016-11-02 | Hrl Lab Llc | FIELD EFFECT TRANSISTOR WITH GRAPH HETEROSTRUCTURE |
US9627562B2 (en) | 2013-03-22 | 2017-04-18 | Nanyang Technological University | Method of manufacturing a monolayer graphene photodetector and monolayer graphene photodetector |
CN103325836B (zh) * | 2013-06-08 | 2016-02-10 | 中国科学院微电子研究所 | 一种石墨烯场效应晶体管及其制备方法 |
KR101687983B1 (ko) * | 2014-03-26 | 2017-01-02 | 한국과학기술원 | 불화암모늄을 이용한 n-도핑된 그래핀 및 전기소자의 제조방법,그에 의한 그래핀 및 전기소자 |
KR101526555B1 (ko) | 2014-08-22 | 2015-06-09 | 서울대학교산학협력단 | 재구성 가능한 전자 소자 및 이의 동작 방법 |
KR102360025B1 (ko) * | 2014-10-16 | 2022-02-08 | 삼성전자주식회사 | 비정질 탄소원자층의 형성방법 및 비정질 탄소원자층을 포함하는 전자소자 |
JP6582759B2 (ja) | 2015-09-02 | 2019-10-02 | 富士通株式会社 | 電子デバイス及びその製造方法 |
US9882008B2 (en) | 2015-11-05 | 2018-01-30 | Texas Instruments Incorporated | Graphene FET with graphitic interface layer at contacts |
CN106803517B (zh) * | 2015-11-26 | 2019-12-20 | 上海新昇半导体科技有限公司 | 双沟道FinFET器件及其制造方法 |
KR102425131B1 (ko) | 2016-02-05 | 2022-07-26 | 광주과학기술원 | 그래핀 트랜지스터 및 이를 이용한 3진 논리 소자 |
CN107230632B (zh) * | 2016-03-24 | 2020-05-01 | 上海新昇半导体科技有限公司 | 双栅极石墨烯场效应晶体管及其制造方法 |
US9954109B2 (en) * | 2016-05-05 | 2018-04-24 | International Business Machines Corporation | Vertical transistor including controlled gate length and a self-aligned junction |
US9923142B2 (en) * | 2016-05-31 | 2018-03-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Methods of graphene growth and related structures |
US9899537B2 (en) * | 2016-05-31 | 2018-02-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device with transition metal dichalocogenide hetero-structure |
JP6791723B2 (ja) * | 2016-11-07 | 2020-11-25 | 住友電気工業株式会社 | 半導体装置 |
US20180308696A1 (en) | 2017-04-25 | 2018-10-25 | Texas Instruments Incorporated | Low contact resistance graphene device integration |
-
2018
- 2018-03-02 US US15/910,854 patent/US10304967B1/en active Active
-
2019
- 2019-03-04 EP EP19760420.0A patent/EP3759732A4/en active Pending
- 2019-03-04 WO PCT/US2019/020558 patent/WO2019169392A1/en unknown
- 2019-03-04 CN CN201980014329.4A patent/CN111801780A/zh active Pending
- 2019-03-04 JP JP2020568951A patent/JP7293258B2/ja active Active
- 2019-05-28 US US16/501,731 patent/US11296237B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170032977A1 (en) * | 2015-07-31 | 2017-02-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Redistribution lines having stacking vias |
JP2017225100A (ja) * | 2015-07-31 | 2017-12-21 | 株式会社半導体エネルギー研究所 | 半導体装置、表示モジュール、及び電子機器 |
JP2020508587A (ja) * | 2017-02-21 | 2020-03-19 | 日本テキサス・インスツルメンツ合同会社 | 高周波数応用例のためのヘテロ構造相互接続 |
Also Published As
Publication number | Publication date |
---|---|
US11296237B2 (en) | 2022-04-05 |
WO2019169392A1 (en) | 2019-09-06 |
JP7293258B2 (ja) | 2023-06-19 |
CN111801780A (zh) | 2020-10-20 |
EP3759732A4 (en) | 2021-04-28 |
EP3759732A1 (en) | 2021-01-06 |
US20190288122A1 (en) | 2019-09-19 |
US10304967B1 (en) | 2019-05-28 |
WO2019169392A8 (en) | 2020-04-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7229871B2 (en) | Integrated circuit containing polysilicon gate transistors and fully silicidized metal gate transistors | |
CN103022102B (zh) | 用于超薄界面介电层的多层清除金属栅极堆叠件 | |
US7615840B2 (en) | Device performance improvement using flowfill as material for isolation structures | |
TW569451B (en) | Process for fabricating a vertical bipolar junction transistor, process for fabricating an integrated circuit structure, and integrated circuit structure | |
US8685818B2 (en) | Method of forming a shallow trench isolation embedded polysilicon resistor | |
US10714474B2 (en) | High voltage CMOS with triple gate oxide | |
US9698211B2 (en) | High sheet resistor in CMOS flow | |
US7749847B2 (en) | CMOS integration scheme employing a silicide electrode and a silicide-germanide alloy electrode | |
TW201239984A (en) | Semiconductor device with doped inter-level dielectric layers and method of fabrication thereof | |
TW201318149A (zh) | 高電壓裝置 | |
TWI233165B (en) | Semiconductor device fabrication method | |
US20060134844A1 (en) | Method for fabricating dual work function metal gates | |
TW201011818A (en) | Method of fabricating a semiconductor device | |
US7514317B2 (en) | Strained semiconductor device and method of making same | |
CN110783409B (zh) | 具有低闪烁噪声的半导体装置和其形成方法 | |
JP7293258B2 (ja) | 半導体層の上のグラフェン及びボロン窒化物ヘテロ構造デバイスの統合 | |
US8273645B2 (en) | Method to attain low defectivity fully silicided gates | |
TW200949938A (en) | Method of manufacturing semiconductor device | |
JPWO2008117430A1 (ja) | 半導体装置の製造方法、半導体装置 | |
TW201731101A (zh) | 半導體裝置 | |
US20050106833A1 (en) | Semiconductor device having metal silicide layer on source/drain region and gate electrode and method of manufacturing the same | |
US20220375856A1 (en) | Integration scheme to build resistor, capacitor, efuse using silicon-rich dielectric layer as a base dielectric | |
JP2009059758A (ja) | 半導体装置及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20200902 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20210218 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210323 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210602 |
|
A625 | Written request for application examination (by other person) |
Free format text: JAPANESE INTERMEDIATE CODE: A625 Effective date: 20220302 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220307 |
|
RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7421 Effective date: 20220518 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230322 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230331 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230509 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230607 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7293258 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |