JP2021517359A5 - - Google Patents
Info
- Publication number
- JP2021517359A5 JP2021517359A5 JP2020547186A JP2020547186A JP2021517359A5 JP 2021517359 A5 JP2021517359 A5 JP 2021517359A5 JP 2020547186 A JP2020547186 A JP 2020547186A JP 2020547186 A JP2020547186 A JP 2020547186A JP 2021517359 A5 JP2021517359 A5 JP 2021517359A5
- Authority
- JP
- Japan
- Prior art keywords
- chambers
- substrate
- individually controllable
- carrier head
- flexible film
- Prior art date
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862641950P | 2018-03-12 | 2018-03-12 | |
| US62/641,950 | 2018-03-12 | ||
| PCT/US2019/021045 WO2019177842A1 (en) | 2018-03-12 | 2019-03-06 | Filtering during in-situ monitoring of polishing |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| JP2021517359A JP2021517359A (ja) | 2021-07-15 |
| JPWO2019177842A5 JPWO2019177842A5 (https=) | 2022-03-14 |
| JP2021517359A5 true JP2021517359A5 (https=) | 2022-03-14 |
| JP7237083B2 JP7237083B2 (ja) | 2023-03-10 |
Family
ID=67842927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020547186A Active JP7237083B2 (ja) | 2018-03-12 | 2019-03-06 | 研磨のインシトゥモニタリングにおけるフィルタリング |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US11446783B2 (https=) |
| JP (1) | JP7237083B2 (https=) |
| KR (2) | KR102853782B1 (https=) |
| CN (1) | CN111316403B (https=) |
| TW (2) | TWI805703B (https=) |
| WO (1) | WO2019177842A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019177842A1 (en) | 2018-03-12 | 2019-09-19 | Applied Materials, Inc. | Filtering during in-situ monitoring of polishing |
| EP4182119A4 (en) * | 2020-07-14 | 2024-08-07 | Applied Materials, Inc. | METHOD FOR DETECTING NON-CONFORMING SUBSTRATE PROCESSING EVENTS DURING CHEMICAL MECHANICAL POLISHING |
| KR102747336B1 (ko) * | 2021-03-03 | 2024-12-31 | 어플라이드 머티어리얼스, 인코포레이티드 | 공간 분해능을 제공하기 위한 모터 토크 모니터링 동안의 압력 신호들 |
| JP2023124546A (ja) * | 2022-02-25 | 2023-09-06 | 株式会社荏原製作所 | 研磨装置および研磨装置における研磨終点検出方法 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5213655A (en) * | 1990-05-16 | 1993-05-25 | International Business Machines Corporation | Device and method for detecting an end point in polishing operation |
| US5069002A (en) | 1991-04-17 | 1991-12-03 | Micron Technology, Inc. | Apparatus for endpoint detection during mechanical planarization of semiconductor wafers |
| EP0616362A3 (en) * | 1993-03-15 | 1995-06-21 | Tokyo Shibaura Electric Co | Process for polishing workpieces and device therefor. |
| JP3431115B2 (ja) | 1995-03-28 | 2003-07-28 | アプライド マテリアルズ インコーポレイテッド | ケミカルメカニカルポリシングの操作をインシチュウでモニタするための装置及び方法 |
| JP2953387B2 (ja) | 1996-08-12 | 1999-09-27 | 日本電気株式会社 | ウェハの研磨装置及びウェハの研磨方法 |
| US5865665A (en) | 1997-02-14 | 1999-02-02 | Yueh; William | In-situ endpoint control apparatus for semiconductor wafer polishing process |
| US6230069B1 (en) * | 1998-06-26 | 2001-05-08 | Advanced Micro Devices, Inc. | System and method for controlling the manufacture of discrete parts in semiconductor fabrication using model predictive control |
| JP2000218518A (ja) * | 1999-02-01 | 2000-08-08 | Nec Corp | 研磨装置 |
| US6464824B1 (en) | 1999-08-31 | 2002-10-15 | Micron Technology, Inc. | Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| JP2001198813A (ja) | 2000-01-13 | 2001-07-24 | Toshiba Corp | 研磨装置及びその研磨方法 |
| DE60116757T4 (de) * | 2000-05-19 | 2007-01-18 | Applied Materials, Inc., Santa Clara | Verfahren und vorrichtung zur "in-situ" überwachung der dicke während des chemisch-mechanischen planiervorganges |
| US7087527B2 (en) | 2002-08-28 | 2006-08-08 | Micron Technology, Inc. | Extended kalman filter incorporating offline metrology |
| US7226339B2 (en) | 2005-08-22 | 2007-06-05 | Applied Materials, Inc. | Spectrum based endpointing for chemical mechanical polishing |
| CN101511539B (zh) * | 2006-09-12 | 2012-08-22 | 株式会社荏原制作所 | 研磨装置及研磨方法 |
| US20130065493A1 (en) * | 2011-08-09 | 2013-03-14 | Taro Takahashi | Polishing monitoring method, polishing end point detection method, and polishing apparatus |
| US9308618B2 (en) * | 2012-04-26 | 2016-04-12 | Applied Materials, Inc. | Linear prediction for filtering of data during in-situ monitoring of polishing |
| US9551567B2 (en) | 2013-10-25 | 2017-01-24 | Applied Materials, Inc. | Reducing noise in spectral data from polishing substrates |
| JP6030041B2 (ja) * | 2013-11-01 | 2016-11-24 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
| US9375824B2 (en) * | 2013-11-27 | 2016-06-28 | Applied Materials, Inc. | Adjustment of polishing rates during substrate polishing with predictive filters |
| US9490186B2 (en) | 2013-11-27 | 2016-11-08 | Applied Materials, Inc. | Limiting adjustment of polishing rates during substrate polishing |
| WO2019177842A1 (en) | 2018-03-12 | 2019-09-19 | Applied Materials, Inc. | Filtering during in-situ monitoring of polishing |
-
2019
- 2019-03-06 WO PCT/US2019/021045 patent/WO2019177842A1/en not_active Ceased
- 2019-03-06 JP JP2020547186A patent/JP7237083B2/ja active Active
- 2019-03-06 KR KR1020247017724A patent/KR102853782B1/ko active Active
- 2019-03-06 US US16/294,382 patent/US11446783B2/en active Active
- 2019-03-06 CN CN201980005581.9A patent/CN111316403B/zh active Active
- 2019-03-06 KR KR1020207028579A patent/KR102670962B1/ko active Active
- 2019-03-08 TW TW108107710A patent/TWI805703B/zh active
- 2019-03-08 TW TW112119455A patent/TWI885376B/zh active
-
2022
- 2022-08-11 US US17/886,386 patent/US11679466B2/en active Active
-
2023
- 2023-05-17 US US18/198,587 patent/US11969855B2/en active Active
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