JP2021517359A5 - - Google Patents

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Publication number
JP2021517359A5
JP2021517359A5 JP2020547186A JP2020547186A JP2021517359A5 JP 2021517359 A5 JP2021517359 A5 JP 2021517359A5 JP 2020547186 A JP2020547186 A JP 2020547186A JP 2020547186 A JP2020547186 A JP 2020547186A JP 2021517359 A5 JP2021517359 A5 JP 2021517359A5
Authority
JP
Japan
Prior art keywords
chambers
substrate
individually controllable
carrier head
flexible film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020547186A
Other languages
English (en)
Japanese (ja)
Other versions
JP7237083B2 (ja
JP2021517359A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2019/021045 external-priority patent/WO2019177842A1/en
Publication of JP2021517359A publication Critical patent/JP2021517359A/ja
Publication of JP2021517359A5 publication Critical patent/JP2021517359A5/ja
Application granted granted Critical
Publication of JP7237083B2 publication Critical patent/JP7237083B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2020547186A 2018-03-12 2019-03-06 研磨のインシトゥモニタリングにおけるフィルタリング Active JP7237083B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862641950P 2018-03-12 2018-03-12
US62/641,950 2018-03-12
PCT/US2019/021045 WO2019177842A1 (en) 2018-03-12 2019-03-06 Filtering during in-situ monitoring of polishing

Publications (3)

Publication Number Publication Date
JP2021517359A JP2021517359A (ja) 2021-07-15
JP2021517359A5 true JP2021517359A5 (https=) 2022-03-14
JP7237083B2 JP7237083B2 (ja) 2023-03-10

Family

ID=67842927

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020547186A Active JP7237083B2 (ja) 2018-03-12 2019-03-06 研磨のインシトゥモニタリングにおけるフィルタリング

Country Status (6)

Country Link
US (3) US11446783B2 (https=)
JP (1) JP7237083B2 (https=)
KR (2) KR102670962B1 (https=)
CN (1) CN111316403B (https=)
TW (2) TWI885376B (https=)
WO (1) WO2019177842A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102670962B1 (ko) 2018-03-12 2024-05-31 어플라이드 머티어리얼스, 인코포레이티드 연마의 인-시튜 모니터링 동안의 필터링
CN115943016A (zh) * 2020-07-14 2023-04-07 应用材料公司 在化学机械抛光期间检测不合格衬底处理事件的方法
KR20240161701A (ko) * 2021-03-03 2024-11-12 어플라이드 머티어리얼스, 인코포레이티드 공간 분해능을 제공하기 위한 모터 토크 모니터링 동안의 압력 신호들
JP2023124546A (ja) * 2022-02-25 2023-09-06 株式会社荏原製作所 研磨装置および研磨装置における研磨終点検出方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5213655A (en) * 1990-05-16 1993-05-25 International Business Machines Corporation Device and method for detecting an end point in polishing operation
US5069002A (en) 1991-04-17 1991-12-03 Micron Technology, Inc. Apparatus for endpoint detection during mechanical planarization of semiconductor wafers
EP0616362A3 (en) * 1993-03-15 1995-06-21 Tokyo Shibaura Electric Co Process for polishing workpieces and device therefor.
DE69635816T2 (de) 1995-03-28 2006-10-12 Applied Materials, Inc., Santa Clara Verfahren zum Herstellen einer Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen Planiervorgängen
JP2953387B2 (ja) * 1996-08-12 1999-09-27 日本電気株式会社 ウェハの研磨装置及びウェハの研磨方法
US5865665A (en) 1997-02-14 1999-02-02 Yueh; William In-situ endpoint control apparatus for semiconductor wafer polishing process
US6230069B1 (en) 1998-06-26 2001-05-08 Advanced Micro Devices, Inc. System and method for controlling the manufacture of discrete parts in semiconductor fabrication using model predictive control
JP2000218518A (ja) 1999-02-01 2000-08-08 Nec Corp 研磨装置
US6464824B1 (en) 1999-08-31 2002-10-15 Micron Technology, Inc. Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
JP2001198813A (ja) * 2000-01-13 2001-07-24 Toshiba Corp 研磨装置及びその研磨方法
DE60132385T2 (de) * 2000-05-19 2008-05-15 Applied Materials, Inc., Santa Clara Polierkissen
US7087527B2 (en) 2002-08-28 2006-08-08 Micron Technology, Inc. Extended kalman filter incorporating offline metrology
US7306507B2 (en) 2005-08-22 2007-12-11 Applied Materials, Inc. Polishing pad assembly with glass or crystalline window
JP5283506B2 (ja) * 2006-09-12 2013-09-04 株式会社荏原製作所 研磨装置および研磨方法
US20130065493A1 (en) * 2011-08-09 2013-03-14 Taro Takahashi Polishing monitoring method, polishing end point detection method, and polishing apparatus
US9308618B2 (en) * 2012-04-26 2016-04-12 Applied Materials, Inc. Linear prediction for filtering of data during in-situ monitoring of polishing
US9551567B2 (en) * 2013-10-25 2017-01-24 Applied Materials, Inc. Reducing noise in spectral data from polishing substrates
JP6030041B2 (ja) * 2013-11-01 2016-11-24 株式会社荏原製作所 研磨装置および研磨方法
US9490186B2 (en) * 2013-11-27 2016-11-08 Applied Materials, Inc. Limiting adjustment of polishing rates during substrate polishing
US9375824B2 (en) 2013-11-27 2016-06-28 Applied Materials, Inc. Adjustment of polishing rates during substrate polishing with predictive filters
KR102670962B1 (ko) 2018-03-12 2024-05-31 어플라이드 머티어리얼스, 인코포레이티드 연마의 인-시튜 모니터링 동안의 필터링

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