JP2021533273A5 - - Google Patents

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Publication number
JP2021533273A5
JP2021533273A5 JP2021506503A JP2021506503A JP2021533273A5 JP 2021533273 A5 JP2021533273 A5 JP 2021533273A5 JP 2021506503 A JP2021506503 A JP 2021506503A JP 2021506503 A JP2021506503 A JP 2021506503A JP 2021533273 A5 JP2021533273 A5 JP 2021533273A5
Authority
JP
Japan
Prior art keywords
substrate
substrate base
base
electrodes
thin film
Prior art date
Application number
JP2021506503A
Other languages
English (en)
Japanese (ja)
Other versions
JP7564088B2 (ja
JPWO2020033122A5 (https=
JP2021533273A (ja
Filing date
Publication date
Priority claimed from US16/057,383 external-priority patent/US20200048770A1/en
Application filed filed Critical
Publication of JP2021533273A publication Critical patent/JP2021533273A/ja
Publication of JP2021533273A5 publication Critical patent/JP2021533273A5/ja
Publication of JPWO2020033122A5 publication Critical patent/JPWO2020033122A5/ja
Priority to JP2024166834A priority Critical patent/JP7793012B2/ja
Application granted granted Critical
Publication of JP7564088B2 publication Critical patent/JP7564088B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2021506503A 2018-08-07 2019-07-19 アーク発生を防止または抑制するための化学蒸着ツール Active JP7564088B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024166834A JP7793012B2 (ja) 2018-08-07 2024-09-26 アーク発生を防止または抑制するための化学蒸着ツール

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/057,383 US20200048770A1 (en) 2018-08-07 2018-08-07 Chemical vapor deposition tool for preventing or suppressing arcing
US16/057,383 2018-08-07
PCT/US2019/042575 WO2020033122A1 (en) 2018-08-07 2019-07-19 Chemical vapor deposition tool for preventing or suppressing arcing

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024166834A Division JP7793012B2 (ja) 2018-08-07 2024-09-26 アーク発生を防止または抑制するための化学蒸着ツール

Publications (4)

Publication Number Publication Date
JP2021533273A JP2021533273A (ja) 2021-12-02
JP2021533273A5 true JP2021533273A5 (https=) 2022-07-22
JPWO2020033122A5 JPWO2020033122A5 (https=) 2022-07-22
JP7564088B2 JP7564088B2 (ja) 2024-10-08

Family

ID=69405586

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021506503A Active JP7564088B2 (ja) 2018-08-07 2019-07-19 アーク発生を防止または抑制するための化学蒸着ツール
JP2024166834A Active JP7793012B2 (ja) 2018-08-07 2024-09-26 アーク発生を防止または抑制するための化学蒸着ツール

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024166834A Active JP7793012B2 (ja) 2018-08-07 2024-09-26 アーク発生を防止または抑制するための化学蒸着ツール

Country Status (6)

Country Link
US (2) US20200048770A1 (https=)
JP (2) JP7564088B2 (https=)
KR (2) KR20260011771A (https=)
CN (2) CN112567072A (https=)
TW (1) TW202018122A (https=)
WO (1) WO2020033122A1 (https=)

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US10388493B2 (en) * 2011-09-16 2019-08-20 Lam Research Corporation Component of a substrate support assembly producing localized magnetic fields
US11749554B2 (en) 2020-11-05 2023-09-05 Sandisk Technologies Llc Multi-wafer deposition tool for reducing residual deposition on transfer blades and methods of operating the same
US12136225B2 (en) * 2022-09-09 2024-11-05 Applied Materials, Inc. Clog detection via image analytics
US12476091B2 (en) * 2023-04-18 2025-11-18 Tokyo Electron Limited Electrostatic chuck and method of operation for plasma processing
JP2024172480A (ja) * 2023-05-31 2024-12-12 株式会社Kokusai Electric 基板処理方法、半導体装置の製造方法、基板処理装置及びプログラム

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US5573597A (en) * 1995-06-07 1996-11-12 Sony Corporation Plasma processing system with reduced particle contamination
US6108189A (en) * 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
US5737177A (en) * 1996-10-17 1998-04-07 Applied Materials, Inc. Apparatus and method for actively controlling the DC potential of a cathode pedestal
US5933314A (en) * 1997-06-27 1999-08-03 Lam Research Corp. Method and an apparatus for offsetting plasma bias voltage in bi-polar electro-static chucks
US6304424B1 (en) * 1998-04-03 2001-10-16 Applied Materials Inc. Method and apparatus for minimizing plasma destabilization within a semiconductor wafer processing system
US6104596A (en) 1998-04-21 2000-08-15 Applied Materials, Inc. Apparatus for retaining a subtrate in a semiconductor wafer processing system and a method of fabricating same
US7199327B2 (en) * 2002-06-28 2007-04-03 Tokyo Electron Limited Method and system for arc suppression in a plasma processing system
US7276122B2 (en) * 2004-04-21 2007-10-02 Mattson Technology, Inc. Multi-workpiece processing chamber
US20070042131A1 (en) * 2005-08-22 2007-02-22 Applied Materials, Inc., A Delaware Corporation Non-intrusive plasma monitoring system for arc detection and prevention for blanket CVD films
JP4674177B2 (ja) * 2006-03-15 2011-04-20 株式会社日立ハイテクノロジーズ プラズマ処理装置
US7864502B2 (en) * 2007-05-15 2011-01-04 International Business Machines Corporation In situ monitoring of wafer charge distribution in plasma processing
US7667944B2 (en) * 2007-06-29 2010-02-23 Praxair Technology, Inc. Polyceramic e-chuck
CN101779269B (zh) * 2008-07-23 2014-05-07 新动力等离子体株式会社 多工件处理室以及包括该多工件处理室的工件处理系统
TWI495536B (zh) * 2008-10-20 2015-08-11 創意科技股份有限公司 Electrostatic suction cup inspection method and electrostatic sucker device
US8908348B2 (en) * 2009-09-01 2014-12-09 Hermes Microvision, Inc. Wafer grounding and biasing method, apparatus, and application
US9076831B2 (en) * 2011-11-04 2015-07-07 Lam Research Corporation Substrate clamping system and method for operating the same
US20130240147A1 (en) * 2012-03-19 2013-09-19 Sang Ki Nam Methods and apparatus for selectively modulating azimuthal non-uniformity in a plasma processing system
JP2014075398A (ja) * 2012-10-03 2014-04-24 Tokyo Electron Ltd プラズマ処理方法及びプラズマ処理装置
KR102168064B1 (ko) * 2013-02-20 2020-10-20 도쿄엘렉트론가부시키가이샤 플라즈마 처리 장치 및 플라즈마 처리 방법
US9593421B2 (en) * 2013-11-06 2017-03-14 Applied Materials, Inc. Particle generation suppressor by DC bias modulation
GB201321463D0 (en) * 2013-12-05 2014-01-22 Oxford Instr Nanotechnology Tools Ltd Electrostatic clamping method and apparatus
US20180233321A1 (en) * 2017-02-16 2018-08-16 Lam Research Corporation Ion directionality esc
US11289355B2 (en) * 2017-06-02 2022-03-29 Lam Research Corporation Electrostatic chuck for use in semiconductor processing

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