KR102853782B1 - 연마의 인-시튜 모니터링 동안의 필터링 - Google Patents

연마의 인-시튜 모니터링 동안의 필터링

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Publication number
KR102853782B1
KR102853782B1 KR1020247017724A KR20247017724A KR102853782B1 KR 102853782 B1 KR102853782 B1 KR 102853782B1 KR 1020247017724 A KR1020247017724 A KR 1020247017724A KR 20247017724 A KR20247017724 A KR 20247017724A KR 102853782 B1 KR102853782 B1 KR 102853782B1
Authority
KR
South Korea
Prior art keywords
signal
polishing
monitoring system
filtered
paragraph
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020247017724A
Other languages
English (en)
Korean (ko)
Other versions
KR20240093966A (ko
Inventor
시바쿠마르 드한다파니
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20240093966A publication Critical patent/KR20240093966A/ko
Application granted granted Critical
Publication of KR102853782B1 publication Critical patent/KR102853782B1/ko
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Anticipated expiration legal-status Critical

Links

Classifications

    • H01L21/304—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • H01L21/31051—
    • H01L21/67092—
    • H01L21/67253—
    • H01L21/67276—
    • H01L21/76819—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/092—Manufacture or treatment of dielectric parts thereof by smoothing the dielectric parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49085—CMP end point analysis, measure parameters on points to detect end of polishing process

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Automation & Control Theory (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
KR1020247017724A 2018-03-12 2019-03-06 연마의 인-시튜 모니터링 동안의 필터링 Active KR102853782B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201862641950P 2018-03-12 2018-03-12
US62/641,950 2018-03-12
PCT/US2019/021045 WO2019177842A1 (en) 2018-03-12 2019-03-06 Filtering during in-situ monitoring of polishing
KR1020207028579A KR102670962B1 (ko) 2018-03-12 2019-03-06 연마의 인-시튜 모니터링 동안의 필터링

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020207028579A Division KR102670962B1 (ko) 2018-03-12 2019-03-06 연마의 인-시튜 모니터링 동안의 필터링

Publications (2)

Publication Number Publication Date
KR20240093966A KR20240093966A (ko) 2024-06-24
KR102853782B1 true KR102853782B1 (ko) 2025-09-03

Family

ID=67842927

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020247017724A Active KR102853782B1 (ko) 2018-03-12 2019-03-06 연마의 인-시튜 모니터링 동안의 필터링
KR1020207028579A Active KR102670962B1 (ko) 2018-03-12 2019-03-06 연마의 인-시튜 모니터링 동안의 필터링

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020207028579A Active KR102670962B1 (ko) 2018-03-12 2019-03-06 연마의 인-시튜 모니터링 동안의 필터링

Country Status (6)

Country Link
US (3) US11446783B2 (https=)
JP (1) JP7237083B2 (https=)
KR (2) KR102853782B1 (https=)
CN (1) CN111316403B (https=)
TW (2) TWI805703B (https=)
WO (1) WO2019177842A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019177842A1 (en) 2018-03-12 2019-09-19 Applied Materials, Inc. Filtering during in-situ monitoring of polishing
EP4182119A4 (en) * 2020-07-14 2024-08-07 Applied Materials, Inc. METHOD FOR DETECTING NON-CONFORMING SUBSTRATE PROCESSING EVENTS DURING CHEMICAL MECHANICAL POLISHING
KR102747336B1 (ko) * 2021-03-03 2024-12-31 어플라이드 머티어리얼스, 인코포레이티드 공간 분해능을 제공하기 위한 모터 토크 모니터링 동안의 압력 신호들
JP2023124546A (ja) * 2022-02-25 2023-09-06 株式会社荏原製作所 研磨装置および研磨装置における研磨終点検出方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015085487A (ja) 2013-11-01 2015-05-07 株式会社荏原製作所 研磨装置および研磨方法
JP2015519740A (ja) 2012-04-26 2015-07-09 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 研磨のインシトゥ監視時にデータをフィルタリングするための線形予測
JP2016538728A (ja) 2013-11-27 2016-12-08 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板研磨中の研磨速度の制限的調整

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US5213655A (en) * 1990-05-16 1993-05-25 International Business Machines Corporation Device and method for detecting an end point in polishing operation
US5069002A (en) 1991-04-17 1991-12-03 Micron Technology, Inc. Apparatus for endpoint detection during mechanical planarization of semiconductor wafers
EP0616362A3 (en) * 1993-03-15 1995-06-21 Tokyo Shibaura Electric Co Process for polishing workpieces and device therefor.
JP3431115B2 (ja) 1995-03-28 2003-07-28 アプライド マテリアルズ インコーポレイテッド ケミカルメカニカルポリシングの操作をインシチュウでモニタするための装置及び方法
JP2953387B2 (ja) 1996-08-12 1999-09-27 日本電気株式会社 ウェハの研磨装置及びウェハの研磨方法
US5865665A (en) 1997-02-14 1999-02-02 Yueh; William In-situ endpoint control apparatus for semiconductor wafer polishing process
US6230069B1 (en) * 1998-06-26 2001-05-08 Advanced Micro Devices, Inc. System and method for controlling the manufacture of discrete parts in semiconductor fabrication using model predictive control
JP2000218518A (ja) * 1999-02-01 2000-08-08 Nec Corp 研磨装置
US6464824B1 (en) 1999-08-31 2002-10-15 Micron Technology, Inc. Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
JP2001198813A (ja) 2000-01-13 2001-07-24 Toshiba Corp 研磨装置及びその研磨方法
DE60116757T4 (de) * 2000-05-19 2007-01-18 Applied Materials, Inc., Santa Clara Verfahren und vorrichtung zur "in-situ" überwachung der dicke während des chemisch-mechanischen planiervorganges
US7087527B2 (en) 2002-08-28 2006-08-08 Micron Technology, Inc. Extended kalman filter incorporating offline metrology
US7226339B2 (en) 2005-08-22 2007-06-05 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
CN101511539B (zh) * 2006-09-12 2012-08-22 株式会社荏原制作所 研磨装置及研磨方法
US20130065493A1 (en) * 2011-08-09 2013-03-14 Taro Takahashi Polishing monitoring method, polishing end point detection method, and polishing apparatus
US9551567B2 (en) 2013-10-25 2017-01-24 Applied Materials, Inc. Reducing noise in spectral data from polishing substrates
US9375824B2 (en) * 2013-11-27 2016-06-28 Applied Materials, Inc. Adjustment of polishing rates during substrate polishing with predictive filters
WO2019177842A1 (en) 2018-03-12 2019-09-19 Applied Materials, Inc. Filtering during in-situ monitoring of polishing

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Publication number Priority date Publication date Assignee Title
JP2015519740A (ja) 2012-04-26 2015-07-09 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 研磨のインシトゥ監視時にデータをフィルタリングするための線形予測
JP2015085487A (ja) 2013-11-01 2015-05-07 株式会社荏原製作所 研磨装置および研磨方法
JP2016538728A (ja) 2013-11-27 2016-12-08 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板研磨中の研磨速度の制限的調整

Also Published As

Publication number Publication date
TW201946135A (zh) 2019-12-01
US20230286105A1 (en) 2023-09-14
WO2019177842A1 (en) 2019-09-19
US11446783B2 (en) 2022-09-20
TW202336853A (zh) 2023-09-16
US20220388113A1 (en) 2022-12-08
KR102670962B1 (ko) 2024-05-31
JP7237083B2 (ja) 2023-03-10
CN111316403B (zh) 2024-12-13
TWI805703B (zh) 2023-06-21
US11969855B2 (en) 2024-04-30
CN111316403A (zh) 2020-06-19
KR20240093966A (ko) 2024-06-24
US11679466B2 (en) 2023-06-20
KR20200120745A (ko) 2020-10-21
US20190275633A1 (en) 2019-09-12
JP2021517359A (ja) 2021-07-15
TWI885376B (zh) 2025-06-01

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