JP2021514545A - 両面処理のためのパターニングされた真空チャック - Google Patents
両面処理のためのパターニングされた真空チャック Download PDFInfo
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- JP2021514545A JP2021514545A JP2020544293A JP2020544293A JP2021514545A JP 2021514545 A JP2021514545 A JP 2021514545A JP 2020544293 A JP2020544293 A JP 2020544293A JP 2020544293 A JP2020544293 A JP 2020544293A JP 2021514545 A JP2021514545 A JP 2021514545A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
Abstract
Description
[0001]本開示の実施形態は、概して基板チャックに関する。より具体的には、本書に記載の実施形態は、パターニングされた真空チャックに関する。
[0002]基板チャック装置は、一般的に、半導体及びディスプレイ関連の産業において、基板の移送中又は処理中に基板を支持するために使用される。新興技術は、基板上にデバイス及び構造物を製造するための様々な先進的処理技法の発展をもたらしてきた。例えば、仮想現実及び拡張現実関連の応用のための導波管装置の製造により、従来型の基板処理技法の限界が広げられてきた。
Claims (15)
- チャック面及び前記チャック面の反対側の底面を有する本体であって、前記本体内に形成された、前記チャック面から凹化している複数のキャビティを有し、前記複数のキャビティの対が複数の第1導管と流体連結している、本体と、
前記本体内に形成された複数の第2導管であって、そのうちの1つは前記複数のキャビティのうちの一部の間に形成される、複数の第2導管とを備える、基板チャック装置であって、前記キャビティの対の中の圧力は個別に制御される、基板チャック装置。 - 前記本体が金属材料である、請求項1に記載の装置。
- 前記複数のキャビティの各々が、前記キャビティの底部から延在する支持部材を含む、請求項1に記載の装置。
- 前記複数の第1導管が、導管の第1の対及び導管の第2の対を含む、請求項1に記載の装置。
- 前記導管の第1の対が、前記複数のキャビティのうちの、キャビティの第1の対と流体連結しており、前記導管の第2の対が、前記複数のキャビティのうちの、キャビティの第2の対と流体連結している、請求項4に記載の装置。
- 前記導管の第1の対が第1真空源と流体連結しており、前記導管の第2の対が第2真空源と流体連結している、請求項4に記載の装置。
- 前記第1真空源は前記第2真空源とは異なる、請求項6に記載の装置。
- 前記複数の第2導管の各々が、前記チャック面に形成された開口に連結される、請求項1に記載の装置。
- 各開口が、前記チャック面に形成された溝パターン内に形成される、請求項8に記載の装置。
- チャック面を有する円形本体と、
前記チャック面に形成された複数のキャビティと、
各々が前記チャック面に形成された表面ポートに連結された、複数の第1導管と、
前記複数のキャビティの第1の対に連結された第2導管と、
前記複数のキャビティの第2の対に連結された第3導管と、
前記複数のキャビティの第3の対に連結された第4導管とを備える、基板チャック装置であって、前記キャビティの対の各々の中の圧力は個別に制御される、基板チャック装置。 - 前記チャック面が溝パターンを備える、請求項10に記載の装置。
- 前記表面ポートが前記溝パターンと流体連結している、請求項11に記載の装置。
- 前記溝パターンが前記複数のキャビティのうちの一部を取り囲む、請求項11に記載の装置。
- 前記複数のキャビティの各々が、前記キャビティの底部から延在する支持部材を含む、請求項10に記載の装置。
- 前記円形本体が金属材料である、請求項10に記載の装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2022111504A JP2022160438A (ja) | 2018-02-20 | 2022-07-12 | 両面処理のためのパターニングされた真空チャック |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862632867P | 2018-02-20 | 2018-02-20 | |
US62/632,867 | 2018-02-20 | ||
PCT/US2019/015569 WO2019164640A1 (en) | 2018-02-20 | 2019-01-29 | Patterned vacuum chuck for double-sided processing |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2022111504A Division JP2022160438A (ja) | 2018-02-20 | 2022-07-12 | 両面処理のためのパターニングされた真空チャック |
Publications (2)
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JP2021514545A true JP2021514545A (ja) | 2021-06-10 |
JP7105900B2 JP7105900B2 (ja) | 2022-07-25 |
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JP2020544293A Active JP7105900B2 (ja) | 2018-02-20 | 2019-01-29 | 両面処理のためのパターニングされた真空チャック |
JP2022111504A Pending JP2022160438A (ja) | 2018-02-20 | 2022-07-12 | 両面処理のためのパターニングされた真空チャック |
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JP2022111504A Pending JP2022160438A (ja) | 2018-02-20 | 2022-07-12 | 両面処理のためのパターニングされた真空チャック |
Country Status (7)
Country | Link |
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US (2) | US20190259648A1 (ja) |
EP (1) | EP3756215A4 (ja) |
JP (2) | JP7105900B2 (ja) |
KR (2) | KR102369694B1 (ja) |
CN (1) | CN111742402A (ja) |
TW (2) | TWI741257B (ja) |
WO (1) | WO2019164640A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US20220319903A1 (en) * | 2021-03-31 | 2022-10-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method for substrate handling |
US20240027896A1 (en) * | 2022-07-25 | 2024-01-25 | Applied Materials, Inc. | Advanced-packaging high-volume-mode digital-lithography-tool |
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- 2019-01-29 KR KR1020227006538A patent/KR102434811B1/ko active IP Right Grant
- 2019-01-29 EP EP19757895.8A patent/EP3756215A4/en active Pending
- 2019-01-29 JP JP2020544293A patent/JP7105900B2/ja active Active
- 2019-01-29 WO PCT/US2019/015569 patent/WO2019164640A1/en unknown
- 2019-01-29 US US16/260,675 patent/US20190259648A1/en not_active Abandoned
- 2019-01-29 CN CN201980014108.7A patent/CN111742402A/zh active Pending
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2020
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Also Published As
Publication number | Publication date |
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US20200373188A1 (en) | 2020-11-26 |
JP2022160438A (ja) | 2022-10-19 |
TWI741257B (zh) | 2021-10-01 |
JP7105900B2 (ja) | 2022-07-25 |
KR20200112998A (ko) | 2020-10-05 |
KR102434811B1 (ko) | 2022-08-22 |
WO2019164640A1 (en) | 2019-08-29 |
US11222809B2 (en) | 2022-01-11 |
KR102369694B1 (ko) | 2022-03-04 |
KR20220031747A (ko) | 2022-03-11 |
TW202141682A (zh) | 2021-11-01 |
EP3756215A4 (en) | 2021-11-10 |
CN111742402A (zh) | 2020-10-02 |
US20190259648A1 (en) | 2019-08-22 |
TWI773370B (zh) | 2022-08-01 |
EP3756215A1 (en) | 2020-12-30 |
TW201943015A (zh) | 2019-11-01 |
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