JP2021503178A - 導電性パターンの製造法 - Google Patents
導電性パターンの製造法 Download PDFInfo
- Publication number
- JP2021503178A JP2021503178A JP2020526488A JP2020526488A JP2021503178A JP 2021503178 A JP2021503178 A JP 2021503178A JP 2020526488 A JP2020526488 A JP 2020526488A JP 2020526488 A JP2020526488 A JP 2020526488A JP 2021503178 A JP2021503178 A JP 2021503178A
- Authority
- JP
- Japan
- Prior art keywords
- receiving layer
- substrate
- white
- pattern
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
- B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/0047—Digital printing on surfaces other than ordinary paper by ink-jet printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/32—Inkjet printing inks characterised by colouring agents
- C09D11/322—Pigment inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/40—Ink-sets specially adapted for multi-colour inkjet printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/54—Inks based on two liquids, one liquid being the ink, the other liquid being a reaction solution, a fixer or a treatment solution for the ink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/125—Inorganic compounds, e.g. silver salt
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Nanotechnology (AREA)
- Dispersion Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Pest Control & Pesticides (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Ink Jet Recording Methods And Recording Media Thereof (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP17201474 | 2017-11-14 | ||
| EP17201474.8 | 2017-11-14 | ||
| PCT/EP2018/065063 WO2019096450A1 (en) | 2017-11-14 | 2018-06-07 | A method of manufacturing a conductive pattern |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2021503178A true JP2021503178A (ja) | 2021-02-04 |
| JP2021503178A5 JP2021503178A5 (enExample) | 2021-03-18 |
Family
ID=60574364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020526488A Pending JP2021503178A (ja) | 2017-11-14 | 2018-06-07 | 導電性パターンの製造法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11236249B2 (enExample) |
| EP (1) | EP3711460A1 (enExample) |
| JP (1) | JP2021503178A (enExample) |
| KR (1) | KR20200071100A (enExample) |
| CN (1) | CN111345119A (enExample) |
| WO (1) | WO2019096450A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023053925A1 (ja) * | 2021-09-30 | 2023-04-06 | 富士フイルム株式会社 | インクジェット記録用インク及びインクジェット記録方法 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7153228B2 (ja) * | 2018-10-31 | 2022-10-14 | セイコーエプソン株式会社 | 放射線硬化型インク組成物及び記録方法 |
| JP7338167B2 (ja) | 2019-02-28 | 2023-09-05 | セイコーエプソン株式会社 | インク組成物 |
| EP3725853A1 (en) * | 2019-04-19 | 2020-10-21 | Agfa-Gevaert Nv | A method of manufacturing a conductive pattern |
| WO2023136828A1 (en) * | 2022-01-13 | 2023-07-20 | Kao Corporation | Inkjet inks for metallic printed images |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000234075A (ja) * | 1999-02-16 | 2000-08-29 | Toppan Forms Co Ltd | 紙基材への熱硬化導電性インキの定着方法 |
| JP2004056106A (ja) * | 2002-05-28 | 2004-02-19 | Fuji Photo Film Co Ltd | 導電性パターン材料、金属微粒子パターン材料及びパターン形成方法 |
| JP2005081335A (ja) * | 2003-09-11 | 2005-03-31 | Seiko Epson Corp | パターン形成方法、導電性薄膜、電気光学装置、電子機器 |
| JP2013010236A (ja) * | 2011-06-29 | 2013-01-17 | Seiko Epson Corp | インクジェット記録装置および記録物 |
| JP2013241507A (ja) * | 2012-05-18 | 2013-12-05 | Mitsubishi Paper Mills Ltd | 導電性インク組成物および導電性部材 |
| JP2014154778A (ja) * | 2013-02-12 | 2014-08-25 | Noritake Co Ltd | ペースト組成物と太陽電池 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6867539B1 (en) * | 2000-07-12 | 2005-03-15 | 3M Innovative Properties Company | Encapsulated organic electronic devices and method for making same |
| US7065910B2 (en) * | 2003-11-20 | 2006-06-27 | Woodruff Michael A | Illuminated display device |
| JP3916638B2 (ja) * | 2004-12-02 | 2007-05-16 | 日東電工株式会社 | 粘着型光学フィルムおよび画像表示装置 |
| PL1911814T5 (pl) | 2006-10-11 | 2023-12-11 | Agfa Nv | Sposoby sporządzania zestawów utwardzalnych pigmentowanych tuszów do druku atramentowego |
| US20100328223A1 (en) * | 2009-06-30 | 2010-12-30 | Nokia Corporation | Apparatus and associated methods |
| EP2468827B1 (en) | 2010-12-21 | 2014-03-12 | Agfa-Gevaert | A dispersion comprising metallic, metal oxide or metal precursor nanoparticles |
| WO2012134200A2 (ko) * | 2011-03-29 | 2012-10-04 | 주식회사 엘지화학 | 유기전자소자용 기판 |
| EP2671927B1 (en) | 2012-06-05 | 2021-06-02 | Agfa-Gevaert Nv | A metallic nanoparticle dispersion |
| DE102013104577B3 (de) * | 2013-05-03 | 2014-07-24 | Heraeus Noblelight Gmbh | Vorrichtung zum Trocknen und Sintern metallhaltiger Tinte auf einem Substrat |
| JPWO2014185256A1 (ja) * | 2013-05-17 | 2017-02-23 | コニカミノルタ株式会社 | 導電性樹脂基板の製造方法 |
| EP2821164A1 (en) | 2013-07-04 | 2015-01-07 | Agfa-Gevaert | A metallic nanoparticle dispersion |
| US9839961B2 (en) | 2013-07-04 | 2017-12-12 | Agfa Gevaert | Metallic nanoparticle dispersion |
| US20150202846A1 (en) * | 2014-01-17 | 2015-07-23 | Pleotint, L.L.C. | Reflective and conductive coatings directly on pvb |
| EP3017960B1 (en) | 2014-11-05 | 2017-07-19 | Agfa Graphics Nv | Inkjet printing of pearlescent and metallic colours |
| EP3037161B1 (en) | 2014-12-22 | 2021-05-26 | Agfa-Gevaert Nv | A metallic nanoparticle dispersion |
| EP3099146B1 (en) | 2015-05-27 | 2020-11-04 | Agfa-Gevaert | Method of preparing a silver layer or pattern comprising a step of applying a silver nanoparticle dispersion |
| TWI746465B (zh) * | 2015-10-13 | 2021-11-21 | 美商康寧公司 | 可彎式電子裝置模組、物品及其製造方法 |
-
2018
- 2018-06-07 US US16/762,171 patent/US11236249B2/en active Active
- 2018-06-07 JP JP2020526488A patent/JP2021503178A/ja active Pending
- 2018-06-07 CN CN201880073805.5A patent/CN111345119A/zh active Pending
- 2018-06-07 WO PCT/EP2018/065063 patent/WO2019096450A1/en not_active Ceased
- 2018-06-07 EP EP18728649.7A patent/EP3711460A1/en not_active Withdrawn
- 2018-06-07 KR KR1020207013610A patent/KR20200071100A/ko not_active Ceased
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000234075A (ja) * | 1999-02-16 | 2000-08-29 | Toppan Forms Co Ltd | 紙基材への熱硬化導電性インキの定着方法 |
| JP2004056106A (ja) * | 2002-05-28 | 2004-02-19 | Fuji Photo Film Co Ltd | 導電性パターン材料、金属微粒子パターン材料及びパターン形成方法 |
| JP2005081335A (ja) * | 2003-09-11 | 2005-03-31 | Seiko Epson Corp | パターン形成方法、導電性薄膜、電気光学装置、電子機器 |
| JP2013010236A (ja) * | 2011-06-29 | 2013-01-17 | Seiko Epson Corp | インクジェット記録装置および記録物 |
| JP2013241507A (ja) * | 2012-05-18 | 2013-12-05 | Mitsubishi Paper Mills Ltd | 導電性インク組成物および導電性部材 |
| JP2014154778A (ja) * | 2013-02-12 | 2014-08-25 | Noritake Co Ltd | ペースト組成物と太陽電池 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023053925A1 (ja) * | 2021-09-30 | 2023-04-06 | 富士フイルム株式会社 | インクジェット記録用インク及びインクジェット記録方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3711460A1 (en) | 2020-09-23 |
| US11236249B2 (en) | 2022-02-01 |
| KR20200071100A (ko) | 2020-06-18 |
| WO2019096450A1 (en) | 2019-05-23 |
| CN111345119A (zh) | 2020-06-26 |
| US20200362186A1 (en) | 2020-11-19 |
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| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200514 |
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| A621 | Written request for application examination |
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| A977 | Report on retrieval |
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