JP2021138851A - 塗布型有機膜形成用組成物、パターン形成方法、重合体および重合体の製造方法 - Google Patents
塗布型有機膜形成用組成物、パターン形成方法、重合体および重合体の製造方法 Download PDFInfo
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- JP2021138851A JP2021138851A JP2020038165A JP2020038165A JP2021138851A JP 2021138851 A JP2021138851 A JP 2021138851A JP 2020038165 A JP2020038165 A JP 2020038165A JP 2020038165 A JP2020038165 A JP 2020038165A JP 2021138851 A JP2021138851 A JP 2021138851A
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Abstract
Description
このような好ましい重合体を含む組成物は、溶剤溶解性を向上させるのみならず、詳細な理由は不明であるが、40nmより微細で高アスペクトなラインパターンにおけるドライエッチング後のよれがより発生しない有機膜を形成することができる。
このような範囲の重量平均分子量を有する重合体を含む有機膜形成用組成物であれば、有機溶剤への溶解性を損なわず、ベーク時のアウトガスを抑制できるものとなる。
前記有機溶剤が前記混合物であれば、前記重合体に高沸点溶剤の添加による有機膜の熱流動性が付与されることで、有機膜形成用組成物は、より高度な埋め込み/平坦化特性を併せ持つものとなる。
このような添加剤を含む有機膜形成用組成物であれば、塗布性、埋め込み/平坦化特性のより優れたものとなる。
前記無機ハードマスクをCVD法あるいはALD法によって形成すると、被加工基板に微細なパターンをより高精度で形成することができる。
前記レジスト上層膜に回路パターンを形成する方法として前記方法を用いると、被加工基板に微細なパターンをより高精度で形成することができる。
現像方法として、アルカリ現像または有機溶剤による現像を用いると、被加工基板に微細なパターンをより高精度で形成することができる。
本発明では、前記被加工体として、例えば、前記のものを用いることができる。
前記金属としてこれらのものを用いることができる。
このような好ましい重合体を用いることにより、溶剤溶解性を向上させるのみならず、詳細な理由は不明であるが、40nmより微細で高アスペクトなラインパターンにおけるドライエッチング後のよれがより発生しない有機膜を形成することができる。
このような範囲の重量平均分子量を有する重合体を含む有機膜形成用組成物であれば、有機溶剤への溶解性を損なわず、ベーク時のアウトガスを抑制できるものとなる。
この製造方法によると、上記一般式(1)で示される部分構造を有する重合体を製造することができる。
この製造方法によると、前記W2が前記有機基である上記一般式(2)で示される部分構造を有する重合体を製造することができる。
この製造方法によると、前記W2が前記有機基である上記一般式(2)で示される部分構造を有する重合体を製造することができる。
この製造方法によると、前記W2が水酸基または炭素数1〜10のアルキルオキシ基である上記一般式(2)で示される部分構造を有する重合体を製造することができる。
この製造方法によると、上記一般式(3)で示される部分構造を有する重合体を製造することができる。
この製造方法によると、上記一般式(3)で示される部分構造を有する重合体を製造することができる。
本発明は、下記一般式(1)で示される構造を部分構造とするものであることを特徴とする重合体である。
[一般式(1)の部分構造を有する重合体]
本発明の一般式(1)で示される構造を部分構造とする重合体の製造方法の一例として、下記に示す3級アルコール基を有するフルオレノール類、すなわちアリール基W1および3級アルコール基を有するフルオレノール類をモノマーとして用いた、脱水を伴うフルオレン環への親電子置換反応を例示できる。下記式中のAr1、Ar2およびW1は前記と同じである。
{W2が芳香環を有する有機基である重合体}
本発明の一般式(2)で示される部分構造を有する重合体は、W2が少なくとも1つの芳香環を有する場合、一般式(1)で示される部分構造を有する重合体を製造する原料であるフルオレノール類と有機基W2を部分構造として有する化合物とを共重合する方法、または一般式(1)で示される部分構造を有する重合体の反応中に有機基W2を部分構造として有する化合物を添加し末端封止する方法などにより製造することができる。下記式中のAr1、Ar2、W1、W2は前記と同じである。
また、本発明の一般式(2)で示される部分構造を有する重合体は、W2が水酸基または炭素数1〜10のアルキルオキシ基である場合、反応系内に水またはアルコールを予め添加、または反応中に水またはアルコールを添加することで製造することができる。下記式中のRは水素原子または炭素数1〜10のアルキル基である。すなわち、下記式中の基ORは、式(2)におけるW2である。Ar1、Ar2、W1は前記と同じである。
本発明の一般式(3)で示される部分構造を有する重合体は、一般式(1)で示される部分構造を有する重合体を製造する原料であるフルオレノール類と2級アルコール基を有するフルオレノール類とを一括で仕込み共重合する方法、または一般式(1)で示される部分構造を有する重合体の原料である第1のフルオレノール類若しくは2級アルコール基を有する第2のフルオレノール類を1段階目に重合後、1段階目とは別のフルオレノール類を2段階目に追加して重合する方法などが挙げられる。また2段階で重合を行う場合、1段階目または2段階目の重合には複数のフルオレノールを混合して用いることも可能であり、さらに3段階目、4段階目と同一または他のフルオレノール類をさらに追加して重合することもできる。
また、本発明では、一般式(1)もしくは(2)で示される部分構造、または一般式(1)もしくは(2)で示される部分構造と一般式(3)で示される部分構造とを有する重合体、及び有機溶剤を含有する塗布型有機膜形成用組成物を提供する。なお、本発明の塗布型有機膜形成用組成物において、一般式(1)もしくは(2)で示される部分構造、または一般式(1)もしくは(2)で示される部分構造と一般式(3)で示される部分構造とを有する重合体を、単独又は複数組み合わせて用いることができる。
本発明の塗布型有機膜形成用組成物において使用可能な有機溶剤としては、一般式(1)もしくは(2)で示される部分構造、または一般式(1)もしくは(2)で示される部分構造と一般式(3)で示される部分構造とを有する重合体と、任意成分、例えば以下に説明する酸発生剤、架橋剤、その他添加剤等とが溶解するものであれば特に制限はない。具体的には、特開2007−199653号公報中の(0091)〜(0092)段落に記載されている溶剤などの沸点が160℃未満の溶剤を使用することができる。中でも、プロピレングリコールモノメチルエーテルアセテート、プロピレングリコールモノメチルエーテル、2−ヘプタノン、シクロペンタノン、シクロヘキサノン及びこれらのうち2種以上の混合物が好ましく用いられる。
本発明の塗布型有機膜形成用組成物においては、硬化反応を更に促進させるために酸発生剤を添加することができる。酸発生剤は熱分解によって酸を発生するものや、光照射によって酸を発生するものがあるが、いずれのものも添加することができる。具体的には、特開2007−199653号公報中の(0061)〜(0085)段落に記載されている材料を添加することができるがこれらに限定されない。
本発明の塗布型有機膜形成用組成物を用いて、リソグラフィーで用いられる多層レジスト膜のレジスト下層膜又は半導体製造用平坦化膜として機能する有機膜を形成することができる。
なお、このレジスト下層膜又は半導体装置製造用平坦化膜等の有機膜の厚さは適宜選定されるが、30〜20,000nmとすることが好ましく、50〜15,000nmとすることがより好ましい。
本発明では、このような塗布型有機膜形成用組成物を用いた3層レジストプロセスによるパターン形成方法として、被加工基板にパターンを形成する方法であって、少なくとも、被加工体上に、本発明の有機膜形成用組成物を用いて有機膜を形成する工程、該有機膜の上に、ケイ素含有レジスト下層膜材料を用いてケイ素含有レジスト下層膜を形成する工程、該ケイ素含有レジスト下層膜の上に、フォトレジスト組成物を用いてレジスト上層膜を形成する工程、該レジスト上層膜に回路パターンを形成する工程、該パターンが形成された前記レジスト上層膜をマスクにして前記ケイ素含有レジスト下層膜をエッチングして、該ケイ素含有レジスト下層膜にパターンを転写する工程、該パターンが転写された前記ケイ素含有レジスト下層膜をマスクにして前記有機膜をエッチングして、該有機膜にパターンを転写する工程、および該パターンが転写された前記有機膜をマスクにして前記被加工体をエッチングして、該被加工体にパターンを形成する工程を含むパターン形成方法を提供する。
3層レジストプロセスの場合、図1(A)に示したように、基板1の上に積層された被加工層2上に本発明の有機膜形成用組成物を用いて有機膜3を形成した後、ケイ素含有レジスト下層膜4を形成し、その上にレジスト上層膜5を形成する。
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A1):Mw=2700、Mw/Mn=1.39
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A2):Mw=2780、Mw/Mn=1.35
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A3):Mw=2810、Mw/Mn=1.36
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A4):Mw=2900、Mw/Mn=1.38
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A5):Mw=2950、Mw/Mn=1.40
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A6):Mw=2890、Mw/Mn=1.39
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A7):Mw=2870、Mw/Mn=1.38
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A8):Mw=2920、Mw/Mn=1.41
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A9):Mw=2890、Mw/Mn=1.38
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A10):Mw=1520、Mw/Mn=1.25
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A11):Mw=1630、Mw/Mn=1.22
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A12):Mw=1420、Mw/Mn=1.19
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A13):Mw=2020、Mw/Mn=1.24
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A14):Mw=2200、Mw/Mn=1.27
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A15):Mw=2890、Mw/Mn=1.60
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A16):Mw=1520、Mw/Mn=1.24
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A17):Mw=1850、Mw/Mn=1.26
[合成例18]化合物(A18)の合成
1H−NMR(600MHz in DMSO−d6 ):δ=6.29 (2H,−OH,s),6.83(4H,d),7.20−7.25(12H,m),7.33−7.36(4H,m),7.79(4H,d)ppm。
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(R1):Mw=2130、Mw/Mn=2.61
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(R2):Mw=966、Mw/Mn=1.09
前記重合体(A1)〜(A17)、重合体(R1)および化合物(R2)の何れかと、架橋剤として(A18)または(XL1)とを、酸発生剤(AG1)0.05質量%、界面活性剤FC−4430(住友スリーエム(株)製)0.1質量%を含む溶媒中に表1および2に示す割合で溶解させ、0.1μmのフッ素樹脂製のフィルターで濾過することによって、塗布型有機膜形成用組成物(材料)(UDL−1〜20、比較UDL−1〜3)をそれぞれ調製した。溶媒としては、プロピレングリコールモノメチルエーテルアセテート(PGMEA)、シクロヘキサノン(CyHO)および/または1,2,4−トリメチルベンゼン(TMB)を表1および2に示す割合で用いた。なお、UDL−19、比較UDL−1および比較UDL−3には、架橋剤を含ませなかった。
上記で調製した有機膜形成用組成物(UDL−1〜20、比較UDL−1〜3)をシリコン基板上に塗布し、大気中350℃で60秒間焼成した後、膜厚を測定した。次いで、塗布膜上にPGMEA溶媒をディスペンスし、30秒間放置しスピンドライし、100℃で60秒間ベークしてPGMEAを蒸発させた(PGMEA処理)。処理後、膜厚を測定した。PGMEA処理前後の膜厚差を、処理前の膜厚aに対する処理後の膜厚bの割合(残膜率)として求めた。これらの結果を表3に示す。
上記の有機膜形成用組成物(UDL−1〜20、比較UDL−3)を、それぞれシリコンウエハー基板上に塗布し、大気中350℃で60秒焼成した。それぞれ115nmの有機膜を形成し、下記条件でCF4/CHF3系ガスでのエッチング試験を行った。またこのとき、東京エレクトロン製エッチング装置Teliusを用い、エッチング前後の有機膜の膜厚差を求めた。結果を表4に合わせて示す。
チャンバー圧力40.0Pa
RFパワー1,000W
CF4ガス流量100sccm
CHF3ガス流量10sccm
Heガス流量200sccm
時間20sec
CF4/CHF3系ガスでのエッチング試験と同様に、有機膜形成用組成物(UDL−1〜20、比較UDL−3)をシリコン基板上に塗布して、大気中350℃で60秒焼成した。それぞれ115nmの有機膜を形成し、下記条件でO2系ガスでのエッチング試験を行った。またこのとき、東京エレクトロン製エッチング装置Teliusを用い、エッチング前後の有機膜の膜厚差を求めた。結果を表4に合わせて示す。
チャンバー圧力40.0Pa
RFパワー100W
O2ガス流量30sccm
N2ガス流量70sccm
時間20sec
上記の有機膜形成用組成物(UDL−1〜20、比較UDL−1〜3)を、それぞれシリコンウエハー基板上に塗布し、大気中350℃で60秒間焼成し、有機膜を形成した。その上にSOG−1を塗布して220℃で60秒間ベークして膜厚35nmのレジスト下層膜を形成し、その上にレジスト上層膜材料のArF用単層レジストを塗布し、105℃で60秒間ベークして膜厚100nmのフォトレジスト膜を形成した。フォトレジスト膜上に液浸保護膜材料(TC−1)を塗布し90℃で60秒間ベークし膜厚50nmの保護膜を形成した。
チャンバー圧力10.0Pa
RFパワー500W
CF4ガス流量150sccm
CHF3ガス流量50sccm
時間15sec
チャンバー圧力2.0Pa
RFパワー1000W
N2ガス流量80sccm
CO2ガス流量200sccm
COガス流量100sccm
時間60sec
チャンバー圧力15.0Pa
RFパワー500W
CF4ガス流量150sccm
CHF3ガス流量30sccm
時間120sec
トレンチパターン(トレンチ幅10μm、トレンチ深さ0.10μm)を有するSiO2ウエハー基板上に、上記の有機膜形成用組成物(UDL−1〜20、比較UDL−1〜3)をそれぞれ塗布し、大気中350℃で60秒間焼成した以外は、パターン形成試験1と同じ方法で積層膜を形成し、パターニング、ドライエッチングを行ない、出来上がったパターンの形状を観察した。その結果を以下の表8に示す。
上記の有機膜形成用組成物(UDL1〜20、比較UDL2)をそれぞれシリコンウエハー基板上に塗布し、大気中350℃で60秒焼成した後、形成した有機膜の表面をKLA−Tencor社製暗視野欠陥検査装置SP2で60nm以上の大きさの塗布欠陥を計測した。
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A15):Mw=2890、Mw/Mn=1.60
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A16):Mw=1520、Mw/Mn=1.24
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A17):Mw=1850、Mw/Mn=1.26
Claims (27)
- 前記W2が、前記有機基であり、窒素原子を含むものであることを特徴とする請求項2に記載の塗布型有機膜形成用組成物。
- 前記重合体の重量平均分子量が、500〜5000であることを特徴とする請求項1〜4のいずれか1項に記載の塗布型有機膜形成用組成物。
- 前記有機溶剤は、沸点が160℃未満の有機溶剤1種以上と、沸点が160℃以上の有機溶剤1種以上との混合物であることを特徴とする請求項1〜5のいずれか1項に記載の塗布型有機膜形成用組成物。
- 更に、酸発生剤、架橋剤、界面活性剤および可塑剤のうち1種以上を含有するものであることを特徴とする請求項1〜6のいずれか1項に記載の塗布型有機膜形成用組成物。
- パターン形成方法であって、
被加工体上に、請求項1〜7の何れか1項に記載の塗布型有機膜形成用組成物を用いて有機膜を形成し、
該有機膜の上に、ケイ素含有レジスト下層膜材料を用いてケイ素含有レジスト下層膜を形成し、
該ケイ素含有レジスト下層膜の上に、フォトレジスト組成物を用いてレジスト上層膜を形成し、
該レジスト上層膜に回路パターンを形成し、
該パターンが形成された前記レジスト上層膜をマスクにして前記ケイ素含有レジスト下層膜をエッチングして、該ケイ素含有レジスト下層膜にパターンを転写し、
該パターンが転写された前記ケイ素含有レジスト下層膜をマスクにして前記有機膜をエッチングして、該有機膜にパターンを転写し、
さらに、該パターンが転写された前記有機膜をマスクにして前記被加工体をエッチングして、該被加工体にパターンを形成することを特徴とするパターン形成方法。 - パターン形成方法であって、
被加工体上に、請求項1〜7のいずれか1項に記載の塗布型有機膜形成用組成物を用いて有機膜を形成し、
該有機膜の上に、ケイ素含有レジスト下層膜材料を用いてケイ素含有レジスト下層膜を形成し、
該ケイ素含有レジスト下層膜の上に、有機反射防止膜を形成し、
該有機反射防止膜上に、フォトレジスト組成物を用いてレジスト上層膜を形成して4層膜構造とし、
該レジスト上層膜に回路パターンを形成し、
該パターンが形成された前記レジスト上層膜をマスクにして前記有機反射防止膜および前記ケイ素含有レジスト下層膜をエッチングして、該有機反射防止膜および該ケイ素含有レジスト下層膜にパターンを転写し、
該パターンが転写された前記ケイ素含有レジスト下層膜をマスクにして前記有機膜をエッチングして、該有機膜にパターンを転写し、
さらに、該パターンが転写された前記有機膜をマスクにして前記被加工体をエッチングして、該被加工体にパターンを形成することを特徴とするパターン形成方法。 - パターン形成方法であって、
被加工体上に、請求項1〜7のいずれか1項に記載の塗布型有機膜形成用組成物を用いて有機膜を形成し、
該有機膜の上に、ケイ素酸化膜、ケイ素窒化膜およびケイ素酸化窒化膜から選ばれる無機ハードマスクを形成し、
該無機ハードマスクの上に、フォトレジスト組成物を用いてレジスト上層膜を形成し、
該レジスト上層膜に回路パターンを形成し、
該パターンが形成された前記レジスト上層膜をマスクにして前記無機ハードマスクをエッチングして、該無機ハードマスクにパターンを転写し、
該パターンが転写された前記無機ハードマスクをマスクにして前記有機膜をエッチングして、該有機膜にパターンを転写し、
さらに、該パターンが転写された有機膜をマスクにして前記被加工体をエッチングして、該被加工体にパターンを形成することを特徴とするパターン形成方法。 - パターン形成方法であって、
被加工体上に、請求項1〜7のいずれか1項に記載の塗布型有機膜形成用組成物を用いて有機膜を形成し、
該有機膜の上に、ケイ素酸化膜、ケイ素窒化膜およびケイ素酸化窒化膜から選ばれる無機ハードマスクを形成し、
該無機ハードマスクの上に、有機反射防止膜を形成し、
該有機反射防止膜上に、フォトレジスト組成物を用いてレジスト上層膜を形成して4層膜構造とし、
該レジスト上層膜に回路パターンを形成し、
該パターンが形成された前記レジスト上層膜をマスクにして前記有機反射防止膜および前記無機ハードマスクをエッチングして、該有機反射防止膜および該無機ハードマスクにパターンを転写し、
該パターンが形成された前記無機ハードマスクをマスクにして前記有機膜をエッチングして、該有機膜にパターンを転写し、
さらに、該パターンが形成された前記有機膜をマスクにして前記被加工体をエッチングして、該被加工体にパターンを形成することを特徴とするパターン形成方法。 - 前記無機ハードマスクが、CVD法あるいはALD法によって形成されることを特徴とする請求項10または11に記載のパターン形成方法。
- 前記レジスト上層膜のパターン形成方法が、波長が10nm以上300nm以下の光を用いた光リソグラフィー、電子線による直接描画、ナノインプリンティングまたはこれらの組み合わせによるパターン形成であることを特徴とする請求項8〜12のいずれか1項に記載のパターン形成方法。
- 前記レジスト上層膜のパターン形成方法が、アルカリ現像または有機溶剤による現像を含むことを特徴とする請求項8〜13のいずれか1項に記載のパターン形成方法。
- 前記被加工体が、半導体装置基板、金属膜、金属炭化膜、金属酸化膜、金属窒化膜、金属酸化炭化膜または金属酸化窒化膜であることを特徴とする請求項8〜14に記載のパターン形成方法。
- 前記被加工体が、ケイ素、チタン、タングステン、ハフニウム、ジルコニウム、クロム、ゲルマニウム、銅、銀、金、アルミニウム、インジウム、ガリウム、ヒ素、パラジウム、鉄、タンタル、イリジウム、モリブデンまたはこれらの合金を含むことを特徴とする請求項8〜15に記載のパターン形成方法。
- 前記W2が、前記有機基であり、窒素原子を含むものであることを特徴とする請求項18に記載の重合体。
- 重量平均分子量が、500〜5000であることを特徴とする請求項17〜20のいずれか1項に記載の重合体。
- 請求項17に記載の重合体の製造方法であって、
前記アリール基W1および3級アルコール基を有するフルオレノール類をモノマーとして用い、脱水を伴うフルオレン環への親電子置換反応によって、前記重合体の合成を行うことを特徴とする重合体の製造方法。 - 請求項18または19に記載の重合体の製造方法であって、
前記W2は前記有機基であり、
前記アリール基W1および3級アルコール基を有するフルオレノール類と、前記有機基W2を部分構造として有する化合物とを共重合して、前記重合体の合成を行うことを特徴とする重合体の製造方法。 - 請求項18または19に記載の重合体の製造方法であって、
前記W2は前記有機基であり、
前記アリール基W1および3級アルコール基を有するフルオレノール類をモノマーとして用い、脱水を伴うフルオレン環への親電子置換反応によって、前記重合体の合成を行い、
前記重合体の合成中に、前記有機基W2を部分構造として有する化合物を添加することを特徴とする重合体の製造方法。 - 請求項18に記載の重合体の製造方法であって、
前記W2は、水酸基または炭素数1〜10のアルキルオキシ基であり、
前記アリール基W1および3級アルコール基を有するフルオレノール類をモノマーとして用い、脱水を伴うフルオレン環への親電子置換反応によって、前記重合体の合成を行い、
前記合成を行う前または反応中に、反応系内に水またはアルコールを添加することを特徴とする重合体の製造方法。 - 請求項20に記載の重合体の製造方法であって、
前記アリール基W1および3級アルコール基を有するフルオレノール類と、2級アルコール基を有するフルオレノール類とを共重合することを特徴とする重合体の製造方法。 - 請求項20に記載の重合体の製造方法であって、
前記アリール基W1および3級アルコール基を有する第1のフルオレノール類、または2級アルコール基を有する第2のフルオレノール類のうちの一方をモノマーとして用い、脱水を伴うフルオレン環への親電子置換反応によって、前記重合体の合成を行って第1の重合体を得、
前記第1の重合体に、前記第1のフルオレノール類および前記第2のフルオレノール類の他方を加えて更に重合を行って、第2の重合体としての請求項20に記載の重合体を得ることを特徴とする重合体の製造方法。
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