JP7401424B2 - 有機膜形成材料、ならびにパターン形成方法および重合体 - Google Patents
有機膜形成材料、ならびにパターン形成方法および重合体 Download PDFInfo
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- JP7401424B2 JP7401424B2 JP2020217018A JP2020217018A JP7401424B2 JP 7401424 B2 JP7401424 B2 JP 7401424B2 JP 2020217018 A JP2020217018 A JP 2020217018A JP 2020217018 A JP2020217018 A JP 2020217018A JP 7401424 B2 JP7401424 B2 JP 7401424B2
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- 239000010703 silicon Substances 0.000 claims description 80
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- 125000001624 naphthyl group Chemical group 0.000 claims description 42
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 42
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Description
(A)下記一般式(1)で示される繰り返し単位を有する重合体および(B)有機溶剤を含有するものである有機膜形成材料を提供する。
被加工基板上に上記の有機膜形成材料を用いて有機膜を形成し、該有機膜の上にケイ素含有レジスト下層膜材料を用いてケイ素含有レジスト下層膜を形成し、該ケイ素含有レジスト下層膜の上にフォトレジスト組成物を用いてレジスト上層膜を形成し、該レジスト上層膜に回路パターンを形成し、該パターンが形成されたレジスト上層膜をマスクにして前記ケイ素含有レジスト下層膜にエッチングでパターン転写し、該パターンが転写されたケイ素含有レジスト下層膜をマスクにして前記有機膜にエッチングでパターン転写し、さらに、該パターンが転写された有機膜をマスクにして前記被加工基板にエッチングでパターンを形成することを特徴とするパターン形成方法を提供する。
被加工基板上に上記の有機膜形成材料を用いて有機膜を形成し、該有機膜の上にケイ素含有レジスト下層膜材料を用いてケイ素含有レジスト下層膜を形成し、該ケイ素含有レジスト下層膜の上に有機反射防止膜(BARC)を形成し、該BARC上にフォトレジスト組成物を用いてレジスト上層膜を形成して4層膜構造とし、該レジスト上層膜に回路パターンを形成し、該パターンが形成されたレジスト上層膜をマスクにして前記BARC膜と前記ケイ素含有レジスト下層膜にエッチングでパターン転写し、該パターンが転写されたケイ素含有レジスト下層膜をマスクにして前記有機膜にエッチングでパターン転写し、さらに、該パターンが転写された有機膜をマスクにして前記被加工基板をエッチングして該被加工基板にパターンを形成するパターン形成方法を提供する。
被加工基板上に上記の有機膜形成材料を用いて有機膜を形成し、該有機膜の上にケイ素酸化膜、ケイ素窒化膜、ケイ素酸化窒化膜から選ばれる無機ハードマスクを形成し、該無機ハードマスクの上にフォトレジスト組成物を用いてレジスト上層膜を形成して、該レジスト上層膜に回路パターンを形成し、該パターンが形成されたレジスト上層膜をマスクにして前記無機ハードマスクにエッチングでパターンを転写し、該パターンが転写された無機ハードマスクをマスクにして前記有機膜にエッチングでパターンを転写し、さらに、該パターンが転写された有機膜をマスクにして前記被加工基板をエッチングして該被加工基板にパターンを形成するパターン形成方法を提供する。
被加工基板上に上記の有機膜形成材料を用いて有機膜を形成し、該有機膜の上にケイ素酸化膜、ケイ素窒化膜、ケイ素酸化窒化膜から選ばれる無機ハードマスクを形成し、該無機ハードマスクの上に有機反射防止膜(BARC)を形成し、該BARC上にフォトレジスト組成物を用いてレジスト上層膜を形成して4層膜構造とし、該レジスト上層膜に回路パターンを形成し、該パターンが形成されたレジスト上層膜をマスクにして前記BARC膜と前記無機ハードマスクにエッチングでパターンを転写し、該パターンが転写された無機ハードマスクをマスクにして前記有機膜にエッチングでパターンを転写し、さらに、該パターンが転写された有機膜をマスクにして前記被加工基板をエッチングして該被加工基板にパターンを形成するパターン形成方法を提供する。
(A)下記一般式(1)で示される繰り返し単位を有する重合体および(B)有機溶剤を含有するものである有機膜形成材料である。
上記一般式(1)中の重合体のAR1、AR2、AR3、AR4で構成されるフルオレン型の部分構造としては下記を例示することができる。これらの芳香環上にはビニル基、エチニル基、エチニルフェニル基、アリル基、プロパルギル基、アリール基、アリルオキシ基、プロパルギルオキシ基などの置換基を有してもよい。下記のうちフルオレン、ベンゾフルオレン構造が原料入手の容易さから好ましい。
本発明の一般式(1)で示される繰り返し単位を有する重合体の製造方法の一例として、下記に示されるW1を部分構造とするジオール化合物とAR1、AR2、AR3、AR4、W2から構成されるフルオレノール類をモノマーとして用いた、脱水を伴う環化反応を繰り返すことにより重合体を合成することができる。縮合によりベンゾピラン構造を形成するためジオールの水酸基はフェノール性水酸基を表し、ジオール化合物は具体的にはカテコール、レゾルシノールなどのベンゼンジオール類や1,5-ジヒドロキシナフタレン、2,6-ジヒドロキシナフタレンなどのナフタレンジオール類、ビスフェノールA、ビスヒドロキシフェニルフルオレンなどのビスフェノール類、ビスヒドロキシナフチルフルオレンなどのビスナフトール類を表す。下記式中のW1、AR1、AR2、AR3、AR4、W2は前記と同じ。
また、本発明では、有機膜形成用の材料であって、(A)上述の本発明の有機膜形成材料用重合体及び(B)有機溶剤を含有する有機膜形成材料を提供する。なお、本発明の有機膜形成材料において、本発明の有機膜形成材料用重合体を単独又は複数組み合わせて用いることができる。
本発明の有機膜形成材料において使用可能な有機溶剤としては、上記の重合体(ベースポリマー)、及び含まれる場合には後述の酸発生剤、架橋剤、その他添加剤等が溶解するものであれば特に制限はない。具体的には、特開2007-199653号公報中の[0091]~[0092]段落に記載されている溶剤などの沸点が180℃未満の溶剤を使用することができる。中でも、プロピレングリコールモノメチルエーテルアセテート、プロピレングリコールモノメチルエーテル、2-ヘプタノン、シクロペンタノン、シクロヘキサノン及びこれらのうち2種以上の混合物が好ましく用いられる。有機溶剤の配合量は、(A)前記重合体100部に対して好ましくは200~10,000部、より好ましくは300~5,000部である。
本発明の有機膜形成材料においては、硬化反応を更に促進させるために(C)酸発生剤を添加することができる。酸発生剤は熱分解によって酸を発生するものや、光照射によって酸を発生するものがあるが、いずれのものも添加することができる。具体的には、特開2007-199653号公報中の[0061]~[0085]段落に記載されている材料を添加することができるがこれらに限定されない。
本発明の有機膜形成材料には、スピンコーティングにおける塗布性を向上させるために(D)界面活性剤を添加することができる。界面活性剤としては、例えば、特開2009-269953号公報中の[0142]~[0147]記載のものを用いることができる。界面活性剤を添加する場合の添加量は、(A)前記重合体100部に対して好ましくは0.01~10部、より好ましくは0.05~5部である。
また、本発明の有機膜形成材料には、硬化性を高め、上層膜とのインターミキシングを更に抑制するために、(E)架橋剤を添加することもできる。架橋剤としては、特に限定されることはなく、公知の種々の系統の架橋剤を広く用いることができる。一例として、メラミン系架橋剤、グリコールウリル系架橋剤、ベンゾグアナミン系架橋剤、ウレア系架橋剤、β-ヒドロキシアルキルアミド系架橋剤、イソシアヌレート系架橋剤、アジリジン系架橋剤、オキサゾリン系架橋剤、エポキシ系架橋剤を例示できる。
また、本発明の有機膜形成材料には、平坦化/埋め込み特性を更に向上させるために、(F)可塑剤を添加することができる。可塑剤としては、特に限定されることはなく、公知の種々の系統の可塑剤を広く用いることができる。一例として、フタル酸エステル類、アジピン酸エステル類、リン酸エステル類、トリメリット酸エステル類、クエン酸エステル類などの低分子化合物、ポリエーテル系、ポリエステル系、特開2013-253227記載のポリアセタール系重合体などのポリマーを例示できる。可塑剤を添加する場合の添加量は、(A)前記重合体100部に対して好ましくは1~100部、より好ましくは5~30部である。
本発明の有機膜形成材料には更に別の化合物やポリマーをブレンドすることもできる。ブレンド用化合物又はブレンド用ポリマーは、本発明の有機膜形成材料と混合し、スピンコーティングの成膜性や、段差を有する基板での埋め込み特性を向上させる役割を持つ。
本発明では、上述の有機膜形成材料を用い、リソグラフィーで用いられる多層レジスト膜の有機膜又は半導体製造用平坦化膜として機能する有機膜を形成する方法を提供する。
本発明では、このような有機膜形成材料を用いた3層レジストプロセスによるパターン形成方法として、被加工基板にパターンを形成する方法であって、少なくとも、被加工基板上に本発明の有機膜形成材料を用いて有機膜を形成し、該有機膜上にケイ素原子を含有するレジスト下層膜材料を用いてケイ素含有レジスト下層膜を形成し、該ケイ素含有レジスト下層膜上にフォトレジスト組成物からなるレジスト上層膜材料を用いてレジスト上層膜を形成して多層レジスト膜とし、上記レジスト上層膜のパターン回路領域を露光した後、現像液で現像して上記レジスト上層膜にレジストパターンを形成し、該得られたレジストパターンをエッチングマスクにして上記ケイ素含有レジスト下層膜にエッチングでパターンを転写し、得られたケイ素含有レジスト下層膜パターンをエッチングマスクにして前記有機膜にエッチングでパターン転写し、さらに得られた有機膜パターンをエッチングマスクにして前記被加工基板にエッチングでパターン転写するパターン形成方法を提供する。
重合体(A1)の合成
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A1):Mw=2700、Mw/Mn=1.58
重合体(A2)の合成
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A2):Mw=3400、Mw/Mn=1.78
重合体(A3)の合成
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A3):Mw=3100、Mw/Mn=1.59
重合体(A4)の合成
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A4):Mw=3200、Mw/Mn=1.51
重合体(A5)の合成
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A5):Mw=3800、Mw/Mn=1.84
重合体(A6)の合成
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A6):Mw=2900、Mw/Mn=1.59
重合体(A7)の合成
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A7):Mw=3200、Mw/Mn=1.67
重合体(A8)の合成
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A8):Mw=3000、Mw/Mn=1.71
重合体(A9)の合成
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A9):Mw=3500、Mw/Mn=1.74
重合体(A10)の合成
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A10):Mw=2900、Mw/Mn=1.53
重合体(A11)の合成
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(A11):Mw=3900、Mw/Mn=2.03
比較例用化合物(R1)の合成
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(R1):Mw=900、Mw/Mn=1.04
比較例用化合物(R2)の合成
GPCにより重量平均分子量(Mw)、分散度(Mw/Mn)を求めたところ、以下のような結果となった。
(R2):Mw=2900、Mw/Mn=1.57
上記重合体(A1)~(A11)および(R1)、(R2)、酸発生剤(AG)、高沸点溶剤として(S1)1,6-ジアセトキシヘキサン:沸点260℃、(S2)トリプロピレングリコールモノメチルエーテル:沸点242℃を用い、PF-6320(オムノバ社製)を0.1質量%含むプロピレングリコールモノメチルエーテルアセテート(PGMEA)を用いて表4に示す割合で溶解させ、0.1μmのフッ素樹脂製のフィルターで濾過することによって有機膜形成材料(UDL-1~17、比較UDL-1~2)をそれぞれ調製した。
上記で調製したUDL-1~17、比較UDL-1~2をシリコン基板上に塗布し、大気中、350℃で60秒間ベークした後、膜厚を測定し、その上にPGMEA溶媒をディスペンスし、30秒間放置しスピンドライ、100℃で60秒間ベークしてPGMEAを蒸発させ、PGMEA処理前後の膜厚を測定した。成膜後の膜厚とPGMEA処理後の膜厚を用いて残膜率を求めた、その結果を表5に示す。
上記の有機膜形成材料(UDL-1~17、比較UDL-1~2)をそれぞれシリコン基板上に塗布し、大気中、350℃で60秒間、焼成して200nmの塗布膜を形成し、膜厚Aを測定した。この基板を更に酸素濃度が0.2%以下に管理された窒素気流下450℃でさらに10分間焼成して膜厚Bを測定した。これらの結果を表6に示す。
上記で調製したUDL-1~17、比較UDL-1~2をシリコン基板上に塗布し、大気中、350℃で60秒間ベークし膜厚200nmの塗布膜を形成した。これらの膜を東陽テクニカ社製ナノインデンターSA2型装置でナノインデンテーション試験を行い、上記塗布膜のハードネスを測定、その結果を表7に示す。
[CF4/CHF3系ガスでのエッチング試験]
上記で調製したUDL-1~17、比較UDL―1~2をシリコン基板上に塗布して、大気中、350℃で60秒間ベークし膜厚200nmになるよう有機膜を形成後、下記条件でCF4/CHF3系ガスでのエッチング試験を行った。この場合、東京エレクトロン株式会社製ドライエッチング装置TE-8500を用いエッチング前後のポリマー膜の膜厚差を求め、エッチング速度(nm/min.)を算出した。結果を表8に示す。
チャンバー圧力 40.0Pa
RFパワー 1,000W
CHF3ガス流量 10ml/min
CF4ガス流量 100ml/min
Heガス流量 200ml/min
時間 20sec
上記と同様にUDL-1~17、比較UDL―1~2をシリコン基板上に塗布して、空気雰囲気下、大気中、350℃で60秒間ベークし、膜厚 200nmになるよう有機膜を形成し、下記条件でO2系ガスでのエッチング試験を行った。この場合、東京エレクトロン株式会社製ドライエッチング装置TE-8500を用い、エッチング前後のポリマー膜の膜厚差を求め、エッチング速度(nm/min.)を算出した。CF4/CHF3系ガスの結果と併せて表8に示す。
チャンバー圧力 40.0Pa
RFパワー 100W
O2ガス流量 30ml/min
N2ガス流量 70ml/min
時間 60sec
上記で調製したUDL-1~17、比較UDL-1~2を膜厚200nmのSiO2膜が形成された直径300mmSiウェハー基板上に塗布し、大気中、350℃で60秒間ベーク後の膜厚200nmになるように有機膜を形成した。その上にケイ素含有レジスト下層膜材料(SOG-1)を塗布して220℃で60秒間ベークして膜厚35nmのケイ素含有レジスト下層膜を形成し、その上にレジスト上層膜材料(ArF用SLレジスト)を塗布し、105℃で60秒間ベークして膜厚100nmのレジスト上層膜を形成した。レジスト上層膜に液浸保護膜(TC-1)を塗布し90℃で60秒間ベークし膜厚50nmの保護膜を形成した。
レジストパターンのSOG膜への転写条件。
チャンバー圧力 10.0Pa
RFパワー 1,500W
CF4ガス流量 15sccm
O2ガス流量 75sccm
時間 15sec
チャンバー圧力 2.0Pa
RFパワー 500W
Arガス流量 75sccm
O2ガス流量 45sccm
時間 120sec
チャンバー圧力 2.0Pa
RFパワー 2,200W
C5F12ガス流量 20sccm
C2F6ガス流量 10sccm
Arガス流量 300sccm
O2ガス流量 60sccm
時間 90sec
有機膜形成材料(UDL-3、5、6、7、9、11~17、比較UDL-2)をそれぞれ、巨大孤立トレンチパターン(トレンチ幅10μm、トレンチ深さ0.10μm)を有するSiO2基板(図2中の8)上に塗布し、大気中、350℃で60秒間焼成した後、トレンチ部分と非トレンチ部分の有機膜(図2中の7)の段差(図2中のdelta)を、パークシステムズ社製NX10原子間力顕微鏡(AFM)を用いて観察した。結果を表13に示す。本評価において、段差が小さいほど、平坦化特性が良好であるといえる。なお、本評価では、深さ0.10μmのトレンチパターンを、膜厚約0.2μmの有機膜形成材料を用いて平坦化しており、平坦化特性の優劣を評価するために厳しい評価条件となっている。
3…有機膜、 3a…有機膜パターン、 4…ケイ素含有レジスト下層膜、
4a…ケイ素含有レジスト下層膜パターン、 5…レジスト上層膜、
5a…レジストパターン、 6…所用部分、 7…有機膜、 8…SiO2基板
delta…段差
Claims (20)
- 前記重合体の重量平均分子量が、500~5000であることを特徴とする請求項1から請求項4のいずれか一項に記載の有機膜形成材料。
- 前記(B)有機溶剤は、沸点が180度未満の有機溶剤1種以上と、沸点が180度以上の有機溶剤1種以上との混合物であることを特徴とする請求項1から請求項5のいずれか一項に記載の有機膜形成材料。
- 更に前記有機膜形成材料が(C)酸発生剤、(D)界面活性剤、(E)架橋剤および(F)可塑剤のうち1種以上を含有するものであることを特徴とする請求項1から請求項6のいずれか一項に記載の有機膜形成材料。
- 被加工基板にパターンを形成する方法であって、
被加工基板上に請求項1から請求項7のいずれか一項に記載の有機膜形成材料を用いて有機膜を形成し、該有機膜の上にケイ素含有レジスト下層膜材料を用いてケイ素含有レジスト下層膜を形成し、該ケイ素含有レジスト下層膜の上にフォトレジスト組成物を用いてレジスト上層膜を形成し、該レジスト上層膜に回路パターンを形成し、該パターンが形成されたレジスト上層膜をマスクにして前記ケイ素含有レジスト下層膜にエッチングでパターン転写し、該パターンが転写されたケイ素含有レジスト下層膜をマスクにして前記有機膜にエッチングでパターン転写し、さらに、該パターンが転写された有機膜をマスクにして前記被加工基板にエッチングでパターンを形成することを特徴とするパターン形成方法。 - 被加工基板にパターンを形成する方法であって、
被加工基板上に請求項1から請求項7のいずれか一項に記載の有機膜形成材料を用いて有機膜を形成し、該有機膜の上にケイ素含有レジスト下層膜材料を用いてケイ素含有レジスト下層膜を形成し、該ケイ素含有レジスト下層膜の上に有機反射防止膜(BARC)を形成し、該BARC上にフォトレジスト組成物を用いてレジスト上層膜を形成して4層膜構造とし、該レジスト上層膜に回路パターンを形成し、該パターンが形成されたレジスト上層膜をマスクにして前記BARC膜と前記ケイ素含有レジスト下層膜にエッチングでパターン転写し、該パターンが転写されたケイ素含有レジスト下層膜をマスクにして前記有機膜にエッチングでパターン転写し、さらに、該パターンが転写された有機膜をマスクにして前記被加工基板をエッチングして該被加工基板にパターンを形成することを特徴とするパターン形成方法。 - 被加工基板にパターンを形成する方法であって、
被加工基板上に請求項1から請求項7のいずれか一項に記載の有機膜形成材料を用いて有機膜を形成し、該有機膜の上にケイ素酸化膜、ケイ素窒化膜、ケイ素酸化窒化膜から選ばれる無機ハードマスクを形成し、該無機ハードマスクの上にフォトレジスト組成物を用いてレジスト上層膜を形成して、該レジスト上層膜に回路パターンを形成し、該パターンが形成されたレジスト上層膜をマスクにして前記無機ハードマスクにエッチングでパターンを転写し、該パターンが転写された無機ハードマスクをマスクにして前記有機膜にエッチングでパターンを転写し、さらに、該パターンが転写された有機膜をマスクにして前記被加工基板をエッチングして該被加工基板にパターンを形成することを特徴とするパターン形成方法。 - 被加工基板にパターンを形成する方法であって、
被加工基板上に請求項1から請求項7のいずれか一項に記載の有機膜形成材料を用いて有機膜を形成し、該有機膜の上にケイ素酸化膜、ケイ素窒化膜、ケイ素酸化窒化膜から選ばれる無機ハードマスクを形成し、該無機ハードマスクの上に有機反射防止膜(BARC)を形成し、該BARC上にフォトレジスト組成物を用いてレジスト上層膜を形成して4層膜構造とし、該レジスト上層膜に回路パターンを形成し、該パターンが形成されたレジスト上層膜をマスクにして前記BARC膜と前記無機ハードマスクにエッチングでパターンを転写し、該パターンが転写された無機ハードマスクをマスクにして前記有機膜にエッチングでパターンを転写し、さらに、該パターンが転写された有機膜をマスクにして前記被加工基板をエッチングして該被加工基板にパターンを形成することを特徴とするパターン形成方法。 - 前記無機ハードマスクを、CVD法あるいはALD法によって形成することを特徴とする請求項10又は請求項11に記載のパターン形成方法。
- 前記レジスト上層膜のパターン形成方法として、波長が10nm以上300nm以下の光リソグラフィー、電子線による直接描画、ナノインプリンティングまたはこれらの組み合わせによるパターン形成とすることを特徴とする請求項8から請求項12のいずれか一項に記載のパターン形成方法。
- 前記パターン形成方法における現像方法を、アルカリ現像または有機溶剤による現像とすることを特徴とする請求項8から請求項13のいずれか一項に記載のパターン形成方法。
- 前記被加工基板を、半導体装置基板、金属膜、金属炭化膜、金属酸化膜、金属窒化膜、金属酸化炭化膜または金属酸化窒化膜とすることを特徴とする請求項8から請求項14のいずれか一項に記載のパターン形成方法。
- 前記金属を、ケイ素、チタン、タングステン、ハフニウム、ジルコニウム、クロム、ゲルマニウム、コバルト、銅、銀、金、アルミニウム、インジウム、ガリウム、ヒ素、パラジウム、鉄、タンタル、イリジウム、マンガン、モリブデン、ルテニウムまたはこれらの合金とすることを特徴とする請求項15に記載のパターン形成方法。
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014145088A (ja) | 2009-10-28 | 2014-08-14 | Transitions Optical Inc | フォトクロミック材料 |
WO2017208796A1 (ja) | 2016-06-03 | 2017-12-07 | Jsr株式会社 | 膜形成用組成物、膜、レジスト下層膜の形成方法、パターニングされた基板の製造方法及び化合物 |
JP2019172605A (ja) | 2018-03-28 | 2019-10-10 | 信越化学工業株式会社 | 化合物、有機膜形成用組成物、半導体装置製造用基板、有機膜の形成方法及びパターン形成方法 |
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JP3774668B2 (ja) | 2001-02-07 | 2006-05-17 | 東京エレクトロン株式会社 | シリコン窒化膜形成装置の洗浄前処理方法 |
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US8142908B2 (en) * | 2003-10-01 | 2012-03-27 | Sumitomo Chemical Company, Limited | Polymer light-emitting material comprising a conjugated polymer and compound exhibiting light emission from the triplet excited state and polymer light-emitting device using the same |
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JP4575214B2 (ja) | 2005-04-04 | 2010-11-04 | 信越化学工業株式会社 | レジスト下層膜材料およびパターン形成方法 |
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JP2008158002A (ja) | 2006-12-20 | 2008-07-10 | Jsr Corp | レジスト下層膜用組成物及びその製造方法 |
JP4569786B2 (ja) | 2008-05-01 | 2010-10-27 | 信越化学工業株式会社 | 新規光酸発生剤並びにこれを用いたレジスト材料及びパターン形成方法 |
JP5336306B2 (ja) | 2008-10-20 | 2013-11-06 | 信越化学工業株式会社 | レジスト下層膜形成方法、これを用いたパターン形成方法、及びレジスト下層膜材料 |
CN103827163A (zh) | 2011-09-30 | 2014-05-28 | 三菱瓦斯化学株式会社 | 具有芴结构的树脂及光刻用下层膜形成材料 |
JP5925721B2 (ja) | 2012-05-08 | 2016-05-25 | 信越化学工業株式会社 | 有機膜材料、これを用いた有機膜形成方法及びパターン形成方法 |
KR101781739B1 (ko) * | 2015-10-07 | 2017-09-25 | 주식회사 엘지화학 | 신규 화합물 및 이를 포함하는 유기 발광 소자 |
JP6726142B2 (ja) * | 2017-08-28 | 2020-07-22 | 信越化学工業株式会社 | 有機膜形成用組成物、半導体装置製造用基板、有機膜の形成方法、パターン形成方法、及び重合体 |
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JP7209588B2 (ja) * | 2019-06-04 | 2023-01-20 | 信越化学工業株式会社 | 有機膜形成用組成物、パターン形成方法及び重合体 |
JP7472011B2 (ja) * | 2020-12-25 | 2024-04-22 | 信越化学工業株式会社 | 有機膜形成材料、パターン形成方法ならびに化合物及び重合体 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014145088A (ja) | 2009-10-28 | 2014-08-14 | Transitions Optical Inc | フォトクロミック材料 |
WO2017208796A1 (ja) | 2016-06-03 | 2017-12-07 | Jsr株式会社 | 膜形成用組成物、膜、レジスト下層膜の形成方法、パターニングされた基板の製造方法及び化合物 |
JP2019172605A (ja) | 2018-03-28 | 2019-10-10 | 信越化学工業株式会社 | 化合物、有機膜形成用組成物、半導体装置製造用基板、有機膜の形成方法及びパターン形成方法 |
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