JP2021092657A - 光トランシーバ - Google Patents
光トランシーバ Download PDFInfo
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- JP2021092657A JP2021092657A JP2019223052A JP2019223052A JP2021092657A JP 2021092657 A JP2021092657 A JP 2021092657A JP 2019223052 A JP2019223052 A JP 2019223052A JP 2019223052 A JP2019223052 A JP 2019223052A JP 2021092657 A JP2021092657 A JP 2021092657A
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- uneven surface
- heat radiating
- housing
- circuit board
- optical transceiver
- Prior art date
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- 230000003287 optical effect Effects 0.000 title claims abstract description 167
- 239000000463 material Substances 0.000 claims abstract description 44
- 238000006073 displacement reaction Methods 0.000 claims 1
- 230000002708 enhancing effect Effects 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 abstract 5
- 239000000835 fiber Substances 0.000 description 18
- 230000017525 heat dissipation Effects 0.000 description 17
- 230000005540 biological transmission Effects 0.000 description 9
- 238000004891 communication Methods 0.000 description 8
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000000243 photosynthetic effect Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Thermal Sciences (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Optical Couplings Of Light Guides (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
最初に本開示の実施形態の内容を列記して説明する。本開示の一実施形態に係る光トランシーバは、長手方向に延びる直方体状の外形を有する光トランシーバであって、第1面を有し、第1面の面上に回路部品が実装された平板状の回路基板と、回路基板の長手方向の一端に嵌合する電気コネクタと、第1面の面上に固定されると共に回路部品に接触する放熱部品と、内部に内部空間を有し、内部空間に回路基板及び放熱部品を内包し、長手方向の一端において電気コネクタを保持する筐体と、を備え、放熱部品は、第1面と平行に第1凹凸面を有し、筐体は、内部に第1凹凸面に対向する第2凹凸面を有し、第1凹凸面及び第2凹凸面は、第1面の法線方向において第1凹凸面の凸部が第2凹凸面の凹部に入り込むと共に、第1凹凸面の凹部に第2凹凸面の凸部が入り込むように配置され、第1凹凸面及び第2凹凸面は、それぞれの側面の間にそれぞれの側面に接触する放熱材が充填されている。
本開示の実施形態に係る光トランシーバの具体例を、以下で図面を参照しながら説明する。なお、本発明は、以降の例示に限定されるものではなく、特許請求の範囲によって示され、特許請求の範囲と均等の範囲内における全ての変更が含まれることが意図される。図面の説明において、同一又は相当する要素には同一の符号を付し、重複する説明を適宜省略する。また、図面は、理解を容易にするため、一部を簡略化又は誇張して描いている場合があり、寸法比率等は図面の記載のものに限定されない。
Claims (5)
- 長手方向に延びる直方体状の外形を有する光トランシーバであって、
第1面を有し、前記第1面の面上に回路部品が実装された平板状の回路基板と、
前記回路基板の前記長手方向の一端に嵌合する電気コネクタと、
前記第1面の面上に固定されると共に前記回路部品に接触する放熱部品と、
内部に内部空間を有し、前記内部空間に前記回路基板及び前記放熱部品を内包し、前記長手方向の一端において前記電気コネクタを保持する筐体と、
を備え、
前記放熱部品は、前記第1面と平行に第1凹凸面を有し、
前記筐体は、前記内部に前記第1凹凸面に対向する第2凹凸面を有し、
前記第1凹凸面及び前記第2凹凸面は、前記第1面の法線方向において前記第1凹凸面の凸部が前記第2凹凸面の凹部に入り込むと共に、前記第1凹凸面の凹部に前記第2凹凸面の凸部が入り込むように配置され、
前記第1凹凸面及び前記第2凹凸面は、それぞれの側面の間にそれぞれの前記側面に接触する放熱材が充填されている、
光トランシーバ。 - 前記放熱材は、可塑性を有し、前記第1凹凸面と前記第2凹凸面との相対的な変位によって加えられる応力に対して変形可能である、
請求項1に記載の光トランシーバ。 - 前記放熱材は、放熱ゲルである、
請求項2に記載の光トランシーバ。 - 前記第1凹凸面及び前記第2凹凸面は、それぞれ前記長手方向に延びている、
請求項1から請求項3のいずれか一項に記載の光トランシーバ。 - 前記第1凹凸面及び前記第2凹凸面の一方は、それぞれ前記第1面の法線方向に延びる複数の柱部によって形成されており、
前記第1凹凸面及び前記第2凹凸面の他方は、前記第1面の法線方向に延びると共に前記複数の柱部のそれぞれが入り込む複数の穴部によって形成されており、
前記複数の柱部、及び前記複数の穴部は、前記長手方向、及び前記長手方向に交差する幅方向のそれぞれに沿って配列されている、
請求項1から請求項4のいずれか一項に記載の光トランシーバ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019223052A JP7500959B2 (ja) | 2019-12-10 | 2019-12-10 | 光トランシーバ |
US17/116,207 US11510325B2 (en) | 2019-12-10 | 2020-12-09 | Optical transceiver |
CN202011448563.9A CN112946834B (zh) | 2019-12-10 | 2020-12-09 | 光收发器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019223052A JP7500959B2 (ja) | 2019-12-10 | 2019-12-10 | 光トランシーバ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021092657A true JP2021092657A (ja) | 2021-06-17 |
JP7500959B2 JP7500959B2 (ja) | 2024-06-18 |
Family
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Family Applications (1)
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JP2019223052A Active JP7500959B2 (ja) | 2019-12-10 | 2019-12-10 | 光トランシーバ |
Country Status (3)
Country | Link |
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US (1) | US11510325B2 (ja) |
JP (1) | JP7500959B2 (ja) |
CN (1) | CN112946834B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024122642A1 (ja) * | 2022-12-09 | 2024-06-13 | 大和電器株式会社 | 配線器具 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220393385A1 (en) * | 2020-02-07 | 2022-12-08 | Bizlink International Corporation | Cable end connector |
US11275223B1 (en) * | 2020-09-04 | 2022-03-15 | Prime World International Holdings Ltd. | Optical transceiver |
CN115903148A (zh) * | 2021-09-22 | 2023-04-04 | 宁波环球广电科技有限公司 | 光收发装置及其退壳机构 |
Citations (5)
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JP2004259977A (ja) * | 2003-02-26 | 2004-09-16 | Hitachi Cable Ltd | 電子回路モジュール |
JP2006237103A (ja) * | 2005-02-23 | 2006-09-07 | Kyocera Corp | 熱伝導部材および電子装置 |
JP2008227331A (ja) * | 2007-03-15 | 2008-09-25 | Hitachi Metals Ltd | 半導体モジュール、これに用いられる回路基板およびその製造方法 |
WO2015013838A1 (en) * | 2013-08-01 | 2015-02-05 | Nokia Solutions And Networks Oy | A heat-dissipation assembly for a heat generating component and related device and method |
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- 2020-12-09 US US17/116,207 patent/US11510325B2/en active Active
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Also Published As
Publication number | Publication date |
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US20210176874A1 (en) | 2021-06-10 |
US11510325B2 (en) | 2022-11-22 |
JP7500959B2 (ja) | 2024-06-18 |
CN112946834A (zh) | 2021-06-11 |
CN112946834B (zh) | 2024-03-08 |
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