WO2015013838A1

WO2015013838A1 - A heat-dissipation assembly for a heat generating component and related device and method

Info

Publication number: WO2015013838A1
Application number: PCT/CN2013/000907
Authority: WO
Inventors: Zengzhen LI; Zhiwei MA
Original assignee: Nokia Solutions And Networks Oy
Priority date: 2013-08-01
Filing date: 2013-08-01
Publication date: 2015-02-05

Abstract

A heat-dissipation assembly (30) for a heat generating component (10) comprises a heat sink (20) with a first gap (3) between a heat transfer surface (11) of the heat generating component (10) and a heat transfer surface (21) of the heat sink (20). The heat-dissipation assembly further comprises: a first heat-dissipation enhancement member (31) thermally coupled to the heating generating component (10), and a second heat-dissipation enhancement member (32) thermally coupled to the heat sink (20) or integrated as part of the heat sink (20). Heat transfer material is filled between said first heat-dissipation enhancement member (31) and said second heat-dissipation enhancement member (32).

Description

A HEAT-DISSIPATION ASSEMBLY FOR A HEAT GENERATING

COMPONENT AND RELATED DEVICE AND METHOD

Technical field

The invention generally relates to heat-dissipation of electronic components, and more particularly, to a heat-dissipation assembly for a heat generating component, an device comprising such heat-dissipation assembly, and a heat-dissipation method for a heat generating component. Background

Electronic components of electronic devices generally generate heat while in use. The generated heat increases the temperature of the electronic components. In this regard, electronic components of electronic devices are also known as heat generating components. Because some components of an electronic device has a maximum operating temperature, if an electronic component is operated at a temperature exceeding the maximum operating temperature, the lifespan of electronic devices will be shortened and the electronic devices may be damaged. Therefore, heat-dissipation of electronic components is necessary.

For electronic components with large heat generating power, we need to connect them to a heat sink. In some products, such as telecom industry, it is not possible to design a line to line direct contact between heat generating components and heat sink. There should be a gap to absorb the tolerance of components and to reduce the pressure applied on the components by compression force.

The prior art solution is to connect the heat generating components and heat sink directly by thermal material. As shown in fig.1 . There is a gap 3 between a heat generating component 1 and a heat sink 3. The gap 3 is filled with heat transfer material (also referred to as thermal material). Even if the gap 3 is filled up with heat transfer material, there is still large thermal resistance and temperature difference between the heat generating component 1 and heat sink 3, which will lead to a higher temperature for the heat generating component 1. As an example, given the size of the heat generating component 1 is 23 *23mm and heat generating power thereof is 15W, in order to absorb the tolerance of the components, the gap 3 is designed as 1. 1 mm. This gap 3 will be filled up with heat transfer material, the normal thermal conductivity of which is about 3W/m*K. The temperature rise caused by the heat transfer material is 12.5 ^°C .

As a result, there is needed a more effective heat-dissipation assembly for a heat generating component. Summary of the Invention

An object of the invention is to provide a more effective heat-dissipation assembly for a heat generating component.

According to one embodiment of the invention, there is provided a heat-dissipation assembly for a heat generating component, comprising: a heat sink with a first gap between a heat transfer surface of the heat generating component and a heat transfer surface of the heat sink;

characterized in that, the heat-dissipation assembly further comprising:

a first heat-dissipation enhancement member thermally coupled to the heating generating component; and

a second heat-dissipation enhancement member thermally coupled to the heat sink or integrated as part of the heat sink,

said first heat-dissipation enhancement member and said second heat-dissipation enhancement member are configured to provide a spacing therebetween in a first direction perpendicular to the heat transfer surface of the heat generating component, and are configured to provide a second gap therebetween in a second direction perpendicular to the first direction, heat transfer material is filled between said first heat-dissipation enhancement member and said second heat-dissipation enhancement member.

Preferably, said first heat-dissipation enhancement member includes a plurality of first fins and a plurality of first grooves located between adjacent first fins, and said second heat-dissipation enhancement member includes a plurality of second fins and a plurality of second grooves located between adjacent second fins, the first fins are disposed in the second grooves, and the second fins are disposed in the first grooves.

Preferably, the first fins have the same overlapped height, spacing and thickness as those of the second fins.

Preferably, the first fins have different overlapped height, spacing and thickness from those of the second fins.

Preferably, at least one of the plurality of first fins has different overlapped height, spacing and thickness from other first fins.

Preferably, at least one of the plurality of second fins has different overlapped height, spacing and thickness from other second fins.

Preferably, the area of the heat transfer surface of the heat generating component is AO, the size of the first gap is SO, effective overlapped area between the first fins and the second fins is Al , the average size of the second gap is S I , and S 1/AKS0/A0.

Preferably, the overlapped height is 2-50 mm, the spacing is 0-2 mm and the thickness is 0.2-5 mm.

Preferably, the overlapped height is 20 mm, the spacing is 0.25 mm and the thickness is 2 mm.

Preferably, the plurality of first fins and the plurality of second fins are each disposed in an array of cylinders, tapers, wedges or cuboids.

Preferably, the plurality of first fins and the plurality of second fins are each disposed in multiple rows of cuboids or multiple rows of wedges.

Preferably, the first fins and the second fins have ring-shaped,

S-shaped or other curved section.

According to another embodiment of the invention, there is provided an electronic device, comprising:

a heat generating component; and

a heat-dissipation assembly including a heat sink with a first gap between a heat transfer surface of the heat generating component and a heat transfer surface of the heat sink; characterized in that, the heat-dissipation assembly further comprising:

According to another embodiment of the invention, there is provided a heat-dissipation method for a heat generating component, comprising: providing a heat sink with a first gap between a heat transfer surface of the heat generating component and a heat transfer surface of the heat sink;

characterized in that, the method further comprising:

providing a first heat-dissipation enhancement member thermally coupled to the heating generating component; and

providing a second heat-dissipation enhancement member thermally coupled to the heat sink or integrated as part of the heat sink,

said first heat-dissipation enhancement member and said second heat-dissipation enhancement member are configured to provide a spacing therebetween in a first direction perpendicular to the heat transfer surface of the heat generating component, and are configured to provide a second gap therebetween in a second direction perpendicular to the first direction, heat transfer material is filled between said first heat-dissipation enhancement member and said second heat-dissipation enhancement member. The second gap between the first heat-dissipation enhancement member of the heat generating component and the second heat-dissipation enhancement member of the heat sink will be as small as possible, thus keeping tight contact between the flat side surfaces of the first heat-dissipation enhancement member and the second heat-dissipation enhancement member. In application, the second gap will be less than 0.2 mm. This will result in better heat-dissipation effects.

The heat transfer area between the first fins of the first heat-dissipation enhancement member of the heat generating component and second fins of the second heat-dissipation enhancement member of the heat sink is increased due to arrangement in an array or multiple rows, thus resulting in much better heat-dissipation effects.

In addition, the spacing between the first fins of the first heat-dissipation enhancement member of the heat generating component and second fins of the second heat-dissipation enhancement member of the heat sink in the first direction can provide sufficient spacing for tolerance of components, thus ensuring the reliability of the electronic device.

Furthermore, due to better heat-dissipation effects, the invention can reduce the weight and size of the heat sink and thus saves cost.

Other exemplary embodiments of the invention will be apparent from the detailed description provided below. It should be understood that while the detailed description and the particular examples disclose the exemplary embodiments, they are for the purpose of illustration and are not intended to limit the scope of the invention.

Description of drawings

At least one embodiment will be described hereafter with reference to the following drawings, wherein similar elements are indicated with like reference numbers.

Fig. 1 is a front cross-sectional view of an electronic device comprising a heat generating component and a heat sink according to the prior art solution. Fig.2 is a front cross-sectional view of an electronic device comprising a heat generating component and a heat-dissipation assembly according to an embodiment of the present invention.

Fig.3 is a front cross-sectional view of an electronic device comprising a heat generating component and a heat-dissipation assembly according to an embodiment of the present invention.

Fig.4 is a perspective view of an electronic device comprising a heat generating component and a heat-dissipation assembly according to an embodiment of the present invention.

Fig.5 is a front cross-sectional view of an electronic device comprising a heat generating component and a heat-dissipation assembly according to an embodiment of the present invention.

Fig.6 is a perspective view of an electronic device comprising a heat generating component and a heat-dissipation assembly according to another embodiment of the present invention, wherein the first and second fins have ring-shaped section.

Fig.7 is a perspective view of a heat-dissipation assembly according to another embodiment of the present invention, wherein the first and second fins have ring-shaped section.

Figs.8a-8d are a front cross-sectional view, a side cross-sectional view, a top view and a perspective view of first fins or second fins of a heat-dissipation assembly according to another embodiment of the present invention, respectively, wherein the first fins or the second fins are each disposed in an array of cuboids.

Figs.9a-9d are a front cross-sectional view, a side cross-sectional view, a top view and a perspective view of first fins or second fins of a heat-dissipation assembly according to another embodiment of the present invention, respectively, wherein the first fins or the second fins are each disposed in an array of wedges with trapezoid cross-section.

Figs. l Oa- l Od are a front cross-sectional view, a side cross-sectional view, a top view and a perspective view of first fins or second fins of a heat-dissipation assembly according to another embodiment of the present invention, respectively, wherein the first fins or the second fins are each disposed in an array of wedges with triangular cross-section.

Figs. 1 l a- 1 I d are a front cross-sectional view, a side cross-sectional view, a top view and a perspective view of first fins or second fins of a heat-dissipation assembly according to another embodiment of the present invention, respectively, wherein the first fins or the second fins are each disposed in an array of tapers.

Figs. l2a- 12d are a front cross-sectional view, a side cross-sectional view, a top view and a perspective view of first fins or second fins of a heat-dissipation assembly according to another embodiment of the present invention, respectively, wherein the first fins or the second fins are each disposed in an array of cylinder.

Figs. 13a- 13d are a front cross-sectional view, a side cross-sectional view, a top view and a perspective view of first fins or second fins of a heat-dissipation assembly according to another embodiment of the present invention, respectively, wherein the first fins or the second fins have S-shaped section.

Description of the embodiments

The following descriptions are illustrative in nature and not intended in any way to limit the invention, its application and use. As used herein, directional terms, such as "up", "down", "front", "rear", "leading", "trailing", "transverse" etc., are used with reference to the orientation of the figures being described. Because components of various examples disclosed herein can be positioned in a number of different orientations, the directional terminology is used for illustrative purposes only, and is not intended to be limiting. It is also to be understood that the examples illustrated in the drawings, and the specific language used herein to describe the same are not intended to limit the scope of the invention. Alterations and further modifications of the features illustrated herein, and additional applications of the principles illustrated herein are to be considered to fall within the scope of the invention. Electronic components of electronic devices generally generate heat while in use. The generated heat increases the temperature of the electronic components. Because some components of an electronic device has a maximum operating temperature, if an electronic component is operated at a temperature exceeding the maximum operating temperature, the lifespan of electronic devices will be shortened and the electronic devices may be damaged. Therefore, heat-dissipation of electronic components is necessary.

In some products, such as telecom industry, it is not possible to design a line to line direct contact between heat generating components and heat sink. There should be a gap to absorb the tolerance of components and to reduce the pressure applied on the components by compression force. In the case that the heat generating components and heat sink are connected directly by thermal material, even if the gap between heat generating components and heat sink is filled up with heat transfer material, there is still large thermal resistance and temperature difference between the heat generating components and heat sink, which will lead to a higher temperature for the heat generating components.

Fig.2 and Fig.3 are front cross-sectional views of an electronic device 40 comprising a heat generating component 10 and a heat-dissipation assembly 30 according to an embodiment of the present invention. As shown in fig.2 and fig.3, the electronic device 40 comprises a heat generating component 10 and a heat-dissipation assembly 30. The heat-dissipation assembly 30 includes a heat sink 20 with a first gap 3 between a heat transfer surface 1 1 of the heat generating component 10 and a heat transfer surface 21 of the heat sink 20.

The electronic device 40 further comprises a first heat-dissipation enhancement member 31 thermally coupled to the heating generating component 10; and a second heat-dissipation enhancement member 32 thermally coupled to the heat sink 20 or integrated as part of the heat sink 20.

Said first heat-dissipation enhancement member 31 and said second heat-dissipation enhancement member 32 are configured to provide a spacing 37 therebetween in a first direction dl perpendicular to the heat transfer surface 1 1 of the heat generating component 10, and are configured to provide a second gap 38 therebetween in a second direction d2 perpendicular to the first direction dl , heat transfer material is filled between said first heat-dissipation enhancement member 31 and said second heat-dissipation enhancement member 32.

In the front cross-sectional views of Fig.2 and Fig.3, the first direction dl is top-down direction, and the second direction dl is left-right direction, however, the electronic device 40 can have other orientation, without departing the scope of the invention.

According to an embodiment of the invention, the heat transfer material is thermal gel which has a normal thermal conductivity of about 3.2 W/m*K. However, any suitable heat transfer material which have suitable normal thermal conductivity can be used, without departing from the scope of the invention.

Thus, the heat transfer path between the heat generating component 10 and the heat sink 20 is from the heat transfer surface 1 1 of the heat generating component 10, through the first heat-dissipation enhancement member 3 1 , through the heat transfer material filled the second gap 38, through the second heat-dissipation enhancement member 32, and to the heat transfer surface 21 of the heat sink 20. In contrast, according to the prior art solution, the heat transfer path between the heat generating component 1 and the heat sink 2 is from the heat generating component 1 , through the heat transfer material filled the first gap 3, and to the heat transfer surfaceof the heat sink 2.

The second gap 38 between the first heat-dissipation enhancement member 31 of the heat generating component 10 and the second heat-dissipation enhancement member 32 of the heat sink 20 will be as small as possible, thus keeping tight contact between the flat side surfaces of the first heat-dissipation enhancement member 31 and the second heat-dissipation enhancement member 32. In application, the second gap 38 will be less than 0.2 mm. This will result in better heat-dissipation effects due to the smaller size of the second gap 38 than that of the first gap 3.

In addition, the spacing 37 between the first heat-dissipation enhancement member 31 of the heat generating component 10 and the second heat-dissipation enhancement member 32 of the heat sink 20 in the first direction d l can provide sufficient spacing for tolerance of components, thus ensuring the reliability of the electronic device 40.

According to an embodiment of the invention, said first heat-dissipation enhancement member 31 may include a plurality of first fins 33 and a plurality of first grooves 34 located between adjacent first fins 33, and said second heat-dissipation enhancement member 32 may include a plurality of second fins 35 and a plurality of second grooves 36 located between adjacent second fins 35, the first fins 33 are disposed in the second grooves 36, and the second fins 35 are disposed in the first grooves 34.

Fig.4 and Fig.5 are a perspective view and a front cross-sectional view of an electronic device 40 comprising a heat generating component 10 and a heat-dissipation assembly 30 according to an embodiment of the present invention, respectively. In Fig.4, the heat generating component 10 is shown as a printed circuit board, however, the heat generating component 10 may be any other components, without departing the scope of the invention.

In Fig.2-Fig.5, the plurality of first fins 33 and the plurality of second fins 35 are each disposed in multiple rows of cuboids, that is, the first fins 33 and second fins 35 have rectangular cross-section. According to an embodiment of the invention, the first fins 33 have the same overlapped height H, spacing S and thickness T as those of the second fins 35. Alternatively, the first fins 33 may have different overlapped height, spacing and thickness from those of the second fins 35.

According to an embodiment of the invention, at least one of the plurality of first fins 33 has different overlapped height, spacing and thickness from other first fins 33. Similarly, at least one of the plurality of second fins 35 has different overlapped height, spacing and thickness from other second fins 35.

Fig.6 and Fig.7 are a perspective view and a front cross-sectional view of an electronic device 40 comprising a heat generating component 10 and a heat-dissipation assembly 30 according to another embodiment of the present invention, respectively.

The electronic device 40 comprises a heat generating component 10 and a heat-dissipation assembly 30. The heat-dissipation assembly 30 includes a heat sink 20 with a first gap 3 between a heat transfer surface 1 1 of the heat generating component 10 and a heat transfer surface 21 of the heat sink 20.

Said first heat-dissipation enhancement member 31 may include a plurality of first fins 33 and a plurality of first grooves 34 located between adjacent first fins 33, and said second heat-dissipation enhancement member 32 may include a plurality of second fins 35 and a plurality of second grooves 36 located between adjacent second fins 35, the first fins 33 are disposed in the second grooves 36, and the second fins 35 are disposed in the first grooves 34.

As shown in Fig.6 and Fig.7, the first fins 33 and second fins 35 have ring-shaped section. In addition, the first fins 33 and second fins 35 can have S-shaped (as shown in Fig.13a -Fig. 13d), volute shaped (not shown), or other curved section, without departing the scope of the invention. In addition, in Fig.6, the heat generating component 10 is shown as a printed circuit board, however, the heat generating component 10 may be any other components, without departing the scope of the invention.

Fig.8a-Fig.13d show alternative arrangments of the first fins 33 and second fins 35 according to the present invention. In Fig.8a-Fig. 12d, the first fins 33 and second fins 35 are arranged in an array. Figs.8a-8d are a front cross-sectional view, a side cross-sectional view, a top view and a perspective view which show the first fins 33 or the second fins 35 are each disposed in an array of cuboids. Figs.9a-9d are a front cross-sectional view, a side cross-sectional view, a top view and a perspective view which show the first fins 33 or the second fins 35 are each disposed in an array of wedges with trapezoid cross-section. Figs. 10a- l Od are a front cross-sectional view, a side cross-sectional view, a top view and a perspective view which show the first fins 33 or the second fins 35 are each disposed in an array of wedges with triangular cross-section. Figs. 1 l a- 1 I d are a front cross-sectional view, a side cross-sectional view, a top view and a perspective view which show the first fins 33 or the second fins 35 are each disposed in an array of tapers. Figs. 12a- 12d are a front cross-sectional view, a side cross-sectional view, a top view and a perspective view which show the first fins 33 or the second fins 35 are each disposed in an array of cylinder. Figs.13a- 13d are a front cross-sectional view, a side cross-sectional view, a top view and a perspective view which show the first fins 33 or the second fins 35 have S-shaped section.

It should be understood by those skilled in the art that, although the examples shown in the figures show specific arrangements of the first fins 33 or the second fins 35, they are not limiting. The first fins 33 and the second fins 35 can have any other suitalbe arragnements, without departing the scope of the invention.

Considering the manufacturing factors, tests have shown that the parameters in the following table 1 are suitable for telecom equipment. In the following table 1 , rectangular cross-sectional fins are used as an example. Table 1

In other ways, the overlapped height H is 2-50 mm, the spacing S is 0-2 mm and the thickness T is 0.2-5 mm. Preferably, the overlapped height H is 20 mm, the spacing S is 0.25 mm and the thickness T is 2 mm.

It should be understood by those skilled in the art that, although the parameters shown in table 1 show specific parameters of the first fins 33 or the second fins 35, they are not limiting. The first fins 33 and the second fins 35 can have any other suitalbe parameters, without departing the scope of the invention.

In order to make the structure better than prior art solution, the parameters need to obey the following formulation:

S l/Al < S0/A0;

wherein, AO is the area of the heat transfer surface 1 1 of the heat generating component 10, mm²;

SO is the first gap 3 between hot side and cool side, i.e., between the heat transfer surface 1 1 of the heat generating component 10 and the heat transfer surface 21 of the heat sink 20, mm;

S I is the average size of second gap 38, mm;

Al is effective overlapped area between the first fins 33 and the second fins 35, mm .

The smaller S l/Al , the better the heat-dissipation performance is. Again, rectangular cross-sectional fins are used as an example. Given that the overlapped height H is 20 mm, the spacing S is 0.25 mm and the thickness T is 2 mm, the temperature rise caused by the heat transfer material is 3.34 ^°C . Compared with the temperature rise of 12.5 ^°C in the prior art solution, the temperature rise caused by the heat transfer material is substantially reduced.

In addition, in case that the second gap 38 is zero, that is, said first heat-dissipation enhancement member 31 and said second heat-dissipation enhancement member 32 contact with each other, the thermal resistance between the heat generating component 10 and the heat sink 20 is nearly zero, thus realizing perfect heat-dissipation performance of the electronic device 40.

According to another embodiment of the invention, there is provided a heat-dissipation method for a heat generating component 10, comprising: providing a heat sink 20 with a first gap 3 between a heat transfer surface 1 1 of the heat generating component 10 and a heat transfer surface 21 of the heat sink 20;

characterized in that, the method further comprising:

providing a first heat-dissipation enhancement member 31 thermally coupled to the heating generating component 10; and

providing a second heat-dissipation enhancement member 32 thermally coupled to the heat sink 20 or integrated as part of the heat sink 20,

The assembly process of the electronic device 40 is now described. At first, the first heat-dissipation enhancement member 31 is connected and thermally coupled to the heating generating component 10.

Next, the second heat-dissipation enhancement member 32 is connected and thermally coupled to the heat sink 20. In the case that the second heat-dissipation enhancement member 32 is integrated as part of the heat sink 20, the step will be omitted. In addition, the above two steps can take place simultaneously or in other order, without departing the scope of the description.

Then, the first fins 33 of the first heat-dissipation enhancement member 3 1 of the heat generating component 10 are inserted into the second grooves 36 of the second heat-dissipation enhancement member 32 of the heat sink 20, and second fins 35 of the second heat-dissipation enhancement member 32 of the heat sink 20 are inserted into the first grooves 34 of the first heat-dissipation enhancement member 31 of the heat generating component 10.

At last, heat transfer material is filled between said first heat-dissipation enhancement member 31 and said second heat-dissipation enhancement member 32. The heat transfer material may be partially or fully filled.

The invention achieves advantageous technical effects over the prior art solution, including, but not limiting to:

1. The second gap 38 between the first heat-dissipation enhancement member 3 1 of the heat generating component 10 and the second heat-dissipation enhancement member 32 of the heat sink 20 will be as small as possible, thus keeping tight contact between the flat side surfaces of the first heat-dissipation enhancement member 31 and the second heat-dissipation enhancement member 32. In application, the second gap will be less than 0.2 mm. This will result in better heat-dissipation effects.

2. The heat transfer area between the first fins 33 of the first heat-dissipation enhancement member 31 of the heat generating component 10 and second fins 35 of the second heat-dissipation enhancement member 32 of the heat sink 20 is increased due to arrangement in an array or multiple rows, thus resulting in much better heat-dissipation effects.

3. In addition, the spacing 37 between the first fins 33 of the first heat-dissipation enhancement member 31 of the heat generating component 10 and second fins 35 of the second heat-dissipation enhancement member 32 of the heat sink 20 in the first direction dl can provide sufficient spacing for tolerance of components, thus ensuring the reliability of the electronic device 40.

4. Furthermore, due to better heat-dissipation effects, the invention can reduce the weight and size of the heat sink and thus saves cost.

Again, rectangular cross-sectional fins are used as an example. Given the parameters as described in the above, this will reduce the weight and size and save cost both in design stage and in mass production, as shown in the following table 2.

Table 2

Although the invention has been described in connection with the electronic device 40, the invention is applicable to any device which includes heat generating components and needs heat-dissipation and which needs gap between the heat generating components and heat sink so as to bear the tolerance of components.

The invention has described some preferred embodiments and the variants thereof. One skilled in the art can conceive other modifications and variants after reading and understanding the description. Thus, the invention is not limited to the particular embodiments disclosed as the optimum mode for implementing the invention, and the invention will encompass all embodiments falling into the scope of the following claims.

Claims

1. A heat-dissipation assembly (30) for a heat generating component

( 10) , comprising:

a heat sink (20) with a first gap (3) between a heat transfer surface

(1 1 ) of the heat generating component ( 10) and a heat transfer surface (21 ) of the heat sink (20);

characterized in that, the heat-dissipation assembly (30) further comprising:

a first heat-dissipation enhancement member (31 ) thermally coupled to the heating generating component ( 10); and

a second heat-dissipation enhancement member (32) thermally coupled to the heat sink (20) or integrated as part of the heat sink (20),

said first heat-dissipation enhancement member (31) and said second heat-dissipation enhancement member (32) are configured to provide a spacing (37) therebetween in a first direction (dl) perpendicular to the heat transfer surface ( 1 1 ) of the heat generating component ( 10), and are configured to provide a second gap (38) therebetween in a second direction (d2) perpendicular to the first direction (dl ), heat transfer material is filled between said first heat-dissipation enhancement member (31 ) and said second heat-dissipation enhancement member (32).

2. The heat-dissipation assembly (30) of claim 1 , characterized in that: said first heat-dissipation enhancement member (31) includes a plurality of first fins (33) and a plurality of first grooves (34) located between adjacent first fins (33), and said second heat-dissipation enhancement member (32) includes a plurality of second fins (35) and a plurality of second grooves (36) located between adjacent second fins (35), the first fins (33) are disposed in the second grooves (36), and the second fins (35) are disposed in the first grooves (34).

3. The heat-dissipation assembly (30) of claim 2, characterized in that: the first fins (33) have the same overlapped height (H), spacing (S) and thickness (T) as those of the second fins (35).

4. The heat-dissipation assembly (30) of claim 2, characterized in that: the first fins (33) have different overlapped height, spacing and thickness from those of the second fins (35).

5. The heat-dissipation assembly (30) of claim 2, characterized in that: at least one of the plurality of first fins (33) has different overlapped height, spacing and thickness from other first fins (33).

6. The heat-dissipation assembly (30) of claim 2, characterized in that: at least one of the plurality of second fins (35) has different overlapped height, spacing and thickness from other second fins (35).

7. The heat-dissipation assembly (30) of claim 2, characterized in that: the area of the heat transfer surface (1 1 ) of the heat generating component (10) is AO, the size of the first gap (3) is SO, effective overlapped area between the first fins (33) and the second fins (35) is Al , the average size of the second gap (38) is S I , and S 1/AKS0/A0.

8. The heat-dissipation assembly (30) of claim 3, characterized in that: the overlapped height (H) is 2-50 mm, the spacing (S) is 0-2 mm and the thickness (T) is 0.2-5 mm.

9. The heat-dissipation assembly (30) of claim 8, characterized in that: the overlapped height (H) is 20 mm, the spacing (S) is 0.25 mm and the thickness (T) is 2 mm.

10. The heat-dissipation assembly (30) of claim 2, characterized in that: the plurality of first fins (33) and the plurality of second fins (35) are each disposed in an array of cylinders, tapers, wedges or cuboids.

1 1. The heat-dissipation assembly (30) of claim 2, characterized in that: the plurality of first fins (33) and the plurality of second fins (35) are each disposed in multiple rows of cuboids or multiple rows of wedges.

12. The heat-dissipation assembly (30) of claim 2, characterized in that: the first fins (33) and the second fins (35) have ring-shaped, S-shaped or other curved section.

13. An electronic device (40), comprising:

a heat generating component (10); and

a heat-dissipation assembly (30) including a heat sink (20) with a first gap (3) between a heat transfer surface (1 1) of the heat generating component ( 10) and a heat transfer surface (21) of the heat sink (20);

characterized in that, the heat-dissipation assembly (30) further comprising:

14. The electronic device (40) of claim 13, characterized in that: said first heat-dissipation enhancement member (31) includes a plurality of first fins (33) and a plurality of first grooves (34) located between adjacent first fins (33), and said second heat-dissipation enhancement member (32) includes a plurality of second fins (35) and a plurality of second grooves (36) located between adjacent second fins (35), the first fins (33) are disposed in the second grooves (36), and the second fins (35) are disposed in the first grooves (34).

15. The electronic device (40) of claim 14, characterized in that: the first fins (33) have the same overlapped height (H), spacing (S) and thickness (T) as those of the second fins (35).

16. The electronic device (40) of claim 14, characterized in that: the first fins (33) have different overlapped height, spacing and thickness from those of the second fins (35).

17. The electronic device (40) of claim 14, characterized in that: at least one of the plurality of first fins (33) has different overlapped height, spacing and thickness from other first fins (33).

18. The electronic device (40) of claim 14, characterized in that: at least one of the plurality of second fins (35) has different overlapped height, spacing and thickness from other second fins (35).

19. The electronic device (40) of claim 14, characterized in that: the area of the heat transfer surface ( 1 1 ) of the heat generating component ( 10) is AO, the size of the first gap (3) is SO, effective overlapped area between the first fins (33) and the second fins (35) is Al , the average size of the second gap (38) is S I , and S 1/AKS0/A0.

20. The electronic device (40) of claim 15, characterized in that: the overlapped height (H) is 2-50 mm, the spacing (S) is 0-2 mm and the thickness (T) is 0.2-5 mm.

21. The electronic device (40) of claim 20, characterized in that: the overlapped height (H) is 20 mm, the spacing (S) is 0.25 mm and the thickness (T) is 2 mm.

22. The electronic device (40) of claim 14, characterized in that: the plurality of first fins (33) and the plurality of second fins (35) are each disposed in an array of cylinders, tapers, wedges or cuboids.

23. The electronic device (40) of claim 14, characterized in that: the plurality of first fins (33) and the plurality of second fins (35) are each disposed in multiple rows of cuboids or multiple rows of wedges.

24. The electronic device (40) of claim 14, characterized in that: the first fins (33) and the second fins (35) have ring-shaped, S-shaped or other curved section.

25. A heat-dissipation method for a heat generating component (10), comprising:

providing a heat sink (20) with a first gap (3) between a heat transfer surface ( 1 1 ) of the heat generating component (10) and a heat transfer surface (21 ) of the heat sink (20);

characterized in that, the method further comprising:

providing a first heat-dissipation enhancement member (31 ) thermally coupled to the heating generating component ( 10); and providing a second heat-dissipation enhancement member (32) thermally coupled to the heat sink (20) or integrated as part of the heat sink (20),

said first heat-dissipation enhancement member (31 ) and said second heat-dissipation enhancement member (32) are configured to provide a spacing (37) therebetween in a first direction (dl) perpendicular to the heat transfer surface (1 1 ) of the heat generating component ( 10), and are configured to provide a second gap (38) therebetween in a second direction (d2) perpendicular to the first direction (dl ), heat transfer material is filled between said first heat-dissipation enhancement member (31 ) and said second heat-dissipation enhancement member (32).

26. The method of claim 25, characterized in that: said first heat-dissipation enhancement member (31 ) includes a plurality of first fins (33) and a plurality of first grooves (34) located between adjacent first fins (33), and said second heat-dissipation enhancement member (32) includes a plurality of second fins (35) and a plurality of second grooves (36) located between adjacent second fins (35), the first fins (33) are disposed in the second grooves (36), and the second fins (35) are disposed in the first grooves (34).

27. The method of claim 26, characterized in that: the first fins (33) have the same overlapped height (H), spacing (S) and thickness (T) as those of the second fins (35).

28. The method of claim 26, characterized in that: the first fins (33) have different overlapped height, spacing and thickness from those of the second fins (35).

29. The method of claim 26, characterized in that: at least one of the plurality of first fins (33) has different overlapped height, spacing and thickness from other first fins (33).

30. The method of claim 26, characterized in that: at least one of the plurality of second fins (35) has different overlapped height, spacing and thickness from other second fins (35).

31. The method of claim 26, characterized in that: the area of the heat transfer surface ( 1 1) of the heat generating component ( 10) is AO, the size of the first gap (3) is SO, effective overlapped area between the first fins (33) and the second fins (35) is Al , the average size of the second gap (38) is S l , and S l/AKSO/AO.

32. The method of claim 27, characterized in that: the overlapped height (H) is 2-50 mm, the spacing (S) is 0-2 mm and the thickness (T) is 0.2-5 mm.

33. The method of claim 32, characterized in that: the overlapped height (H) is 20 mm, the spacing (S) is 0.25 mm and the thickness (T) is 2 mm.

34. The method of claim 26, characterized in that: the plurality of first fins (33) and the plurality of second fins (35) are each disposed in an array of cylinders, tapers, wedges or cuboids.

35. The method of claim 26, characterized in that: the plurality of first fins (33) and the plurality of second fins (35) are each disposed in multiple rows of cuboids or multiple rows of wedges.

36. The method of claim 26, characterized in that: the first fins (33) and the second fins (35) have ring-shaped, S-shaped or other curved section.