JP2021045890A - 成形型、樹脂成形装置及び樹脂成形品の製造方法 - Google Patents
成形型、樹脂成形装置及び樹脂成形品の製造方法 Download PDFInfo
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- 239000011347 resin Substances 0.000 title claims abstract description 256
- 238000000465 moulding Methods 0.000 title claims abstract description 144
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 149
- 230000007246 mechanism Effects 0.000 claims abstract description 68
- 239000000463 material Substances 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims description 22
- 239000004065 semiconductor Substances 0.000 description 12
- ZKFQEACEUNWPMT-UHFFFAOYSA-N Azelnidipine Chemical compound CC(C)OC(=O)C1=C(C)NC(N)=C(C(=O)OC2CN(C2)C(C=2C=CC=CC=2)C=2C=CC=CC=2)C1C1=CC=CC([N+]([O-])=O)=C1 ZKFQEACEUNWPMT-UHFFFAOYSA-N 0.000 description 10
- 229950004646 azelnidipine Drugs 0.000 description 10
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/0061—Moulds or cores; Details thereof or accessories therefor characterised by the configuration of the material feeding channel
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/0077—Moulds or cores; Details thereof or accessories therefor characterised by the configuration of the mould filling gate ; accessories for connecting the mould filling gate with the filling spout
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/20—Opening, closing or clamping
- B29C33/202—Clamping means operating on closed or nearly closed mould parts, the clamping means being independently movable of the opening or closing means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0046—Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
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- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
- B29C45/2708—Gates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/64—Mould opening, closing or clamping devices
- B29C45/641—Clamping devices using means for straddling or interconnecting the mould halves, e.g. jaws, straps, latches
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/80—Measuring, controlling or regulating of relative position of mould parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
- B29C2033/023—Thermal insulation of moulds or mould parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0046—Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity
- B29C2045/0051—Flow adjustment by throttles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
リードフレームや半導体チップ(以下、単に「チップ」と称する場合がある。)が実装された基板等の成形対象物は樹脂封止することにより電子部品として用いられる。この電子部品は、例えば、携帯通信端末用の高周波モジュール基板、電力制御用モジュール基板、機器制御用基板等として用いられる。成形対象物を樹脂封止する技術の一つとして、BGA(ball grid array)基板等を樹脂封止して半導体パッケージを製造するトランスファ方式がある。このトランスファ方式は、チップが実装された基板等を成形型のキャビティに収容し、成形型のポットに粉粒体状樹脂を固めた樹脂タブレットを供給して加熱,溶融した後、該成形型を型締めした状態で樹脂タブレットが溶融した溶融樹脂をキャビティに供給して硬化させ、型開きして樹脂成形品を製造する方式である。
図1〜図4を用いて樹脂成形品の製造方法について説明する。
以下、上述した実施形態と同様の部材については、理解を容易にするため、同一の用語、符号を用いて説明する。
以下、上述の実施形態において説明した成形型C、樹脂成形装置D及び樹脂成形品の製造方法の概要について説明する。
12 :突起状電極
13 :チップ
15 :側方流路
16 :可動ブロック(制限部材)
21 :ポット
23 :ゲート
35 :型締め機構
C :成形型
D :樹脂成形装置
M :成形型本体
MC :キャビティ
R :流路制限機構
S :一辺
Sa :樹脂封止前基板(成形対象物)
Sb :樹脂封止済基板(樹脂成形品)
T :樹脂タブレット(樹脂材料)
Claims (6)
- 基板の中央領域にチップが配置された成形対象物を保持し、樹脂材料が供給される平面視矩形状のキャビティを有する成形型本体を備え、
前記成形型本体は、前記樹脂材料が充填されるポットと、前記キャビティの一辺に設けられ、前記キャビティに向けて前記樹脂材料を供給するゲートと、前記一辺と交わる両側辺の側で前記キャビティの内部を流動する前記樹脂材料の流路のうち、前記チップが配置されていない側方流路を絞る流路制限機構と、を含んでいる成形型。 - 前記流路制限機構は、前記側方流路を絞った状態から前記側方流路を全開にした状態に変化可能に構成されている請求項1に記載の成形型。
- 前記成形対象物は、前記基板上で二次元アレイ状に配置された複数の突起状電極に前記チップが電気的に接続されており、
前記流路制限機構は、前記側方流路に配置され、側面視で前記基板と前記チップとの間の間隙領域に先端が位置することにより前記側方流路を絞った状態にする制限部材で構成されている請求項1又は2に記載の成形型。 - 請求項1から3の何れか一項に記載の成形型と、
前記成形型を型締めする型締め機構と、を備えた樹脂成形装置。 - 請求項4に記載の樹脂成形装置を用いた樹脂成形品の製造方法であって、
前記成形型に前記成形対象物及び前記樹脂材料を供給する供給工程と、
前記樹脂材料を加熱した状態で前記成形型を型締めする型締工程と、
前記ゲートから前記キャビティに前記樹脂材料を流動させることにより、前記成形対象物の樹脂成形を行う成形工程と、を含み、
前記成形工程では、前記流路制限機構により前記側方流路を絞る樹脂成形品の製造方法。 - 前記成形工程では、前記樹脂材料が前記基板の中央領域に供給された後、前記流路制限機構を解除して前記側方流路を開放させる請求項5に記載の樹脂成形品の製造方法。
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JP2019169574A JP6845903B1 (ja) | 2019-09-18 | 2019-09-18 | 成形型、樹脂成形装置及び樹脂成形品の製造方法 |
US17/761,448 US11938660B2 (en) | 2019-09-18 | 2020-05-14 | Mold die, resin molding apparatus, and method for producing resin molded product |
CN202080065340.6A CN114423582A (zh) | 2019-09-18 | 2020-05-14 | 成型模、树脂成型装置以及树脂成型品的制造方法 |
PCT/JP2020/019206 WO2021053879A1 (ja) | 2019-09-18 | 2020-05-14 | 成形型、樹脂成形装置及び樹脂成形品の製造方法 |
KR1020217040387A KR102576139B1 (ko) | 2019-09-18 | 2020-05-14 | 성형 몰드, 수지 성형 장치 및 수지 성형품의 제조 방법 |
TW109116165A TWI745964B (zh) | 2019-09-18 | 2020-05-15 | 成形模具、樹脂成形裝置及樹脂成形品的製造方法 |
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WO2022097392A1 (ja) * | 2020-11-04 | 2022-05-12 | Towa株式会社 | 樹脂成形装置及び樹脂成形品の製造方法 |
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JP2002184797A (ja) * | 2000-12-13 | 2002-06-28 | Towa Corp | 樹脂封止装置 |
JP2006156796A (ja) * | 2004-11-30 | 2006-06-15 | Towa Corp | 半導体チップの樹脂封止成形方法、及び、装置 |
JP2012166430A (ja) * | 2011-02-14 | 2012-09-06 | Apic Yamada Corp | 樹脂封止装置 |
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JP6678973B1 (ja) * | 2019-04-09 | 2020-04-15 | アサヒ・エンジニアリング株式会社 | 樹脂封止装置および樹脂封止方法 |
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