JP2021022632A - 搬送システム - Google Patents
搬送システム Download PDFInfo
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- JP2021022632A JP2021022632A JP2019137609A JP2019137609A JP2021022632A JP 2021022632 A JP2021022632 A JP 2021022632A JP 2019137609 A JP2019137609 A JP 2019137609A JP 2019137609 A JP2019137609 A JP 2019137609A JP 2021022632 A JP2021022632 A JP 2021022632A
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- 238000012545 processing Methods 0.000 claims abstract description 71
- 230000007246 mechanism Effects 0.000 claims abstract description 64
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- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 claims description 4
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G35/00—Mechanical conveyors not otherwise provided for
- B65G35/06—Mechanical conveyors not otherwise provided for comprising a load-carrier moving along a path, e.g. a closed path, and adapted to be engaged by any one of a series of traction elements spaced along the path
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B61—RAILWAYS
- B61B—RAILWAY SYSTEMS; EQUIPMENT THEREFOR NOT OTHERWISE PROVIDED FOR
- B61B3/00—Elevated railway systems with suspended vehicles
- B61B3/02—Elevated railway systems with suspended vehicles with self-propelled vehicles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
- B65G1/04—Storage devices mechanical
- B65G1/0457—Storage devices mechanical with suspended load carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0297—Wafer cassette
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G41/00—Supporting frames or bases for conveyors as a whole, e.g. transportable conveyor frames
- B65G41/006—Supporting frames or bases for conveyors as a whole, e.g. transportable conveyor frames with the conveyor not adjustably mounted on the supporting frame or base
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
- B65G43/10—Sequence control of conveyors operating in combination
Abstract
Description
図1は、本実施形態に係る搬送システム2の構成例を示す平面図であり、図2は、搬送システム2の接続関係の例を示す機能ブロック図である。図1に示すように、本実施形態に係る搬送システム2は、切削装置(加工装置)4によって加工される板状の被加工物11(図4(B)等参照)を搬送する際に使用される線路6を含んでいる。
本実施形態では、実施形態1の線路6及び無人被加工物搬送車(無人搬送車)10とは異なる構造の線路及び無人被加工物搬送車(無人搬送車)について説明する。なお、本実施形態の線路及び無人被加工物搬送車が組み込まれる搬送システム等の基本的な構成は、実施形態1に係る搬送システム2等と同じである。よって、共通する構成要素には同じ符号を付して詳細な説明を省略する。
本実施形態では、ストックユニット8とは異なる構造のストックユニットについて説明する。なお、本実施形態のストックユニットが組み込まれる搬送システム等の基本的な構成は、実施形態1に係る搬送システム2等と同じである。よって、共通する構成要素には同じ符号を付して詳細な説明を省略する。
4 :切削装置(加工装置)
6 :線路
8 :ストックユニット
10 :無人被加工物搬送車(無人搬送車)
12 :制御ユニット
16 :筐体
16a :天井
16b :開口
18 :カセット保持台
20 :カセット(被加工物ストッカー)
21 :配管
22 :プッシュプルアーム
24 :ガイドレール
26 :収容部保持台
32 :制御装置
34 :受信機
36 :送信機
38 :収容部
38a :空間(収容空間)
38b :側面
38c :開口
39 :走行部
39a :基部
39b :突出部
39c :端子
40 :昇降機構
40a :ワイヤ
41 :車輪(走行機構)
42 :制御装置
44 :受信機
46 :送信機
102 :レール
102a :上板
102b :側板
102c :下板
104 :レール保持構造
104a :脚部
104b :保持部
104c :吸着部
106 :レール
106a :第1経路
106b :第2経路
108 :レール
110 :レール
112 :レール保持構造
114 :レール保持構造
116 :情報提供部
118 :読み取り機
122 :制御部
124 :受信機
126 :送信機
Claims (3)
- 複数の加工装置のそれぞれに対して被加工物を搬送する搬送システムであって、
複数の該加工装置に渡って該加工装置の上部に固定される線路と、
該被加工物を収容する収容空間を有する収容部、該収容部に上方から連結される走行部、該走行部に設けられた走行機構、該走行部に配置され該収容部を上方から吊り下げて昇降させる昇降機構、及び制御信号を受信する受信機を備え、該線路を走行する無人搬送車と、
該被加工物が収容された被加工物ストッカーから該無人搬送車の該収容部に対して該被加工物を受け渡す際に該収容部を保持する収容部保持台、及び制御信号を受信する受信機を備えるストックユニットと、
該加工装置、該無人搬送車、及び該ストックユニットに制御信号を送信する送信機、該加工装置から送信される通知信号を受信する受信機、及び該送信機から送信される制御信号を生成する制御信号生成部を備える制御ユニットと、を含み、
該制御ユニットの該制御信号生成部は、該制御ユニットの該受信機が受信した通知信号に基づき該制御ユニットの該送信機から送信される制御信号を生成し、
該制御ユニットの該送信機は、該制御ユニットの該制御信号生成部で生成された制御信号を、該加工装置、該無人搬送車、及び該ストックユニットに送信し、
該無人搬送車は、該受信機で受信した制御信号に基づき該線路を走行することを特徴とする搬送システム。 - 該線路は、複数のレールを連結して構成され、
該無人搬送車は、該レールの下方に該収容部が配置された状態で該レールを走行することを特徴とする請求項1に記載の搬送システム。 - 該線路は、該加工装置に対して吸着する吸着部を有する脚部を備え、該吸着部によって該加工装置に固定されることを特徴とする請求項1又は請求項2に記載の搬送システム。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019137609A JP7229644B2 (ja) | 2019-07-26 | 2019-07-26 | 搬送システム |
KR1020200081512A KR20210012909A (ko) | 2019-07-26 | 2020-07-02 | 반송 시스템 |
SG10202006488QA SG10202006488QA (en) | 2019-07-26 | 2020-07-06 | Conveyance system |
DE102020208907.8A DE102020208907B4 (de) | 2019-07-26 | 2020-07-16 | Transportsystem |
US16/932,021 US11059673B2 (en) | 2019-07-26 | 2020-07-17 | Conveyance system |
CN202010716599.4A CN112309934A (zh) | 2019-07-26 | 2020-07-23 | 搬运系统 |
TW109125032A TW202104047A (zh) | 2019-07-26 | 2020-07-24 | 搬送系統 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019137609A JP7229644B2 (ja) | 2019-07-26 | 2019-07-26 | 搬送システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021022632A true JP2021022632A (ja) | 2021-02-18 |
JP7229644B2 JP7229644B2 (ja) | 2023-02-28 |
Family
ID=74099029
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019137609A Active JP7229644B2 (ja) | 2019-07-26 | 2019-07-26 | 搬送システム |
Country Status (7)
Country | Link |
---|---|
US (1) | US11059673B2 (ja) |
JP (1) | JP7229644B2 (ja) |
KR (1) | KR20210012909A (ja) |
CN (1) | CN112309934A (ja) |
DE (1) | DE102020208907B4 (ja) |
SG (1) | SG10202006488QA (ja) |
TW (1) | TW202104047A (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7109863B2 (ja) * | 2018-11-30 | 2022-08-01 | 株式会社ディスコ | 搬送システム |
WO2022195931A1 (ja) * | 2021-03-18 | 2022-09-22 | Towa株式会社 | 加工装置、及び加工品の製造方法 |
Citations (7)
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JPH06115634A (ja) * | 1992-10-08 | 1994-04-26 | Fujitsu General Ltd | 自動倉庫 |
JPH06177244A (ja) * | 1992-12-01 | 1994-06-24 | Disco Abrasive Syst Ltd | ダイシングシステム |
US6663340B1 (en) * | 2002-08-30 | 2003-12-16 | Motorola, Inc. | Wafer carrier transport system for tool bays |
JP2013030003A (ja) * | 2011-07-28 | 2013-02-07 | Daifuku Co Ltd | 処理設備 |
JP2013206970A (ja) * | 2012-03-27 | 2013-10-07 | Daifuku Co Ltd | 物品保管設備及び物品搬送設備 |
JP2016149437A (ja) * | 2015-02-12 | 2016-08-18 | 株式会社ディスコ | ウェーハ処理システム |
WO2017098805A1 (ja) * | 2015-12-08 | 2017-06-15 | 村田機械株式会社 | 搬送システム及び搬送方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6604624B2 (en) | 1998-09-22 | 2003-08-12 | Hirata Corporation | Work conveying system |
JP7184453B2 (ja) | 2018-05-17 | 2022-12-06 | 株式会社ディスコ | 搬送システム |
JP7224725B2 (ja) * | 2019-03-26 | 2023-02-20 | 株式会社ディスコ | 搬送システム |
JP7224728B2 (ja) | 2019-04-23 | 2023-02-20 | 株式会社ディスコ | 搬送システム |
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2019
- 2019-07-26 JP JP2019137609A patent/JP7229644B2/ja active Active
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2020
- 2020-07-02 KR KR1020200081512A patent/KR20210012909A/ko unknown
- 2020-07-06 SG SG10202006488QA patent/SG10202006488QA/en unknown
- 2020-07-16 DE DE102020208907.8A patent/DE102020208907B4/de active Active
- 2020-07-17 US US16/932,021 patent/US11059673B2/en active Active
- 2020-07-23 CN CN202010716599.4A patent/CN112309934A/zh active Pending
- 2020-07-24 TW TW109125032A patent/TW202104047A/zh unknown
Patent Citations (7)
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US11059673B2 (en) | 2021-07-13 |
DE102020208907B4 (de) | 2023-08-10 |
US20210024294A1 (en) | 2021-01-28 |
CN112309934A (zh) | 2021-02-02 |
DE102020208907A1 (de) | 2021-01-28 |
TW202104047A (zh) | 2021-02-01 |
SG10202006488QA (en) | 2021-02-25 |
JP7229644B2 (ja) | 2023-02-28 |
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