JP2021015446A - 加工装置 - Google Patents
加工装置 Download PDFInfo
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- JP2021015446A JP2021015446A JP2019129631A JP2019129631A JP2021015446A JP 2021015446 A JP2021015446 A JP 2021015446A JP 2019129631 A JP2019129631 A JP 2019129631A JP 2019129631 A JP2019129631 A JP 2019129631A JP 2021015446 A JP2021015446 A JP 2021015446A
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- 238000003384 imaging method Methods 0.000 claims abstract description 17
- 230000007246 mechanism Effects 0.000 claims abstract description 4
- 238000001514 detection method Methods 0.000 claims description 20
- 244000309466 calf Species 0.000 description 32
- 238000010586 diagram Methods 0.000 description 17
- 238000003754 machining Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000001454 recorded image Methods 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/409—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by using manual data input [MDI] or by using control panel, e.g. controlling functions with the panel; characterised by control panel details or by setting parameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Human Computer Interaction (AREA)
- Automation & Control Theory (AREA)
- Dicing (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Numerical Control (AREA)
- User Interface Of Digital Computer (AREA)
Abstract
Description
図16は、変形例に係る加工装置の機能構成の一例を模式的に示すブロック図である。図16に示すように、変形例に係る加工装置10は、エラーを検知するエラー検出部46を備える。エラー検出部46は、例えば、マニュアルアライメントにおいて発生したカーフチェックエラーなどを検知する。
本発明に係る加工装置1は、本発明の骨子を逸脱しない範囲で種々変形して実施することができる。例えば、加工装置1の一例として説明した切削装置に限定されるものではなく、レーザー加工装置や研削装置であってもよい。
11 チャックテーブル
12 撮像ユニット
13 加工ユニット
17 タッチパネル
23 光源
30 ストレージ
31 画像記憶部
40 制御ユニット
41 中央制御部
42 画面表示制御部
43 接触検出部
44 画像記録部
45 画像表示制御部
46 エラー検出部
100 ウエーハ(被加工物)
103 ストリート(分割予定ライン)
104 デバイス
Claims (2)
- 加工装置であって、
保持テーブルと、加工部と、撮像部と、タッチパネルと、各機構を制御する制御部とを備え、
該制御部は、
該タッチパネルに表示されている画面を連続的に画像として記録する画像記録部と、
オペレータが触れて操作した該タッチパネルの座標を検出する接触検出部と、を備え、
該画像記録部は、該画像を該接触検出部が検出した座標に任意のマークを表示させた状態で記録することを特徴とする加工装置。 - 該制御部は、
エラーを検知するエラー検出部をさらに備え、
該画像記録部は、
エラー前後の事前に設定された時間内に記録された該画像を蓄積し、
その他の時間に記録された該画像は所定時間が経過後に消去することを特徴とする、
請求項1に記載の加工装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019129631A JP7349278B2 (ja) | 2019-07-11 | 2019-07-11 | 加工装置 |
KR1020200073314A KR20210007838A (ko) | 2019-07-11 | 2020-06-17 | 가공 장치 |
CN202010644378.0A CN112216628A (zh) | 2019-07-11 | 2020-07-07 | 加工装置 |
TW109122955A TW202103225A (zh) | 2019-07-11 | 2020-07-08 | 加工裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019129631A JP7349278B2 (ja) | 2019-07-11 | 2019-07-11 | 加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021015446A true JP2021015446A (ja) | 2021-02-12 |
JP7349278B2 JP7349278B2 (ja) | 2023-09-22 |
Family
ID=74059576
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019129631A Active JP7349278B2 (ja) | 2019-07-11 | 2019-07-11 | 加工装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7349278B2 (ja) |
KR (1) | KR20210007838A (ja) |
CN (1) | CN112216628A (ja) |
TW (1) | TW202103225A (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010117763A (ja) * | 2008-11-11 | 2010-05-27 | Kyocera Mita Corp | 電子機器 |
JP2014231123A (ja) * | 2013-05-29 | 2014-12-11 | 株式会社ディスコ | 加工装置および情報交換方法 |
JP2015229224A (ja) * | 2014-06-06 | 2015-12-21 | パナソニックIpマネジメント株式会社 | 産業用ロボット |
WO2018151303A1 (ja) * | 2017-02-20 | 2018-08-23 | 株式会社サザンウィッシュ | 操作表示装置及び操作表示プログラム |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010049466A (ja) | 2008-08-21 | 2010-03-04 | Disco Abrasive Syst Ltd | 加工装置 |
-
2019
- 2019-07-11 JP JP2019129631A patent/JP7349278B2/ja active Active
-
2020
- 2020-06-17 KR KR1020200073314A patent/KR20210007838A/ko active Search and Examination
- 2020-07-07 CN CN202010644378.0A patent/CN112216628A/zh active Pending
- 2020-07-08 TW TW109122955A patent/TW202103225A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010117763A (ja) * | 2008-11-11 | 2010-05-27 | Kyocera Mita Corp | 電子機器 |
JP2014231123A (ja) * | 2013-05-29 | 2014-12-11 | 株式会社ディスコ | 加工装置および情報交換方法 |
JP2015229224A (ja) * | 2014-06-06 | 2015-12-21 | パナソニックIpマネジメント株式会社 | 産業用ロボット |
WO2018151303A1 (ja) * | 2017-02-20 | 2018-08-23 | 株式会社サザンウィッシュ | 操作表示装置及び操作表示プログラム |
Also Published As
Publication number | Publication date |
---|---|
CN112216628A (zh) | 2021-01-12 |
TW202103225A (zh) | 2021-01-16 |
KR20210007838A (ko) | 2021-01-20 |
JP7349278B2 (ja) | 2023-09-22 |
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