JP2021002662A - 光起電力モジュールの封止材 - Google Patents
光起電力モジュールの封止材 Download PDFInfo
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- JP2021002662A JP2021002662A JP2020140655A JP2020140655A JP2021002662A JP 2021002662 A JP2021002662 A JP 2021002662A JP 2020140655 A JP2020140655 A JP 2020140655A JP 2020140655 A JP2020140655 A JP 2020140655A JP 2021002662 A JP2021002662 A JP 2021002662A
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Abstract
Description
− メルトフローインデックスMFIが1g/10分から40g/10分の間であるエチレン/アクリル酸アルキルコポリマー;
− 組成物の重量の0.1%から0.5%の間を占めるシラン
を含む、光起電力セルを入れることが意図された光起電力モジュールの封止材において、
前記封止材は、前記組成物の重量の0.1%から0.5%の間を占める架橋剤を追加的に含み、前記コポリマーは、前記組成物の重量の少なくとも99%を占めることを特徴とする、封止材に関する。
− どのような環境条件であろうとも、その使用中の、酢酸、より一般的にはあらゆる酸の出現の不可能性;
− 特に光起電力モジュールの封止材としての使用における、組成物の寿命を通しての組成物の優れた接着特性の維持;
− 困難な環境中の老化の間の光学特性の改善;
− EVAをベースとする現在の解決策(架橋剤及びシラン)と少なくとも同じ程度に満足のいく、優れた熱機械的特性及び物理化学的特性の維持。
− 有利には、架橋剤は、モノペルオキシカーボネートファミリーに属し、好ましくはOO−tert−ブチル O−(2−エチルヘキシル)モノペルオキシカーボネートからなる;
− 好ましくは、上記コポリマーについて、エチレンの重量含有率は、50%から85%の間、好ましくは60%から84%の間であり、アクリル酸アルキルの重量含有率は、15%から50%の間、好ましくは16%から40%の間である;
− 有利には、シランは、ビニルシラン又は(メタ)アクリルシランからなる;
− 本発明の非限定的な特定化によれば、シランは、メタクリルオキシプロピルシランからなる;
− 有利には、架橋剤は、組成物の重量の0.3%未満を占める;
− 好ましくは、上記コポリマーは、2g/10分から10g/10分の間のメルトフローインデックスMFIを有する;
− 本発明により提供される可能性の1つによれば、組成物は、上記コポリマー、上記架橋剤及び上記シランのみからなる;
− 本発明により提供される別の可能性によれば、組成物は、追加の特定の特性を与えることが意図された添加剤、特に可塑剤、接着促進剤、UV安定剤及び吸収剤、抗酸化剤、難燃剤並びに/又は充填剤を追加的に含む。
従来、特に温度が非常に高くなる場合、EVAベースの封止材の熱機械的特性を調整するために架橋が必要である。この特定の場合、本発明の文脈内で、架橋剤(複数可)の非常に少ない含有量のために架橋は完全ではないが、コポリマー鎖に対するシランのグラフト化及びこのコポリマーの部分的架橋を可能にする。
Lotryl(登録商標)17BA07:エチレン/アクリル酸ブチルコポリマー、このアクリル酸エステルの含有率は、コポリマーの17重量%であり、このMFIは、7g/10分(190℃、2.13kg)である。それは、オートクレーブプロセスによって得られ、その融点は89℃である。以下に提示される結果の表において、このLotryl(登録商標)は、17BA07の頭文字で表示される。
フィルムの調製:
封止材フィルムは、含浸ポリマーの顆粒の押出しによって得る:
処方を特徴付けするために、試験モジュールをホットラミネーションにより得る。
− クリープ及び透過による光学特性の測定:ガラス(4mm)/封止材フィルム/ガラス(4mm)
− 接着の測定:ガラス(4mm)/封止材フィルム/Apolhyaバックシート。
本発明は、以下の非限定的な実施例によってより詳細に例証される。
透過率による光学特性は、Minoltaブランドの分光比色計を使用して、ガラス/封止材/ガラス構造体に対して測定する。測定条件は以下の通りである:
・波長:360nm−740nm(ナノメートル)
・光源:C
・角度:2°
・測定開口部:LAV25mm(ミリメートル)
・バックグラウンド:「Cera」白色プレート+ライトウェル
・ヘイズ:ヘイズは、研究された構造体のヘイズの程度に対応する。それは、規格ASTM D−1003−007に従って計算する。
・透明性:透明性の程度は、400nmから740nmの間の平均透過率値を取得することによって計算し、ガラス層並びにガラス/空気及びガラス/封止材の界面のそれぞれの寄与により補正し、次いで、200μmの厚さに正規化する。透明性は、DHT(加湿加温試験−85℃/85%相対湿度/2000時間)老化の間にも評価した。
クリープ試験は、ガラス/封止材/ガラス構造体(ガラスシートは、長さL=70mmを有する)に対して行う。積層後、試験モジュールを、水平と70°の角度を形成する金属構造体の上に配置する。各モジュールを、第1のガラス層の厚さの一部に及ぶ端部によって固定する。
本発明の要件を満たすために、クリープ測定は、4mm未満の結果を示すべきである。
封止材とガラスの間の接着の程度は、Zwick 1445万能試験機で50mm/分(1分当たりミリメートル)で行われる90°剥離試験を使用してガラス/封止材/バックシート構造体に対して測定する。この測定に使用したバックシートは、本出願会社により製造及び販売されるApolhya(登録商標)からなる単層である。この測定条件は以下の通りである:
・クロスピースの変位速度:50mm/分
・試験片の切り出された幅:10mm
・剥離角度:90°
接着結果は、N/mmで表す。
本発明の要件を満たすために、接着測定は、3.5N/mmより大きい結果を示すべきである。
Claims (11)
- − メルトフローインデックスMFIが1g/10分から40g/10分の間であるエチレン/アクリル酸アルキルコポリマー、
− 組成物の重量の0.1%から0.5%の間を占めるシラン
を含む、光起電力セル(10)を入れることが意図された光起電力モジュール(20)の封止材(22)において、
組成物の重量の0.1%から0.5%の間を占める架橋剤を追加的に含み、前記コポリマーは前記組成物の重量の少なくとも99%を占めることを特徴とする、封止材(22)。 - 前記架橋剤が、モノペルオキシカーボネートファミリーに属し、好ましくはOO−tert−ブチル O−(2−エチルヘキシル)モノペルオキシカーボネートからなることを特徴とする、請求項1に記載の封止材(22)。
- 前記コポリマーに対して、エチレンの重量含有率が、50%から85%の間、好ましくは60%から84%の間であり、アクリル酸アルキルの重量含有率が、15%から50%の間、好ましくは16%から40%の間であることを特徴とする、請求項1又は2に記載の封止材(22)。
- 前記シランが、ビニルシラン又は(メタ)アクリルシランからなることを特徴とする、請求項1から3の何れか一項に記載の封止材(22)。
- 前記シランが、メタクリル酸3−(トリメトキシシリル)プロピルからなることを特徴とする、請求項4に記載の封止材(22)。
- 前記架橋剤が、組成物の重量の0.3%未満を占めることを特徴とする、請求項1から5の何れか一項に記載の封止材(22)。
- 前記コポリマーが、2g/10分から10g/10分の間のメルトフローインデックスMFIを有することを特徴とする、請求項1から6の何れか一項に記載の封止材(22)。
- 組成物が、前記コポリマー、前記架橋剤及び前記シランのみからなることを特徴とする、請求項1から7の何れか一項に記載の封止材(22)。
- 組成物が、追加的な特定の特性を与えることが意図された添加剤、特に可塑剤、接着促進剤、UV安定剤及び吸収剤、抗酸化剤、難燃剤並びに/又は充填剤を追加的に含むことを特徴とする、請求項1から7の何れか一項に記載の封止材(22)。
- 光起電力モジュール(20)における、請求項1から9の何れか一項に記載の封止材(22)の使用。
- 少なくとも1つの封止材(22)と、フロントシート(24)又はバックシート(26)との組合せからなる構造体を含む光起電力モジュール(20)において、前記封止材(22)が請求項1から10の何れか一項に記載されたとおりであることを特徴とする、光起電力モジュール(20)。
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002009309A (ja) * | 2000-06-26 | 2002-01-11 | Mitsubishi Chemicals Corp | 太陽電池モジュールの製造方法 |
WO2007094445A1 (ja) * | 2006-02-17 | 2007-08-23 | Du Pont-Mitsui Polychemicals Co. Ltd. | 太陽電池封止材 |
JP2008533715A (ja) * | 2005-03-08 | 2008-08-21 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 太陽電池素子封止材 |
JP2012190878A (ja) * | 2011-03-09 | 2012-10-04 | Bridgestone Corp | 太陽電池用封止膜及びこれを用いた太陽電池 |
JP2015170657A (ja) * | 2014-03-05 | 2015-09-28 | シーアイ化成株式会社 | 太陽電池モジュール用封止材及び太陽電池モジュール |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2003233469A1 (en) * | 2002-04-01 | 2003-10-20 | World Properties, Inc. | Electrically conductive polymeric foams and elastomers and methods of manufacture thereof |
JP2005002245A (ja) * | 2003-06-13 | 2005-01-06 | Advanced Plastics Compounds Co | シラン架橋難燃性樹脂成形体 |
JP4779074B2 (ja) | 2003-10-03 | 2011-09-21 | 三井・デュポンポリケミカル株式会社 | 太陽電池封止材用シート |
JP4526022B2 (ja) | 2004-12-03 | 2010-08-18 | 三井・デュポンポリケミカル株式会社 | 積層体及びその用途 |
FR2930556B1 (fr) | 2008-04-28 | 2012-08-17 | Arkema France | Composition a base de polymere greffe polyamide et son utilisation dans les modules photovoltaiques |
ES2436113T3 (es) | 2008-07-09 | 2013-12-27 | Borealis Ag | Módulo fotovoltaico que comprende una capa de aislamiento con grupos silano |
US20100269890A1 (en) | 2009-04-23 | 2010-10-28 | Christopher John Koch | Polymeric Encapsulants for Photovoltaic Modules and Methods of Manufacture |
US20110146758A1 (en) * | 2009-06-29 | 2011-06-23 | E. I. Du Pont De Nemours And Company | Reflecting multilayer encapsulant |
CN102482454B (zh) | 2009-08-18 | 2014-03-05 | 巴斯夫欧洲公司 | 具有稳定化聚合封装物的光伏组件 |
US8211265B2 (en) | 2010-06-07 | 2012-07-03 | E. I. Du Pont De Nemours And Company | Method for preparing multilayer structures containing a perfluorinated copolymer resin layer |
US20120255610A1 (en) * | 2011-04-07 | 2012-10-11 | Bokria Jayesh Ghewarchand | Encapsulant for Terrestrial Photovoltaic Modules |
KR101374817B1 (ko) * | 2011-10-13 | 2014-03-19 | 롯데알미늄 주식회사 | 태양전지용 밀봉재 조성물 및 밀봉시트 |
FR2981655B1 (fr) * | 2011-10-24 | 2014-03-14 | Arkema France | Melange-maitre pour la fabrication d'une couche isolante de cable electrique |
JP6299125B2 (ja) | 2013-09-17 | 2018-03-28 | 日立化成株式会社 | リチウムイオンキャパシタ |
-
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002009309A (ja) * | 2000-06-26 | 2002-01-11 | Mitsubishi Chemicals Corp | 太陽電池モジュールの製造方法 |
JP2008533715A (ja) * | 2005-03-08 | 2008-08-21 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 太陽電池素子封止材 |
WO2007094445A1 (ja) * | 2006-02-17 | 2007-08-23 | Du Pont-Mitsui Polychemicals Co. Ltd. | 太陽電池封止材 |
JP2012190878A (ja) * | 2011-03-09 | 2012-10-04 | Bridgestone Corp | 太陽電池用封止膜及びこれを用いた太陽電池 |
JP2015170657A (ja) * | 2014-03-05 | 2015-09-28 | シーアイ化成株式会社 | 太陽電池モジュール用封止材及び太陽電池モジュール |
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