JP2020533208A5 - - Google Patents

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Publication number
JP2020533208A5
JP2020533208A5 JP2020514973A JP2020514973A JP2020533208A5 JP 2020533208 A5 JP2020533208 A5 JP 2020533208A5 JP 2020514973 A JP2020514973 A JP 2020514973A JP 2020514973 A JP2020514973 A JP 2020514973A JP 2020533208 A5 JP2020533208 A5 JP 2020533208A5
Authority
JP
Japan
Prior art keywords
multilayer film
dianhydride
film according
aromatic
acid dianhydride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020514973A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020533208A (ja
JP7843969B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2018/050583 external-priority patent/WO2019055466A1/en
Publication of JP2020533208A publication Critical patent/JP2020533208A/ja
Publication of JP2020533208A5 publication Critical patent/JP2020533208A5/ja
Application granted granted Critical
Publication of JP7843969B2 publication Critical patent/JP7843969B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2020514973A 2017-09-13 2018-09-12 電子回路用途向け多層膜 Active JP7843969B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762557901P 2017-09-13 2017-09-13
US62/557,901 2017-09-13
PCT/US2018/050583 WO2019055466A1 (en) 2017-09-13 2018-09-12 MULTILAYER FILM FOR ELECTRONIC CIRCUIT APPLICATIONS

Publications (3)

Publication Number Publication Date
JP2020533208A JP2020533208A (ja) 2020-11-19
JP2020533208A5 true JP2020533208A5 (https=) 2021-09-30
JP7843969B2 JP7843969B2 (ja) 2026-04-13

Family

ID=63862197

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020514973A Active JP7843969B2 (ja) 2017-09-13 2018-09-12 電子回路用途向け多層膜

Country Status (5)

Country Link
US (1) US11021606B2 (https=)
JP (1) JP7843969B2 (https=)
KR (1) KR102630417B1 (https=)
CN (1) CN111065516A (https=)
WO (1) WO2019055466A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12442084B2 (en) * 2020-04-03 2025-10-14 Dupont Electronics, Inc. Metal-clad polymer films and electronic devices

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3410826A (en) 1967-04-10 1968-11-12 Du Pont Process for preparing shaped articles from polyamide acids before converting to insoluble polyimides
JPH0665708B2 (ja) 1985-11-29 1994-08-24 鐘淵化学工業株式会社 新規ポリイミドフィルム及びその製造法
US5166308A (en) 1990-04-30 1992-11-24 E. I. Du Pont De Nemours And Company Copolyimide film with improved properties
EP0459452A3 (en) * 1990-05-30 1992-04-08 Ube Industries, Ltd. Aromatic polyimide film laminated with metal foil
DE69115171T2 (de) 1990-08-27 1996-05-15 Du Pont Flexible Polyimid-Mehrschichtlaminate und ihre Herstellung.
US5227244A (en) 1990-09-21 1993-07-13 E. I. Du Pont De Nemours And Company Polyimide film with metal salt coating resulting in improved adhesion
US5218034A (en) 1990-09-21 1993-06-08 E. I. Du Pont De Nemours And Company Polyimide film with tin or tin salt incorporation resulting in improved adhesion
US5308569A (en) 1990-11-27 1994-05-03 Ube Industries, Ltd. Process for the preparation of aromatic polyimide film
EP0659553A1 (en) 1993-12-22 1995-06-28 E.I. Du Pont De Nemours And Company Coextruded multi-layer aromatic polyimide film and preparation thereof
US5543222A (en) 1994-04-29 1996-08-06 E. I. Du Pont De Nemours And Company Metallized polyimide film containing a hydrocarbyl tin compound
JP4147639B2 (ja) 1998-09-29 2008-09-10 宇部興産株式会社 フレキシブル金属箔積層体
US6379784B1 (en) 1999-09-28 2002-04-30 Ube Industries, Ltd. Aromatic polyimide laminate
JP4362917B2 (ja) 2000-01-31 2009-11-11 宇部興産株式会社 金属箔積層体およびその製法
US6808818B2 (en) 2001-10-11 2004-10-26 Ube Industries, Ltd. Fusible polyimide and composite polyimide film
TWI298988B (en) 2002-07-19 2008-07-11 Ube Industries Copper-clad laminate
TW200502319A (en) 2002-12-13 2005-01-16 Kaneka Corp Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same
US7285321B2 (en) * 2003-11-12 2007-10-23 E.I. Du Pont De Nemours And Company Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto
JPWO2005115752A1 (ja) * 2004-05-31 2008-03-27 株式会社カネカ ポリイミド積層体およびその製造方法
CN101175633B (zh) * 2005-04-19 2011-12-21 宇部兴产株式会社 聚酰亚胺薄膜层合体
KR101102180B1 (ko) * 2009-01-23 2012-01-02 주식회사 두산 신규 연성 금속박 적층판 및 그 제조방법
US20130011687A1 (en) * 2010-01-18 2013-01-10 Kaneka Corporation Multilayer polymide film and flexible metal laminated board
TWI577546B (zh) * 2011-08-12 2017-04-11 宇部興產股份有限公司 聚醯亞胺金屬疊層體之製造方法
WO2013192474A1 (en) * 2012-06-22 2013-12-27 E. I. Du Pont De Nemours And Company Circuit board
CN105339416B (zh) * 2013-06-28 2017-07-14 新日铁住金化学株式会社 聚酰亚胺、树脂膜及金属包覆层叠体

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