JP2020533208A5 - - Google Patents

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Publication number
JP2020533208A5
JP2020533208A5 JP2020514973A JP2020514973A JP2020533208A5 JP 2020533208 A5 JP2020533208 A5 JP 2020533208A5 JP 2020514973 A JP2020514973 A JP 2020514973A JP 2020514973 A JP2020514973 A JP 2020514973A JP 2020533208 A5 JP2020533208 A5 JP 2020533208A5
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JP
Japan
Prior art keywords
multilayer film
dianhydride
film according
aromatic
acid dianhydride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020514973A
Other languages
English (en)
Japanese (ja)
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JP2020533208A (ja
JP7843969B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2018/050583 external-priority patent/WO2019055466A1/en
Publication of JP2020533208A publication Critical patent/JP2020533208A/ja
Publication of JP2020533208A5 publication Critical patent/JP2020533208A5/ja
Application granted granted Critical
Publication of JP7843969B2 publication Critical patent/JP7843969B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2020514973A 2017-09-13 2018-09-12 電子回路用途向け多層膜 Active JP7843969B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762557901P 2017-09-13 2017-09-13
US62/557,901 2017-09-13
PCT/US2018/050583 WO2019055466A1 (en) 2017-09-13 2018-09-12 MULTILAYER FILM FOR ELECTRONIC CIRCUIT APPLICATIONS

Publications (3)

Publication Number Publication Date
JP2020533208A JP2020533208A (ja) 2020-11-19
JP2020533208A5 true JP2020533208A5 (https=) 2021-09-30
JP7843969B2 JP7843969B2 (ja) 2026-04-13

Family

ID=63862197

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020514973A Active JP7843969B2 (ja) 2017-09-13 2018-09-12 電子回路用途向け多層膜

Country Status (5)

Country Link
US (1) US11021606B2 (https=)
JP (1) JP7843969B2 (https=)
KR (1) KR102630417B1 (https=)
CN (1) CN111065516A (https=)
WO (1) WO2019055466A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12442084B2 (en) * 2020-04-03 2025-10-14 Dupont Electronics, Inc. Metal-clad polymer films and electronic devices

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3410826A (en) 1967-04-10 1968-11-12 Du Pont Process for preparing shaped articles from polyamide acids before converting to insoluble polyimides
JPH0665708B2 (ja) 1985-11-29 1994-08-24 鐘淵化学工業株式会社 新規ポリイミドフィルム及びその製造法
US5166308A (en) 1990-04-30 1992-11-24 E. I. Du Pont De Nemours And Company Copolyimide film with improved properties
EP0459452A3 (en) * 1990-05-30 1992-04-08 Ube Industries, Ltd. Aromatic polyimide film laminated with metal foil
DE69115171T2 (de) 1990-08-27 1996-05-15 Du Pont Flexible Polyimid-Mehrschichtlaminate und ihre Herstellung.
US5227244A (en) 1990-09-21 1993-07-13 E. I. Du Pont De Nemours And Company Polyimide film with metal salt coating resulting in improved adhesion
US5218034A (en) 1990-09-21 1993-06-08 E. I. Du Pont De Nemours And Company Polyimide film with tin or tin salt incorporation resulting in improved adhesion
US5308569A (en) 1990-11-27 1994-05-03 Ube Industries, Ltd. Process for the preparation of aromatic polyimide film
EP0659553A1 (en) 1993-12-22 1995-06-28 E.I. Du Pont De Nemours And Company Coextruded multi-layer aromatic polyimide film and preparation thereof
US5543222A (en) 1994-04-29 1996-08-06 E. I. Du Pont De Nemours And Company Metallized polyimide film containing a hydrocarbyl tin compound
JP4147639B2 (ja) 1998-09-29 2008-09-10 宇部興産株式会社 フレキシブル金属箔積層体
US6379784B1 (en) 1999-09-28 2002-04-30 Ube Industries, Ltd. Aromatic polyimide laminate
JP4362917B2 (ja) 2000-01-31 2009-11-11 宇部興産株式会社 金属箔積層体およびその製法
US6808818B2 (en) 2001-10-11 2004-10-26 Ube Industries, Ltd. Fusible polyimide and composite polyimide film
TWI298988B (en) * 2002-07-19 2008-07-11 Ube Industries Copper-clad laminate
KR20070039151A (ko) 2002-12-13 2007-04-11 가부시키가이샤 가네카 열가소성 폴리이미드 수지 필름, 적층체 및 그것을포함하는 인쇄 배선판의 제조 방법
US7285321B2 (en) * 2003-11-12 2007-10-23 E.I. Du Pont De Nemours And Company Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto
KR20070034007A (ko) * 2004-05-31 2007-03-27 가부시키가이샤 가네카 폴리이미드 적층체 및 그의 제조 방법
WO2006112523A1 (ja) * 2005-04-19 2006-10-26 Ube Industries, Ltd. ポリイミドフィルム積層体
KR101102180B1 (ko) * 2009-01-23 2012-01-02 주식회사 두산 신규 연성 금속박 적층판 및 그 제조방법
CN102712187B (zh) * 2010-01-18 2016-03-30 株式会社钟化 多层聚酰亚胺膜及使用有该多层聚酰亚胺膜的柔性金属箔积层板
CN103889710B (zh) * 2011-08-12 2016-01-13 宇部兴产株式会社 制备聚酰亚胺金属层压体的方法
CN104584696B (zh) * 2012-06-22 2018-04-13 E.I.内穆尔杜邦公司 电路板
JP6422437B2 (ja) * 2013-06-28 2018-11-14 日鉄ケミカル＆マテリアル株式会社 ポリイミド、樹脂フィルム及び金属張積層体

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