JP2020529729A5 - - Google Patents
Info
- Publication number
- JP2020529729A5 JP2020529729A5 JP2020505177A JP2020505177A JP2020529729A5 JP 2020529729 A5 JP2020529729 A5 JP 2020529729A5 JP 2020505177 A JP2020505177 A JP 2020505177A JP 2020505177 A JP2020505177 A JP 2020505177A JP 2020529729 A5 JP2020529729 A5 JP 2020529729A5
- Authority
- JP
- Japan
- Prior art keywords
- gan
- contact
- gan layer
- optimal
- layer doped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762538994P | 2017-07-31 | 2017-07-31 | |
| US62/538,994 | 2017-07-31 | ||
| PCT/US2018/044023 WO2019027820A1 (en) | 2017-07-31 | 2018-07-27 | MICRO-LED NANOPOROUS DEVICES AND METHODS OF MAKING SAME |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2020529729A JP2020529729A (ja) | 2020-10-08 |
| JP2020529729A5 true JP2020529729A5 (https=) | 2022-11-16 |
Family
ID=65234177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020505177A Pending JP2020529729A (ja) | 2017-07-31 | 2018-07-27 | ナノポーラスマイクロledデバイスおよび製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20200152841A1 (https=) |
| EP (1) | EP3662518A4 (https=) |
| JP (1) | JP2020529729A (https=) |
| CN (1) | CN111052418A (https=) |
| WO (1) | WO2019027820A1 (https=) |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110212064B (zh) * | 2018-02-28 | 2020-10-09 | 华为技术有限公司 | 一种发光二极管芯片及其制备方法 |
| US11870015B2 (en) | 2019-03-11 | 2024-01-09 | Saphlux, Inc. | Light conversion devices incorporating quantum dots |
| US11757072B2 (en) * | 2019-03-11 | 2023-09-12 | Saphlux, Inc. | Semiconductor devices incorporating quantum dots |
| CN110058412B (zh) * | 2019-04-23 | 2020-02-18 | 深圳惠牛科技有限公司 | 一种传输解耦的大视场光波导镜片 |
| US11094530B2 (en) | 2019-05-14 | 2021-08-17 | Applied Materials, Inc. | In-situ curing of color conversion layer |
| US11239213B2 (en) | 2019-05-17 | 2022-02-01 | Applied Materials, Inc. | In-situ curing of color conversion layer in recess |
| KR20220067539A (ko) * | 2019-09-27 | 2022-05-24 | 뉴 실리콘 코포레이션 피티이 엘티디 | 반도체 소자의 제조방법 및 이의 반도체 소자 |
| CN110992841A (zh) * | 2019-11-06 | 2020-04-10 | 深圳市华星光电半导体显示技术有限公司 | 显示装置及显示装置的制作方法 |
| FR3105567B1 (fr) * | 2019-12-19 | 2021-12-17 | Commissariat Energie Atomique | Procede pour fabriquer une structure gan/ingan relaxee |
| KR102937515B1 (ko) * | 2020-01-21 | 2026-03-11 | 사플럭스, 아이엔씨. | 양자점들을 포함하는 반도체 소자들 |
| KR20220140749A (ko) | 2020-01-22 | 2022-10-18 | 포로 테크놀로지스 리미티드 | 적색 led 및 제작 방법 |
| JP7296481B2 (ja) | 2020-03-03 | 2023-06-22 | 東莞市中麒光電技術有限公司 | 発光ダイオード及びその製造方法 |
| CN111505866B (zh) * | 2020-04-21 | 2022-04-12 | 京东方科技集团股份有限公司 | 显示装置及其制作方法 |
| CN111668249A (zh) * | 2020-06-02 | 2020-09-15 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及其制作方法 |
| CN116034117A (zh) | 2020-07-24 | 2023-04-28 | 应用材料公司 | 具有用于uv-led固化的基于硫醇的交联剂的量子点配方 |
| TW202211498A (zh) * | 2020-08-04 | 2022-03-16 | 英商普羅科技有限公司 | Led裝置及製造方法 |
| TWI905241B (zh) | 2020-08-04 | 2025-11-21 | 英商普羅科技有限公司 | Led及製造方法 |
| US11646397B2 (en) | 2020-08-28 | 2023-05-09 | Applied Materials, Inc. | Chelating agents for quantum dot precursor materials in color conversion layers for micro-LEDs |
| GB202014318D0 (en) | 2020-09-11 | 2020-10-28 | Poro Tech Ltd | LED Device |
| DE102020128679A1 (de) * | 2020-10-30 | 2022-05-05 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches bauelement und verfahren zur herstellung eines halbleiterkörpers |
| US20220288878A1 (en) | 2021-03-12 | 2022-09-15 | Applied Materials, Inc. | Print Process For Color Conversion Layer Using Mask |
| US20220293669A1 (en) * | 2021-03-15 | 2022-09-15 | Samsung Electronics Co., Ltd. | Display apparatus and method of manufacturing the same |
| WO2022204212A2 (en) | 2021-03-25 | 2022-09-29 | Applied Materials, Inc. | Micro-led displays to reduce subpixel crosstalk and methods of manufacture |
| EP4071809A1 (en) | 2021-04-07 | 2022-10-12 | Samsung Electronics Co., Ltd. | Color conversion structure, display apparatus, and method of manufacturing the display apparatus |
| KR102866873B1 (ko) | 2021-04-30 | 2025-10-01 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
| KR20220149877A (ko) | 2021-04-30 | 2022-11-09 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
| KR20220149829A (ko) | 2021-04-30 | 2022-11-09 | 삼성디스플레이 주식회사 | 표시 장치와 그의 제조 방법 |
| KR102903682B1 (ko) * | 2021-05-14 | 2025-12-24 | 삼성디스플레이 주식회사 | 표시 장치 |
| DE102021113016A1 (de) * | 2021-05-19 | 2022-11-24 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterlaser und optoelektronisches halbleiterkonverterelement |
| EP4378003A1 (en) * | 2021-07-28 | 2024-06-05 | Poro Technologies Ltd | Led display device, method of controlling the same, and method of manufacturing a led display device |
| TWI804952B (zh) | 2021-08-17 | 2023-06-11 | 友達光電股份有限公司 | 電致發光元件及應用其的顯示裝置 |
| KR102727056B1 (ko) * | 2021-12-01 | 2024-11-06 | 삼성전자주식회사 | 마이크로 발광 반도체 소자, 이를 포함한 디스플레이 장치 및 그 제조 방법 |
| KR102885873B1 (ko) * | 2021-12-17 | 2025-11-12 | 삼성전자주식회사 | 색 변환 필름, 디스플레이 장치 및 색 변환 필름 제조 방법 |
| CN114606499B (zh) * | 2022-04-07 | 2023-06-06 | 燕山大学 | 一种表面具有微孔结构的金属及其制备方法与应用 |
| CN116978894A (zh) * | 2022-04-20 | 2023-10-31 | 海信视像科技股份有限公司 | 一种显示装置 |
| CN115064632A (zh) * | 2022-05-19 | 2022-09-16 | 西安赛富乐斯半导体科技有限公司 | 一种基于量子点显色技术的Micro LED芯片及其制造方法 |
| CN115000279A (zh) * | 2022-08-01 | 2022-09-02 | 西安赛富乐斯半导体科技有限公司 | 量子点色彩转换层微阵列及其制备方法、应用 |
| KR20240030349A (ko) * | 2022-08-30 | 2024-03-07 | 삼성전자주식회사 | 다중 파장 발광 소자 및 그 제조 방법 |
| KR20240044983A (ko) * | 2022-09-29 | 2024-04-05 | 삼성전자주식회사 | 발광 소자, 이를 포함하는 디스플레이 장치 및 그 제조 방법 |
| GB202216889D0 (en) * | 2022-11-11 | 2022-12-28 | Poro Tech Ltd | Opto-electronic device and method of manufacturing |
| US20250022909A1 (en) * | 2023-07-14 | 2025-01-16 | Saphlux, Inc. | Semiconductor devices incorporating quantum dots |
| CN117038695A (zh) * | 2023-08-07 | 2023-11-10 | 星钥(珠海)半导体有限公司 | 一种遂穿结联rgb微型发光二极管及其制作方法 |
| KR20250043079A (ko) * | 2023-09-21 | 2025-03-28 | 삼성전자주식회사 | 발광 소자 및 이를 포함하는 디스플레이 장치 |
| KR20250047000A (ko) * | 2023-09-27 | 2025-04-03 | 삼성전자주식회사 | 나노 막대 발광 소자 및 그 제조 방법, 및 나노 막대 발광 소자를 포함하는 디스플레이 장치 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4193471B2 (ja) * | 2001-12-14 | 2008-12-10 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
| US8941566B2 (en) * | 2007-03-08 | 2015-01-27 | 3M Innovative Properties Company | Array of luminescent elements |
| US8455904B2 (en) * | 2009-04-20 | 2013-06-04 | 3M Innovative Properties Company | Non-radiatively pumped wavelength converter |
| US20120161185A1 (en) * | 2009-06-19 | 2012-06-28 | Tao Wang | Light emitting diodes |
| EP2460191A2 (en) * | 2009-07-30 | 2012-06-06 | 3M Innovative Properties Company | Pixelated led |
| US8557616B2 (en) * | 2009-12-09 | 2013-10-15 | Nano And Advanced Materials Institute Limited | Method for manufacturing a monolithic LED micro-display on an active matrix panel using flip-chip technology and display apparatus having the monolithic LED micro-display |
| KR101726807B1 (ko) * | 2010-11-01 | 2017-04-14 | 삼성전자주식회사 | 반도체 발광소자 |
| DE102010051286A1 (de) * | 2010-11-12 | 2012-05-16 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung |
| KR20120057298A (ko) * | 2010-11-26 | 2012-06-05 | 서울옵토디바이스주식회사 | 발광 소자 및 그 제조 방법 |
| US8835965B2 (en) * | 2012-01-18 | 2014-09-16 | The Penn State Research Foundation | Application of semiconductor quantum dot phosphors in nanopillar light emitting diodes |
| CN103412435B (zh) * | 2013-07-24 | 2015-11-25 | 北京京东方光电科技有限公司 | 一种液晶显示屏及显示装置 |
| US9048387B2 (en) * | 2013-08-09 | 2015-06-02 | Qingdao Jason Electric Co., Ltd. | Light-emitting device with improved light extraction efficiency |
| US9574135B2 (en) * | 2013-08-22 | 2017-02-21 | Nanoco Technologies Ltd. | Gas phase enhancement of emission color quality in solid state LEDs |
| KR102131599B1 (ko) * | 2013-12-16 | 2020-07-09 | 삼성디스플레이 주식회사 | 발광 다이오드 및 그 제조 방법 |
| DE102014112551A1 (de) | 2014-09-01 | 2016-03-03 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
| CN104868023B (zh) * | 2015-05-11 | 2018-02-16 | 南京大学 | Iii族氮化物半导体/量子点混合白光led器件及其制备方法 |
| KR102617466B1 (ko) * | 2016-07-18 | 2023-12-26 | 주식회사 루멘스 | 마이크로 led 어레이 디스플레이 장치 |
| KR102650341B1 (ko) * | 2016-11-25 | 2024-03-22 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법 |
| US10629577B2 (en) * | 2017-03-16 | 2020-04-21 | Invensas Corporation | Direct-bonded LED arrays and applications |
-
2018
- 2018-07-27 CN CN201880056804.XA patent/CN111052418A/zh active Pending
- 2018-07-27 JP JP2020505177A patent/JP2020529729A/ja active Pending
- 2018-07-27 EP EP18840256.4A patent/EP3662518A4/en not_active Withdrawn
- 2018-07-27 US US16/632,044 patent/US20200152841A1/en not_active Abandoned
- 2018-07-27 WO PCT/US2018/044023 patent/WO2019027820A1/en not_active Ceased
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