JP2020526917A - コーティングされたトランスミッタコイルを具備するコーティング装置 - Google Patents
コーティングされたトランスミッタコイルを具備するコーティング装置 Download PDFInfo
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- JP2020526917A JP2020526917A JP2019571615A JP2019571615A JP2020526917A JP 2020526917 A JP2020526917 A JP 2020526917A JP 2019571615 A JP2019571615 A JP 2019571615A JP 2019571615 A JP2019571615 A JP 2019571615A JP 2020526917 A JP2020526917 A JP 2020526917A
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- transmitter coil
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/001—Magnets
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
- H05B6/105—Induction heating apparatus, other than furnaces, for specific applications using a susceptor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4581—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber characterised by material of construction or surface finish of the means for supporting the substrate
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Electromagnetism (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Electroplating Methods And Accessories (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
気密性のハウジングがプロセスチャンバ1を囲み、その中にガス入口部材2が開口し、それを通して(更なるプリカーサに加えて)塩素含有ガス、例えばIII主族の元素の塩素含有化合物も供給される。しかしながら、コーティングプロセス後のエッチングステップによりプロセスチャンバ1を清浄化するために、ガス入口部材2を通って別の塩素含有化合物も供給され得る。ガスとして、ここでは特にCl2又はHClが適切である。
2 ガス入口部材
3 サセプタ
4 基板
5 トランスミッタコイル
6 端部
7 端部
8 中空
9 コーティング
Claims (13)
- 1又は複数のプロセスガスをプロセスチャンバ(1)に供給することによって基板(4)上に層を堆積するための装置であって、該装置内で前記基板(4)を担持するサセプタ(3)が1又は複数のトランスミッタコイル(5)により発生した交流電磁場によりプロセス温度に加熱可能であり、1又は複数のトランスミッタコイルがコーティング(9)を有する、前記装置において、前記コーティング(9)がスズとニッケルからなることを特徴とする装置。
- 前記コーティング(9)が、Ni3Sn2とNi3Sn4からなる混合物であることを特徴とする請求項1に記載の装置。
- 前記コーティング(9)が、40〜30重量%のニッケル含有量と、60〜70重量%のスズ含有量とを有することを特徴とする前出請求項のいずれかに記載の装置。
- 前記コーティング(9)の最外層が、ニッケルとスズの元素のみで構成されていることを特徴とする前出請求項のいずれかに記載の装置。
- 前記コーティング(9)のスズとニッケルの比が、重量%で65/35であることを特徴とする前出請求項のいずれかに記載の装置。
- 前記コーティング(9)の層厚が、1〜50μm又は1〜30μm、好ましくは20μmであることを特徴とする前出請求項のいずれかに記載の装置。
- 前記コーティング(9)が、前記トランスミッタコイル(5)上にガルバニック方式でコーティングされていることを特徴とする前出請求項のいずれかに記載の装置。
- 前記コーティング9を担持する実質的にニッケルを含有するベース層が、実質的に銅を含有するトランスミッタコイル上に適用されていることを特徴とする前出請求項のいずれかに記載の装置。
- 前記ベース層が、1〜50μmの層厚を有し、かつ、特に少なくとも30μmの層厚を有することを特徴とする請求項8に記載の装置。
- 請求項1〜9のいずれかに記載の装置のためのトランスミッタコイル(5)であって、前記トランスミッタコイル(5)が、無線周波数の交流場を発生するために2つの端部(6、7)を具備する渦巻き状形態を有し、前記トランスミッタコイル(5)が、前記端部(6、7)間に延在する中空(8)と、コーティング(9)によりコーティングされた外壁とを有する、前記トランスミッタコイル(5)において、前記コーティング(9)が、スズとニッケルからなることを特徴とするトランスミッタコイル。
- 前記コーティング(9)が、Ni3Sn2とNi3Sn4からなる混合物であることを特徴とする請求項10に記載のトランスミッタコイル。
- スズとニッケルの比が、重量%で60/40〜70/30の範囲でありかつ特に重量%で35/35であり、かつ/又は、層厚が1〜50μmの範囲であり特に20μmであることを特徴とする請求項10又は11に記載のトランスミッタコイル。
- 前出請求項のいずれかに記載の特徴1又は複数の特徴的構成により特徴付けられる装置又はトランスミッタコイル。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE202017104061.5 | 2017-07-07 | ||
DE202017104061.5U DE202017104061U1 (de) | 2017-07-07 | 2017-07-07 | Beschichtungseinrichtung mit beschichteter Sendespule |
PCT/EP2018/067947 WO2019007956A1 (de) | 2017-07-07 | 2018-07-03 | Beschichtungsvorrichtung mit beschichteter sendespule |
Publications (2)
Publication Number | Publication Date |
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JP2020526917A true JP2020526917A (ja) | 2020-08-31 |
JP7221229B2 JP7221229B2 (ja) | 2023-02-13 |
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ID=62842100
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2019571615A Active JP7221229B2 (ja) | 2017-07-07 | 2018-07-03 | コーティングされたトランスミッタコイルを具備するコーティング装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US11851762B2 (ja) |
EP (1) | EP3649280A1 (ja) |
JP (1) | JP7221229B2 (ja) |
KR (1) | KR102640176B1 (ja) |
CN (1) | CN110869540A (ja) |
DE (1) | DE202017104061U1 (ja) |
TW (1) | TWI766059B (ja) |
WO (1) | WO2019007956A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023008689A1 (ko) * | 2021-07-26 | 2023-02-02 | 삼성전자 주식회사 | 무선 충전을 지원하는 안테나 구조체 및 이를 갖는 전자 장치 |
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JP2002275632A (ja) * | 2001-03-19 | 2002-09-25 | Tokyo Electron Ltd | 処理装置 |
US20120148760A1 (en) * | 2010-12-08 | 2012-06-14 | Glen Eric Egami | Induction Heating for Substrate Processing |
JP2015015300A (ja) * | 2013-07-03 | 2015-01-22 | Jx日鉱日石金属株式会社 | 電磁波シールド用金属箔、電磁波シールド材及びシールドケーブル |
JP2016069659A (ja) * | 2014-09-26 | 2016-05-09 | 株式会社オートネットワーク技術研究所 | コネクタ用電気接点材料及びその製造方法 |
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2017
- 2017-07-07 DE DE202017104061.5U patent/DE202017104061U1/de active Active
-
2018
- 2018-07-02 TW TW107122822A patent/TWI766059B/zh active
- 2018-07-03 KR KR1020207001718A patent/KR102640176B1/ko active IP Right Grant
- 2018-07-03 EP EP18737872.4A patent/EP3649280A1/de active Pending
- 2018-07-03 WO PCT/EP2018/067947 patent/WO2019007956A1/de unknown
- 2018-07-03 JP JP2019571615A patent/JP7221229B2/ja active Active
- 2018-07-03 US US16/628,985 patent/US11851762B2/en active Active
- 2018-07-03 CN CN201880045491.8A patent/CN110869540A/zh active Pending
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US20120148760A1 (en) * | 2010-12-08 | 2012-06-14 | Glen Eric Egami | Induction Heating for Substrate Processing |
JP2015015300A (ja) * | 2013-07-03 | 2015-01-22 | Jx日鉱日石金属株式会社 | 電磁波シールド用金属箔、電磁波シールド材及びシールドケーブル |
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WO2023008689A1 (ko) * | 2021-07-26 | 2023-02-02 | 삼성전자 주식회사 | 무선 충전을 지원하는 안테나 구조체 및 이를 갖는 전자 장치 |
Also Published As
Publication number | Publication date |
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KR20200026900A (ko) | 2020-03-11 |
US20200123657A1 (en) | 2020-04-23 |
JP7221229B2 (ja) | 2023-02-13 |
WO2019007956A1 (de) | 2019-01-10 |
TW201907053A (zh) | 2019-02-16 |
TWI766059B (zh) | 2022-06-01 |
DE202017104061U1 (de) | 2018-10-09 |
KR102640176B1 (ko) | 2024-02-22 |
EP3649280A1 (de) | 2020-05-13 |
CN110869540A (zh) | 2020-03-06 |
US11851762B2 (en) | 2023-12-26 |
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