JP2020524749A - 複合材 - Google Patents
複合材 Download PDFInfo
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- JP2020524749A JP2020524749A JP2019571293A JP2019571293A JP2020524749A JP 2020524749 A JP2020524749 A JP 2020524749A JP 2019571293 A JP2019571293 A JP 2019571293A JP 2019571293 A JP2019571293 A JP 2019571293A JP 2020524749 A JP2020524749 A JP 2020524749A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/065—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/002—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of porous nature
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/002—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of porous nature
- B22F7/004—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of porous nature comprising at least one non-porous part
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
- B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
- B22F2007/042—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal characterised by the layer forming method
- B22F2007/045—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal characterised by the layer forming method accompanied by fusion or impregnation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
- B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
- B22F2007/042—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal characterised by the layer forming method
- B22F2007/047—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal characterised by the layer forming method non-pressurised baking of the paste or slurry containing metal powder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/105—Metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/107—Ceramic
- B32B2264/108—Carbon, e.g. graphite particles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2266/00—Composition of foam
- B32B2266/04—Inorganic
- B32B2266/045—Metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
Description
金属フォームとしては、銅金属フォームとして、厚さが約100μm程度であり、気孔度が約70%程度であるフィルム形状の銅フォームを使用した。前記銅金属フォームを熱硬化型シリコン樹脂(ダウコーニング社、Sylgard 183kitポリジメチルシロキサン)と、デンドライト状でありかつ平均粒径が4μm程度である銅粉末を混合した溶液(銅粉末10重量%)に含浸させ、アプリケーターを用いて最終複合材の厚さが約120μm程度のフィルム形態になるように、過量の組成物を除去した。次に、前記材料を約120℃のオーブンに約20分間維持して硬化させることにより、複合材を製造した。この複合材の熱伝導度は、約2.765W/mK程度であり、電気抵抗は、0.36Ω/□程度であった。
電気伝導性フィラーとして、フレーク状でありかつ平均粒径が約10μm程度である銅粉末を適用したことを除いて、実施例1と同一に複合材を製造した。この複合材の熱伝導度は、約4.329W/mK程度であり、電気抵抗は、0.32Ω/□程度であった。
電気伝導性フィラーとして、球形でありかつ平均粒径が約3〜6μm程度の水準であるニッケル粉末を適用したことを除いて、実施例1と同一に複合材を製造した。この複合材の熱伝導度は、約1.741W/mK程度であり、電気抵抗は、0.048Ω/□程度であった。
電気伝導性フィラーとして、フレーク状でありかつ平均粒径が約3〜6μm程度の水準であるニッケル粉末を適用したことを除いて、実施例1と同一に複合材を製造した。この複合材の熱伝導度は、約2.986W/mK程度であり、電気抵抗は、0.041Ω/□程度であった。
電気伝導性フィラーとして、フレーク状でありかつ平均粒径が約3〜6μm程度の水準であるグラファイト粉末を適用したことを除いて、実施例1と同一に複合材を製造した。この複合材の熱伝導度は、約2.134W/mK程度であり、電気抵抗は、0.51Ω/□程度であった。
熱硬化型シリコン樹脂(ダウコーニング社、Sylgard 183kitポリジメチルシロキサン)をフィルムアプリケーターを用いて120μm厚さのフィルムに形成した。その後、120℃のオーブンで20分間加熱して熱硬化を進めた。この複合材の熱伝導度は、約0.270W/mK程度であり、電気抵抗は、絶縁体水準と高く測定された。
厚さが100μmであり、気孔度が75%であるシート形態の銅フォームに熱硬化型シリコン樹脂(ダウコーニング社、Sylgard 183kitポリジメチルシロキサン)をフィルムアプリケーターを用いて全体厚さが120μmとなるようにコートした。その後、120℃のオーブンで20分間加熱して熱硬化を進めて複合材を製造した。この複合材の熱伝導度は、約1.212W/mK程度であり、電気抵抗は、絶縁体水準と高く測定された。
熱硬化型シリコン樹脂(ダウコーニング社、Sylgard 183kitポリジメチルシロキサン)と、デンドライト状でありかつ平均粒径が4μmである銅粉末を混合した溶液(銅粉末25重量%)を混合した溶液をフィルムアプリケーターを用いて120μm厚さのフィルムに形成した。その後、120℃のオーブンで20分間加熱して熱硬化を進めて放熱複合材を製造した。この複合材の熱伝導度は、約0.402W/mK程度であり、電気抵抗は、絶縁体水準と高く測定された。
熱硬化型シリコン樹脂(ダウコーニング社、Sylgard 183kitポリジメチルシロキサン)と、フレーク状でありかつ平均粒径が10μm程度である銅粉末を混合した溶液(銅粉末25重量%)を混合した溶液をフィルムアプリケーターを用いて120μm厚さのフィルムに形成した。その後、120℃のオーブンで20分間加熱して熱硬化を進めて放熱複合材を製造した。この複合材の熱伝導度は、約0.338W/mK程度であり、電気抵抗は、絶縁体水準と高く測定された。
熱硬化型シリコン樹脂(ダウコーニング社、Sylgard 183kitポリジメチルシロキサン)と、球形でありかつ平均粒径が3〜6μm程度であるニッケル粉末を混合した溶液(ニッケル粉末25重量%)を混合した溶液をフィルムアプリケーターを用いて120μm厚さのフィルムに形成した。その後、120℃のオーブンで20分間加熱して熱硬化を進めて放熱複合材を製造した。この複合材の熱伝導度は、約0.297W/mK程度であり、電気抵抗は、絶縁体水準と高く測定された。
熱硬化型シリコン樹脂(ダウコーニング社、Sylgard 183kitポリジメチルシロキサン)と、フレーク状でありかつ平均粒径が3〜6μm程度であるニッケル粉末を混合した溶液(ニッケル粉末25重量%)を混合した溶液をフィルムアプリケーターを用いて120μm厚さのフィルムに形成した。その後、120℃のオーブンで20分間加熱して熱硬化を進めて放熱複合材を製造した。この複合材の熱伝導度は、約0.301W/mK程度であり、電気抵抗は、絶縁体水準と高く測定された。
21、31 高分子成分
22、32 金属フォーム
35 電気伝導性フィラー
Claims (17)
- フィルム形態の金属フォームと、前記金属フォームの表面または金属フォームの内部に存在し、電気伝導性フィラーを含む高分子成分とを含む複合材。
- 前記金属フォームの厚さMTおよび前記複合材の全体厚さTの比率T/MTが2.5以下である、請求項1に記載の複合材。
- 前記金属フォームの厚さMTおよび前記複合材の全体厚さTの比率T/MTが1以上である、請求項1または2に記載の複合材。
- 前記金属フォームの厚さMTおよび前記複合材の全体厚さTの比率T/MTが3以下である、請求項1に記載の複合材。
- 前記金属フォームは、熱伝導度が8W/mK以上である金属または金属合金を含む、請求項1から4のいずれか一項に記載の複合材。
- 前記金属フォームは、厚さが10μm以上である、請求項1から5のいずれか一項に記載の複合材。
- 前記金属フォームは、気孔度が10〜99%の範囲内にある、請求項1から6のいずれか一項に記載の複合材。
- 前記金属フォームは、銅、金、白金、銀、アルミニウム、ニッケル、マンガン、鉄、コバルト、マグネシウム、モリブデン、タングステンおよび亜鉛からなる群から選ばれたいずれか一つの金属または2種以上を含む骨格を有する、請求項1から7のいずれか一項に記載の複合材。
- 前記高分子成分は、アクリル樹脂、シリコン樹脂、エポキシ樹脂、ウレタン樹脂、アミノ樹脂およびフェノール樹脂からなる群から選ばれた一つ以上を含む、請求項1から8のいずれか一項に記載の複合材。
- 前記高分子成分の体積PVと前記金属フォームの体積MVの比率MV/PVは、10以下である、請求項1から9のいずれか一項に記載の複合材。
- 前記電気伝導性フィラーは、金属フィラー、金属合金フィラーまたは炭素系フィラーである、請求項1から10のいずれか一項に記載の複合材。
- 前記電気伝導性フィラーは、ニッケル、鉄、コバルト、銀、銅、金、アルミニウム、カルシウム、タングステン、亜鉛、モリブデン、白金、リチウム、スズ、鉛、チタン、マンガン、マグネシウムおよびクロムからなる群から選択される一つ以上のフィラーである、請求項1から11のいずれか一項に記載の複合材。
- 前記電気伝導性フィラーは、黒鉛、炭素繊維、カーボンナノチューブ、グラフェンまたはグラファイトである、請求項1から11のいずれか一項に記載の複合材。
- 前記電気伝導性フィラーは、球形、針状、板状、フレーク状、デンドライト状または星形である、請求項1から13のいずれか一項に記載の複合材。
- 前記電気伝導性フィラーは、平均粒径が0.001μm〜80μmの範囲内である、請求項1に記載の複合材。
- 前記電気伝導性フィラーの体積比が80vol%以下である、請求項1から15のいずれか一項に記載の複合材。
- 金属または金属合金を含み、フィルム形態である金属フォームの表面に電気伝導性フィラーを含む硬化性高分子組成物が存在する状態で前記高分子組成物を硬化させる段階を含む、請求項1に記載の複合材の製造方法。
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