JP2020522895A5 - - Google Patents

Download PDF

Info

Publication number
JP2020522895A5
JP2020522895A5 JP2019567326A JP2019567326A JP2020522895A5 JP 2020522895 A5 JP2020522895 A5 JP 2020522895A5 JP 2019567326 A JP2019567326 A JP 2019567326A JP 2019567326 A JP2019567326 A JP 2019567326A JP 2020522895 A5 JP2020522895 A5 JP 2020522895A5
Authority
JP
Japan
Prior art keywords
distribution plate
gas distribution
gas
fluid
passages
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019567326A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020522895A (ja
JP7219233B2 (ja
Filing date
Publication date
Priority claimed from US15/613,855 external-priority patent/US11380557B2/en
Application filed filed Critical
Publication of JP2020522895A publication Critical patent/JP2020522895A/ja
Publication of JP2020522895A5 publication Critical patent/JP2020522895A5/ja
Application granted granted Critical
Publication of JP7219233B2 publication Critical patent/JP7219233B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2019567326A 2017-06-05 2018-05-31 半導体処理チャンバ内でのガス供給のための装置および方法 Active JP7219233B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/613,855 US11380557B2 (en) 2017-06-05 2017-06-05 Apparatus and method for gas delivery in semiconductor process chambers
US15/613,855 2017-06-05
PCT/US2018/035355 WO2018226503A1 (en) 2017-06-05 2018-05-31 Apparatus and method for gas delivery in semiconductor process chambers

Publications (3)

Publication Number Publication Date
JP2020522895A JP2020522895A (ja) 2020-07-30
JP2020522895A5 true JP2020522895A5 (https=) 2021-07-26
JP7219233B2 JP7219233B2 (ja) 2023-02-07

Family

ID=64458906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019567326A Active JP7219233B2 (ja) 2017-06-05 2018-05-31 半導体処理チャンバ内でのガス供給のための装置および方法

Country Status (7)

Country Link
US (1) US11380557B2 (https=)
EP (1) EP3635776A4 (https=)
JP (1) JP7219233B2 (https=)
KR (1) KR102530955B1 (https=)
CN (1) CN110800095B (https=)
TW (1) TWI821188B (https=)
WO (1) WO2018226503A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7190386B2 (ja) * 2019-03-28 2022-12-15 芝浦メカトロニクス株式会社 成膜装置
KR20260046529A (ko) 2019-08-23 2026-04-07 램 리써치 코포레이션 열 제어된 샹들리에 샤워헤드
WO2021044622A1 (ja) * 2019-09-06 2021-03-11 キヤノンアネルバ株式会社 ロードロック装置
CN114402426B (zh) 2020-08-18 2025-08-08 玛特森技术公司 具有冷却系统的快速热处理系统

Family Cites Families (130)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3022232A (en) * 1958-05-26 1962-02-20 Caterpillar Tractor Co Method and apparatus for simultaneously plating and lapping
US2959355A (en) * 1958-07-25 1960-11-08 Sandberg Serrell Corp Nozzle
US3024519A (en) * 1960-07-19 1962-03-13 Bendix Corp Cold weld semiconductor housing
US3461045A (en) * 1965-10-21 1969-08-12 Teletype Corp Method of plating through holes
US4745670A (en) * 1980-10-28 1988-05-24 Rockwell International Corporation Method for making chemical laser nozzle arrays
US4530739A (en) 1984-03-09 1985-07-23 Energy Conversion Devices, Inc. Method of fabricating an electroplated substrate
CA1272661A (en) * 1985-05-11 1990-08-14 Yuji Chiba Reaction apparatus
US4864329A (en) * 1988-09-22 1989-09-05 Xerox Corporation Fluid handling device with filter and fabrication process therefor
GB8928492D0 (en) * 1989-12-18 1990-02-21 Westinghouse Brake & Signal Housings for semiconductor devices
JPH0422601A (ja) * 1990-05-18 1992-01-27 Kobe Steel Ltd 貫通孔を有する成形体並びにその製造方法及び装置
US5255017A (en) * 1990-12-03 1993-10-19 Hewlett-Packard Company Three dimensional nozzle orifice plates
US5277783A (en) * 1991-05-15 1994-01-11 Brother Kogyo Kabushiki Kaisha Manufacturing method for orifice plate
US6514376B1 (en) * 1991-06-27 2003-02-04 Applied Materials Inc. Thermal control apparatus for inductively coupled RF plasma reactor having an overhead solenoidal antenna
US6063233A (en) * 1991-06-27 2000-05-16 Applied Materials, Inc. Thermal control apparatus for inductively coupled RF plasma reactor having an overhead solenoidal antenna
US5352108A (en) * 1991-10-18 1994-10-04 Norito Sudo Porous film and porous film manufacturing apparatus
US5249358A (en) * 1992-04-28 1993-10-05 Minnesota Mining And Manufacturing Company Jet impingment plate and method of making
US5317805A (en) * 1992-04-28 1994-06-07 Minnesota Mining And Manufacturing Company Method of making microchanneled heat exchangers utilizing sacrificial cores
US5309322A (en) * 1992-10-13 1994-05-03 Motorola, Inc. Leadframe strip for semiconductor packages and method
DE59407670D1 (de) * 1993-04-16 1999-03-04 Heinze Dyconex Patente Kern für elektrische Verbindungssubstrate und elektrische Verbindungssubstrate mit Kern, sowie Verfahren zu deren Herstellung
US5433835B1 (en) * 1993-11-24 1997-05-20 Applied Materials Inc Sputtering device and target with cover to hold cooling fluid
US5487822A (en) * 1993-11-24 1996-01-30 Applied Materials, Inc. Integrated sputtering target assembly
MX9601409A (es) * 1995-04-14 1997-08-30 Canon Kk Metodo para producir una cabeza de eyeccion de liquido y cabeza de eyeccion de liquido obtenida por dicho metodo.
US5968379A (en) * 1995-07-14 1999-10-19 Applied Materials, Inc. High temperature ceramic heater assembly with RF capability and related methods
JPH09289195A (ja) 1996-04-22 1997-11-04 Nisshinbo Ind Inc プラズマエッチング電極
JP3372765B2 (ja) * 1996-07-12 2003-02-04 キヤノン株式会社 液体吐出ヘッド、ヘッドカートリッジ、液体吐出装置、記録システム、ヘッドキット、および液体吐出ヘッドの製造方法
JPH10125651A (ja) * 1996-10-17 1998-05-15 Shin Etsu Chem Co Ltd 多孔電極板
US6051286A (en) * 1997-02-12 2000-04-18 Applied Materials, Inc. High temperature, high deposition rate process and apparatus for depositing titanium layers
US5983906A (en) * 1997-01-24 1999-11-16 Applied Materials, Inc. Methods and apparatus for a cleaning process in a high temperature, corrosive, plasma environment
US6189482B1 (en) * 1997-02-12 2001-02-20 Applied Materials, Inc. High temperature, high flow rate chemical vapor deposition apparatus and related methods
US6616767B2 (en) * 1997-02-12 2003-09-09 Applied Materials, Inc. High temperature ceramic heater assembly with RF capability
AUPO794797A0 (en) * 1997-07-15 1997-08-07 Silverbrook Research Pty Ltd A device (MEMS07)
JPH11104950A (ja) 1997-10-03 1999-04-20 Shin Etsu Chem Co Ltd 電極板及びその製造方法
US6079356A (en) * 1997-12-02 2000-06-27 Applied Materials, Inc. Reactor optimized for chemical vapor deposition of titanium
US6050506A (en) * 1998-02-13 2000-04-18 Applied Materials, Inc. Pattern of apertures in a showerhead for chemical vapor deposition
US6086677A (en) * 1998-06-16 2000-07-11 Applied Materials, Inc. Dual gas faceplate for a showerhead in a semiconductor wafer processing system
KR100378409B1 (ko) * 1998-09-03 2003-03-29 닛폰산소 가부시키가이샤 반도체 프로세스가스의 대량 공급장치
RU2151066C1 (ru) * 1998-11-03 2000-06-20 Самсунг Электроникс Ко., Лтд. Узел пластины сопла микроинжектора и способ его изготовления
US6214192B1 (en) * 1998-12-10 2001-04-10 Eastman Kodak Company Fabricating ink jet nozzle plate
US6399499B1 (en) * 1999-09-14 2002-06-04 Jeong Gey Lee Method for fabricating an electrode of a plasma chamber
US6585759B1 (en) * 1999-12-16 2003-07-01 Israel Aircraft Industries Ltd. Method and apparatus for manufacturing medical support devices
US6477980B1 (en) * 2000-01-20 2002-11-12 Applied Materials, Inc. Flexibly suspended gas distribution manifold for plasma chamber
US6772827B2 (en) * 2000-01-20 2004-08-10 Applied Materials, Inc. Suspended gas distribution manifold for plasma chamber
US6415860B1 (en) * 2000-02-09 2002-07-09 Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College Crossflow micro heat exchanger
US6892802B2 (en) * 2000-02-09 2005-05-17 Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College Crossflow micro heat exchanger
KR20020000813A (ko) * 2000-03-22 2002-01-05 마치오 나카지마 구멍 구조체 및 구멍 구조체의 제조 방법
AU2001247685A1 (en) * 2000-03-30 2001-10-15 Tokyo Electron Limited Method of and apparatus for tunable gas injection in a plasma processing system
US20020086529A1 (en) * 2001-01-03 2002-07-04 Mcfeely Fenton Read Actively cooled dispenser system for improved resistivity and phase control in metal CVD from organometallic precursors
US20020112954A1 (en) * 2001-02-16 2002-08-22 Associated Plating Co. Plating rack for plating procedures and processes for making and using same
US20020162741A1 (en) * 2001-05-01 2002-11-07 Applied Materials, Inc. Multi-material target backing plate
CA2448736C (en) * 2001-06-05 2010-08-10 Mikro Systems, Inc. Methods for manufacturing three-dimensional devices and devices created thereby
EP1295647A1 (en) * 2001-09-24 2003-03-26 The Technology Partnership Public Limited Company Nozzles in perforate membranes and their manufacture
US7780789B2 (en) * 2001-10-26 2010-08-24 Applied Materials, Inc. Vortex chamber lids for atomic layer deposition
US20030124842A1 (en) * 2001-12-27 2003-07-03 Applied Materials, Inc. Dual-gas delivery system for chemical vapor deposition processes
US6827815B2 (en) * 2002-01-15 2004-12-07 Applied Materials, Inc. Showerhead assembly for a processing chamber
US6659331B2 (en) * 2002-02-26 2003-12-09 Applied Materials, Inc Plasma-resistant, welded aluminum structures for use in semiconductor apparatus
DE10317872A1 (de) * 2002-04-18 2004-01-08 Hitachi Printing Solutions, Ltd., Ebina Tintenstrahlkopf und Verfahren zu seiner Herstellung
US6988534B2 (en) * 2002-11-01 2006-01-24 Cooligy, Inc. Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
US20040051211A1 (en) * 2002-09-12 2004-03-18 Xerox Corporation Production of seamless belts and seamless belt products
JP4260450B2 (ja) * 2002-09-20 2009-04-30 東京エレクトロン株式会社 真空処理装置における静電チャックの製造方法
US7000684B2 (en) * 2002-11-01 2006-02-21 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US6986382B2 (en) * 2002-11-01 2006-01-17 Cooligy Inc. Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
NL1023005C2 (nl) * 2002-11-12 2004-05-13 Stork Prints Bv Zeefmateriaal, werkwijze voor de vervaardiging en toepassingen daarvan.
US20040125563A1 (en) * 2002-12-31 2004-07-01 Vrtis Joan K. Coating for a heat dissipation device and a method of fabrication
US7270713B2 (en) * 2003-01-07 2007-09-18 Applied Materials, Inc. Tunable gas distribution plate assembly
US6942753B2 (en) * 2003-04-16 2005-09-13 Applied Materials, Inc. Gas distribution plate assembly for large area plasma enhanced chemical vapor deposition
US6921437B1 (en) * 2003-05-30 2005-07-26 Aviza Technology, Inc. Gas distribution system
WO2005004256A2 (en) * 2003-06-27 2005-01-13 Ultracell Corporation Annular fuel processor and methods
WO2005004258A2 (en) * 2003-06-27 2005-01-13 Ultracell Corporation Portable fuel cartridge for fuel cells
US20070123051A1 (en) * 2004-02-26 2007-05-31 Reza Arghavani Oxide etch with nh4-nf3 chemistry
US7785672B2 (en) * 2004-04-20 2010-08-31 Applied Materials, Inc. Method of controlling the film properties of PECVD-deposited thin films
US8074599B2 (en) * 2004-05-12 2011-12-13 Applied Materials, Inc. Plasma uniformity control by gas diffuser curvature
KR100912413B1 (ko) * 2004-07-15 2009-08-14 가부시키가이샤 리코 액체토출헤드, 액체토출헤드의 노즐부재, 카트리지 및 액체토출 기록장치
NL1026752C2 (nl) * 2004-07-30 2006-02-02 Stork Veco Bv Vernevelplaat voor het vernevelen van een fluïdum, werkwijze voor het vervaardigen van een vernevelplaat en toepassing van een vernevelplaat.
JP5519105B2 (ja) * 2004-08-02 2014-06-11 ビーコ・インストゥルメンツ・インコーポレイテッド 化学気相成長の方法及び化学気相成長リアクタ用のガス供給システム
US7507670B2 (en) * 2004-12-23 2009-03-24 Lam Research Corporation Silicon electrode assembly surface decontamination by acidic solution
CN101176187A (zh) * 2005-04-18 2008-05-07 东京毅力科创株式会社 喷淋板及其制造方法
WO2007016013A2 (en) * 2005-07-27 2007-02-08 Applied Materials, Inc. Unique passivation technique for a cvd blocker plate to prevent particle formation
US7554052B2 (en) * 2005-07-29 2009-06-30 Applied Materials, Inc. Method and apparatus for the application of twin wire arc spray coatings
TWI298899B (en) * 2005-09-09 2008-07-11 Chipmos Technologies Inc Nozzle plate and manufacturing processe thereof
US8679252B2 (en) * 2005-09-23 2014-03-25 Lam Research Corporation Actively heated aluminum baffle component having improved particle performance and methods of use and manufacture thereof
US7743730B2 (en) * 2005-12-21 2010-06-29 Lam Research Corporation Apparatus for an optimized plasma chamber grounded electrode assembly
US20080226838A1 (en) * 2007-03-12 2008-09-18 Kochi Industrial Promotion Center Plasma CVD apparatus and film deposition method
US7578889B2 (en) * 2007-03-30 2009-08-25 Lam Research Corporation Methodology for cleaning of surface metal contamination from electrode assemblies
US20080296354A1 (en) * 2007-05-31 2008-12-04 Mark Crockett Stainless steel or stainless steel alloy for diffusion bonding
US7798388B2 (en) * 2007-05-31 2010-09-21 Applied Materials, Inc. Method of diffusion bonding a fluid flow apparatus
JP4355023B2 (ja) * 2007-06-01 2009-10-28 三井造船株式会社 プラズマ処理装置用電極の製造方法および再生方法
US7862682B2 (en) * 2007-06-13 2011-01-04 Lam Research Corporation Showerhead electrode assemblies for plasma processing apparatuses
WO2009042137A2 (en) * 2007-09-25 2009-04-02 Lam Research Corporation Temperature control modules for showerhead electrode assemblies for plasma processing apparatuses
US20090095221A1 (en) * 2007-10-16 2009-04-16 Alexander Tam Multi-gas concentric injection showerhead
US20090095222A1 (en) * 2007-10-16 2009-04-16 Alexander Tam Multi-gas spiral channel showerhead
US7976631B2 (en) * 2007-10-16 2011-07-12 Applied Materials, Inc. Multi-gas straight channel showerhead
JP5417338B2 (ja) * 2007-10-31 2014-02-12 ラム リサーチ コーポレーション 冷却液と構成部品本体との間の熱伝導性を制御するためにガス圧を使用する温度制御モジュール及び温度制御方法
WO2009126339A2 (en) * 2008-01-14 2009-10-15 Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College Metal-based microchannel heat exchangers made by molding replication and assembly
US8679288B2 (en) * 2008-06-09 2014-03-25 Lam Research Corporation Showerhead electrode assemblies for plasma processing apparatuses
EP2290124A1 (en) * 2008-06-27 2011-03-02 Mitsubishi Heavy Industries, Ltd. Vacuum processing apparatus and method for operating vacuum processing apparatus
US20100099263A1 (en) * 2008-10-20 2010-04-22 Applied Materials, Inc. Nf3/h2 remote plasma process with high etch selectivity of psg/bpsg over thermal oxide and low density surface defects
US20100096569A1 (en) * 2008-10-21 2010-04-22 Applied Materials, Inc. Ultraviolet-transmitting microwave reflector comprising a micromesh screen
US20100180426A1 (en) 2009-01-21 2010-07-22 Applied Materials, Inc. Particle reduction treatment for gas delivery system
CN102301460A (zh) * 2009-01-29 2011-12-28 东京毅力科创株式会社 成膜装置和气体排出部件
CN102414801A (zh) * 2009-08-27 2012-04-11 应用材料公司 在原位腔室清洁后的处理腔室去污方法
KR101038088B1 (ko) * 2009-09-10 2011-06-01 주식회사 몰텍스 파이버를 이용한 패턴 형성용 다공성 전주 쉘의 제조방법 및 그 다공성 전주 쉘
US20110065276A1 (en) * 2009-09-11 2011-03-17 Applied Materials, Inc. Apparatus and Methods for Cyclical Oxidation and Etching
WO2011096432A1 (ja) * 2010-02-04 2011-08-11 日本精機宝石工業株式会社 放熱性材料
JP5198611B2 (ja) * 2010-08-12 2013-05-15 株式会社東芝 ガス供給部材、プラズマ処理装置およびイットリア含有膜の形成方法
US20120052216A1 (en) * 2010-08-27 2012-03-01 Applied Materials, Inc. Gas distribution showerhead with high emissivity surface
TWI534291B (zh) * 2011-03-18 2016-05-21 應用材料股份有限公司 噴淋頭組件
WO2012147009A1 (en) * 2011-04-27 2012-11-01 Koninklijke Philips Electronics N.V. Nozzle plate fabrication
JP2013026413A (ja) 2011-07-20 2013-02-04 Hokuriku Seikei Kogyo Kk Ａｌ合金系シャワープレート及びその製造方法
TW201331408A (zh) * 2011-10-07 2013-08-01 Tokyo Electron Ltd 電漿處理裝置
US8813824B2 (en) * 2011-12-06 2014-08-26 Mikro Systems, Inc. Systems, devices, and/or methods for producing holes
CN103388132B (zh) 2012-05-11 2015-11-25 中微半导体设备(上海)有限公司 气体喷淋头、其制造方法及薄膜生长反应器
US9018022B2 (en) * 2012-09-24 2015-04-28 Lam Research Corporation Showerhead electrode assembly in a capacitively coupled plasma processing apparatus
US9314854B2 (en) * 2013-01-30 2016-04-19 Lam Research Corporation Ductile mode drilling methods for brittle components of plasma processing apparatuses
US20140235069A1 (en) 2013-02-15 2014-08-21 Novellus Systems, Inc. Multi-plenum showerhead with temperature control
US9583369B2 (en) * 2013-07-20 2017-02-28 Applied Materials, Inc. Ion assisted deposition for rare-earth oxide based coatings on lids and nozzles
GB201314054D0 (en) * 2013-08-06 2013-09-18 Saudi Internat Petrochemical Company Method
US9663870B2 (en) * 2013-11-13 2017-05-30 Applied Materials, Inc. High purity metallic top coat for semiconductor manufacturing components
US9975320B2 (en) * 2014-01-13 2018-05-22 Applied Materials, Inc. Diffusion bonded plasma resisted chemical vapor deposition (CVD) chamber heater
US9484190B2 (en) 2014-01-25 2016-11-01 Yuri Glukhoy Showerhead-cooler system of a semiconductor-processing chamber for semiconductor wafers of large area
TW201737297A (zh) 2014-12-26 2017-10-16 Ａ Ｓａｔ股份有限公司 用於電漿蝕刻裝置的電極
JP6398827B2 (ja) 2015-03-24 2018-10-03 三菱マテリアル株式会社 プラズマ処理装置用電極板の製造方法
TWI677929B (zh) * 2015-05-01 2019-11-21 美商應用材料股份有限公司 用於形成膜堆疊的雙通道噴頭
US20180138408A1 (en) * 2015-08-05 2018-05-17 Applied Materials, Inc. A shadow mask for organic light emitting diode manufacture
US10920318B2 (en) * 2015-10-30 2021-02-16 Kyocera Corporation Shower plate, semiconductor manufacturing apparatus, and method for manufacturing shower plate
US20190036026A1 (en) * 2016-02-03 2019-01-31 Applied Materials, Inc. A shadow mask with tapered openings formed by double electroforming using positive/negative photoresists
US10266947B2 (en) * 2016-08-23 2019-04-23 Lam Research Corporation Rotary friction welded blank for PECVD heated showerhead
US10366904B2 (en) * 2016-09-08 2019-07-30 Corning Incorporated Articles having holes with morphology attributes and methods for fabricating the same
US10591451B2 (en) * 2017-06-01 2020-03-17 Phoenix S&T, Inc. Devices and methods for liquid sample injection for mass spectrometry with improved utilities
US10297458B2 (en) * 2017-08-07 2019-05-21 Applied Materials, Inc. Process window widening using coated parts in plasma etch processes
US20190323127A1 (en) * 2018-04-19 2019-10-24 Applied Materials, Inc. Texturing and plating nickel on aluminum process chamber components

Similar Documents

Publication Publication Date Title
JP2020522895A5 (https=)
US20160204005A1 (en) Support assembly for substrate backside discoloration control
PH12018501544A1 (en) Heat dissipation apparatus and methods for uv-led photoreactors
KR20080089293A (ko) 플라즈마 처리 장치
CN103121062A (zh) 模具及分区段调整模具冷却效率的方法
CN102437002B (zh) 一种用于进气结构的匀气盘
KR102244964B1 (ko) 열 결합된 석영 돔 히트 싱크
CN109599327A (zh) 为使沉积留存增加而用于表面纹理化的几何形状和图案
TW201600436A (zh) 非接觸之用於抓取基板之裝置
JP2016111062A (ja) インプリント装置及び物品の製造方法
CN204702802U (zh) 一种不损伤镜片表面的组合式镀膜夹具
JP7219233B2 (ja) 半導体処理チャンバ内でのガス供給のための装置および方法
CN104928651A (zh) 一种温流室出气的可控温加热盘
JP2008506273A5 (ja) ガス分配プレートアセンブリのための方法及び装置、並びに、ガス分配プレートアセンブリのための方法及び装置を用いて薄膜を成膜するためのプロセスチャンバ及び方法
CN109817562B (zh) 基板载置台
TW200735260A (en) Wafer holder, and wafer prober and semiconductor manufacturing apparatus provided therewith
JP6398827B2 (ja) プラズマ処理装置用電極板の製造方法
TW201312258A (zh) 遮罩及用於製造包含其之光學膜之裝置
TW201900289A (zh) 噴頭加工工具及噴頭加工工具之製造方法
CN203878230U (zh) 螺丝的全镀膜装置
TWI548471B (zh) 型鋼連續鑄造之注嘴
KR20160020079A (ko) 도료 코팅을 위한 진동 장치 및 도료 코팅 방법
KR101953456B1 (ko) 금속 판재의 주조 금형
CN206918138U (zh) 一种汽车刹车片散热装置
JP2002346728A (ja) 鋳造方法および鋳造装置