JP2020521275A5 - - Google Patents

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Publication number
JP2020521275A5
JP2020521275A5 JP2019560260A JP2019560260A JP2020521275A5 JP 2020521275 A5 JP2020521275 A5 JP 2020521275A5 JP 2019560260 A JP2019560260 A JP 2019560260A JP 2019560260 A JP2019560260 A JP 2019560260A JP 2020521275 A5 JP2020521275 A5 JP 2020521275A5
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JP
Japan
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controller
system memory
cpus
execute
implement
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JP2019560260A
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English (en)
Japanese (ja)
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JP2020521275A (ja
JP7289267B2 (ja
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Priority claimed from US15/966,211 external-priority patent/US20180323091A1/en
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JP2019560260A 2017-05-03 2018-05-03 半導体処理中のマイクロ波空洞における均一の熱分布のための方法および装置 Active JP7289267B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762500609P 2017-05-03 2017-05-03
US62/500,609 2017-05-03
US15/966,211 US20180323091A1 (en) 2017-05-03 2018-04-30 Method and apparatus for uniform thermal distribution in a microwave cavity during semiconductor processing
US15/966,211 2018-04-30
PCT/US2018/030787 WO2018204576A1 (en) 2017-05-03 2018-05-03 Method and apparatus for uniform thermal distribution in a microwave cavity during semiconductor processing

Publications (3)

Publication Number Publication Date
JP2020521275A JP2020521275A (ja) 2020-07-16
JP2020521275A5 true JP2020521275A5 (enExample) 2021-05-27
JP7289267B2 JP7289267B2 (ja) 2023-06-09

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ID=64014216

Family Applications (1)

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JP2019560260A Active JP7289267B2 (ja) 2017-05-03 2018-05-03 半導体処理中のマイクロ波空洞における均一の熱分布のための方法および装置

Country Status (6)

Country Link
US (1) US20180323091A1 (enExample)
JP (1) JP7289267B2 (enExample)
KR (1) KR102540168B1 (enExample)
CN (1) CN110663108B (enExample)
TW (1) TWI773753B (enExample)
WO (1) WO2018204576A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112235003B (zh) * 2020-10-13 2022-01-14 大连海事大学 一种用于改变场分布的双路宽带信号装置
TWI834016B (zh) 2020-12-16 2024-03-01 財團法人工業技術研究院 頻率可重組相位陣列系統及其執行的材料處理方法
TWI820537B (zh) * 2021-04-26 2023-11-01 財團法人工業技術研究院 微波加熱方法與微波加熱裝置
TWI786015B (zh) * 2022-04-22 2022-12-01 宏碩系統股份有限公司 單源微波加熱裝置
DE102022127931A1 (de) * 2022-10-21 2024-05-02 TRUMPF Hüttinger GmbH + Co. KG Werkstückbehandlungsvorrichtung zur Behandlung eines Werkstücks mit einer Mikrowelle und Verfahren zur Behandlung des Werkstücks mit der Mikrowelle
JP2024099858A (ja) * 2023-01-13 2024-07-26 株式会社Kokusai Electric 基板処理装置、基板処理方法、半導体装置の製造方法およびプログラム
US20250027202A1 (en) * 2023-07-21 2025-01-23 Applied Materials, Inc. Methods of adjusting uniformity, and related apparatus and systems, for semiconductor manufacturing

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1053760A (en) * 1976-12-30 1979-05-01 Thomas E. Hester Power controller for microwave magnetron
JPS5830687B2 (ja) * 1977-03-16 1983-06-30 松下電器産業株式会社 調理器
JP3957135B2 (ja) * 2000-10-13 2007-08-15 東京エレクトロン株式会社 プラズマ処理装置
JP3839395B2 (ja) * 2002-11-22 2006-11-01 株式会社エーイーティー マイクロ波プラズマ発生装置
JP5064924B2 (ja) * 2006-08-08 2012-10-31 パナソニック株式会社 マイクロ波処理装置
JP2008060016A (ja) 2006-09-04 2008-03-13 Matsushita Electric Ind Co Ltd マイクロ波利用装置
JP5167678B2 (ja) * 2007-04-16 2013-03-21 パナソニック株式会社 マイクロ波処理装置
JP2010073383A (ja) 2008-09-17 2010-04-02 Panasonic Corp マイクロ波加熱装置
WO2011114711A1 (ja) 2010-03-19 2011-09-22 パナソニック株式会社 マイクロ波加熱装置
KR101224520B1 (ko) * 2012-06-27 2013-01-22 (주)이노시티 프로세스 챔버
US10470255B2 (en) * 2012-07-02 2019-11-05 Goji Limited RF energy application based on electromagnetic feedback
CN103533690A (zh) * 2012-07-05 2014-01-22 Nxp股份有限公司 自动调整工作频率的微波功率源和方法
JP2014032744A (ja) * 2012-08-01 2014-02-20 Panasonic Corp マイクロ波加熱装置
US20140042152A1 (en) 2012-08-08 2014-02-13 Taiwan Semiconductor Manufacturing Company, Ltd. Variable frequency microwave device and method for rectifying wafer warpage
WO2015180416A1 (zh) * 2014-05-28 2015-12-03 广东美的厨房电器制造有限公司 半导体微波炉及其半导体微波源
CN105120549B (zh) * 2015-09-02 2018-05-01 广东美的厨房电器制造有限公司 微波加热系统及其半导体功率源和加热控制方法

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