JP2020519011A5 - - Google Patents

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JP2020519011A5
JP2020519011A5 JP2019558402A JP2019558402A JP2020519011A5 JP 2020519011 A5 JP2020519011 A5 JP 2020519011A5 JP 2019558402 A JP2019558402 A JP 2019558402A JP 2019558402 A JP2019558402 A JP 2019558402A JP 2020519011 A5 JP2020519011 A5 JP 2020519011A5
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Japan
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electro
optical device
silicon
stack
layer
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JP2019558402A
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Japanese (ja)
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JP2020519011A (ja
JP7076470B2 (ja
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Priority claimed from US15/587,754 external-priority patent/US10283931B2/en
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JP2019558402A 2017-05-05 2018-05-02 Ｉｉｉ－ｖ族利得材料および集積化ヒート・シンクを有する電子－光学装置ならびにその製造方法 Active JP7076470B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US15/587,754 2017-05-05
US15/587,754 US10283931B2 (en) 2017-05-05 2017-05-05 Electro-optical device with III-V gain materials and integrated heat sink
US15/804,716 2017-11-06
US15/804,716 US10256603B2 (en) 2017-05-05 2017-11-06 Electro-optical device with III-V gain materials and integrated heat sink
PCT/IB2018/053033 WO2018203246A1 (en) 2017-05-05 2018-05-02 Electro-optical device with iii- v gain materials and integrated heat sink

Publications (3)

Publication Number Publication Date
JP2020519011A JP2020519011A (ja) 2020-06-25
JP2020519011A5 true JP2020519011A5 (https=) 2020-08-06
JP7076470B2 JP7076470B2 (ja) 2022-05-27

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JP2019558402A Active JP7076470B2 (ja) 2017-05-05 2018-05-02 Ｉｉｉ－ｖ族利得材料および集積化ヒート・シンクを有する電子－光学装置ならびにその製造方法

Country Status (6)

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US (2) US10283931B2 (https=)
JP (1) JP7076470B2 (https=)
CN (1) CN110574176A (https=)
DE (1) DE112018000883B4 (https=)
GB (1) GB2576844B (https=)
WO (1) WO2018203246A1 (https=)

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FR3109020B1 (fr) * 2020-04-06 2022-02-25 Scintil Photonics Dispositif photonique pour etablir un rayonnement lumineux comprenant un mode optique dans un guide d'onde
FR3115412B1 (fr) * 2020-10-16 2023-01-06 Scintil Photonics Dispositif photonique avec dissipation thermique amelioree pour laser heterogene iii-v/si et procede de fabrication associe
WO2022113153A1 (ja) * 2020-11-24 2022-06-02 日本電信電話株式会社 半導体光素子
CN112769031B (zh) * 2020-12-31 2023-05-16 联合微电子中心有限责任公司 一种背向集成有源器件及其制备方法
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CN113113838B (zh) * 2021-03-22 2022-12-23 武汉华工正源光子技术有限公司 集成激光器件及其制备方法
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EP4102272B1 (en) 2021-06-08 2025-02-19 IHP GmbH - Innovations for High Performance Microelectronics / Leibniz-Institut für innovative Mikroelektronik Integrated optoelectronic device with optical interconnect structure for improved beol device integration
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US11822120B2 (en) * 2022-02-24 2023-11-21 Globalfoundries U.S. Inc. Optical components with enhanced heat dissipation
US20230275399A1 (en) * 2022-02-28 2023-08-31 Sumitomo Electric Industries, Ltd. Semiconductor optical device and method of manufacturing the same
FR3136317B1 (fr) 2022-06-01 2025-07-11 Commissariat Energie Atomique Procédé de fabrication d’une puce photonique
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US20230019747A1 (en) * 2022-09-23 2023-01-19 Richard Jones Hybrid laser architecture with asymmetric metal shunt
JPWO2025013241A1 (https=) * 2023-07-12 2025-01-16
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