JP7076470B2 - Iii-v族利得材料および集積化ヒート・シンクを有する電子-光学装置ならびにその製造方法 - Google Patents
Iii-v族利得材料および集積化ヒート・シンクを有する電子-光学装置ならびにその製造方法 Download PDFInfo
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- JP7076470B2 JP7076470B2 JP2019558402A JP2019558402A JP7076470B2 JP 7076470 B2 JP7076470 B2 JP 7076470B2 JP 2019558402 A JP2019558402 A JP 2019558402A JP 2019558402 A JP2019558402 A JP 2019558402A JP 7076470 B2 JP7076470 B2 JP 7076470B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
- H01S3/2375—Hybrid lasers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
- H01S5/021—Silicon based substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02461—Structure or details of the laser chip to manipulate the heat flow, e.g. passive layers in the chip with a low heat conductivity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
- H01S5/02484—Sapphire or diamond heat spreaders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0421—Electrical excitation ; Circuits therefor characterised by the semiconducting contacting layers
- H01S5/0422—Electrical excitation ; Circuits therefor characterised by the semiconducting contacting layers with n- and p-contacts on the same side of the active layer
- H01S5/0424—Electrical excitation ; Circuits therefor characterised by the semiconducting contacting layers with n- and p-contacts on the same side of the active layer lateral current injection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
- H01S5/125—Distributed Bragg reflector [DBR] lasers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/50—Amplifier structures not provided for in groups H01S5/02 - H01S5/30
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2304/00—Special growth methods for semiconductor lasers
- H01S2304/04—MOCVD or MOVPE
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04256—Electrodes, e.g. characterised by the structure characterised by the configuration
- H01S5/04257—Electrodes, e.g. characterised by the structure characterised by the configuration having positive and negative electrodes on the same side of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1028—Coupling to elements in the cavity, e.g. coupling to waveguides adjacent the active region, e.g. forward coupled [DFC] structures
- H01S5/1032—Coupling to elements comprising an optical axis that is not aligned with the optical axis of the active region
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/587,754 | 2017-05-05 | ||
| US15/587,754 US10283931B2 (en) | 2017-05-05 | 2017-05-05 | Electro-optical device with III-V gain materials and integrated heat sink |
| US15/804,716 | 2017-11-06 | ||
| US15/804,716 US10256603B2 (en) | 2017-05-05 | 2017-11-06 | Electro-optical device with III-V gain materials and integrated heat sink |
| PCT/IB2018/053033 WO2018203246A1 (en) | 2017-05-05 | 2018-05-02 | Electro-optical device with iii- v gain materials and integrated heat sink |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020519011A JP2020519011A (ja) | 2020-06-25 |
| JP2020519011A5 JP2020519011A5 (https=) | 2020-08-06 |
| JP7076470B2 true JP7076470B2 (ja) | 2022-05-27 |
Family
ID=64015449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019558402A Active JP7076470B2 (ja) | 2017-05-05 | 2018-05-02 | Iii-v族利得材料および集積化ヒート・シンクを有する電子-光学装置ならびにその製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US10283931B2 (https=) |
| JP (1) | JP7076470B2 (https=) |
| CN (1) | CN110574176A (https=) |
| DE (1) | DE112018000883B4 (https=) |
| GB (1) | GB2576844B (https=) |
| WO (1) | WO2018203246A1 (https=) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9515002B2 (en) * | 2015-02-09 | 2016-12-06 | Micron Technology, Inc. | Bonding pads with thermal pathways |
| JP6869830B2 (ja) * | 2017-06-29 | 2021-05-12 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| US10594111B2 (en) | 2017-08-31 | 2020-03-17 | International Business Machines Corporation | Lateral current injection electro-optical device with well-separated doped III-V layers structured as photonic crystals |
| DE102018214574A1 (de) * | 2018-08-29 | 2020-03-05 | Robert Bosch Gmbh | Integriert-optische Vorrichtung |
| US11081856B2 (en) * | 2018-12-27 | 2021-08-03 | Cisco Technology, Inc. | III-V laser platforms on silicon with through silicon vias by wafer scale bonding |
| JP7139952B2 (ja) * | 2019-01-08 | 2022-09-21 | 日本電信電話株式会社 | 半導体光素子 |
| CN113491007A (zh) * | 2019-03-11 | 2021-10-08 | Hrl实验室有限责任公司 | 在金属嵌入式芯片组件(meca)处理期间保护晶粒的方法 |
| US10985084B2 (en) * | 2019-07-03 | 2021-04-20 | Globalfoundries U.S. Inc. | Integrated III-V device and driver device packages with improved heat removal and methods for fabricating the same |
| US20230139692A1 (en) * | 2020-03-30 | 2023-05-04 | Nippon Telegraph And Telephone Corporation | Semiconductor Optical Device |
| FR3109020B1 (fr) * | 2020-04-06 | 2022-02-25 | Scintil Photonics | Dispositif photonique pour etablir un rayonnement lumineux comprenant un mode optique dans un guide d'onde |
| FR3115412B1 (fr) * | 2020-10-16 | 2023-01-06 | Scintil Photonics | Dispositif photonique avec dissipation thermique amelioree pour laser heterogene iii-v/si et procede de fabrication associe |
| WO2022113153A1 (ja) * | 2020-11-24 | 2022-06-02 | 日本電信電話株式会社 | 半導体光素子 |
| CN112769031B (zh) * | 2020-12-31 | 2023-05-16 | 联合微电子中心有限责任公司 | 一种背向集成有源器件及其制备方法 |
| US20240055829A1 (en) * | 2021-01-18 | 2024-02-15 | Nippon Telegraph And Telephone Corporation | Semiconductor Laser and Design Method Therefor |
| CN115036785B (zh) * | 2021-03-05 | 2025-02-25 | 联合微电子中心有限责任公司 | 基于背向集成的空气绝热层的制备方法及半导体器件 |
| CN113113838B (zh) * | 2021-03-22 | 2022-12-23 | 武汉华工正源光子技术有限公司 | 集成激光器件及其制备方法 |
| TWI763420B (zh) * | 2021-04-09 | 2022-05-01 | 友達光電股份有限公司 | 顯示面板 |
| EP4102272B1 (en) | 2021-06-08 | 2025-02-19 | IHP GmbH - Innovations for High Performance Microelectronics / Leibniz-Institut für innovative Mikroelektronik | Integrated optoelectronic device with optical interconnect structure for improved beol device integration |
| KR102824593B1 (ko) | 2021-10-06 | 2025-06-24 | 삼성전자주식회사 | 광 변조 소자 및 이를 포함한 장치 |
| US11934021B2 (en) * | 2022-01-27 | 2024-03-19 | Globalfoundries U.S. Inc. | Photonic devices integrated with thermally conductive layers |
| US11846804B2 (en) * | 2022-02-24 | 2023-12-19 | Globalfoundries U.S. Inc. | Thermally-conductive features positioned adjacent to an optical component |
| US11822120B2 (en) * | 2022-02-24 | 2023-11-21 | Globalfoundries U.S. Inc. | Optical components with enhanced heat dissipation |
| US20230275399A1 (en) * | 2022-02-28 | 2023-08-31 | Sumitomo Electric Industries, Ltd. | Semiconductor optical device and method of manufacturing the same |
| FR3136317B1 (fr) | 2022-06-01 | 2025-07-11 | Commissariat Energie Atomique | Procédé de fabrication d’une puce photonique |
| CN114864753B (zh) * | 2022-07-05 | 2022-11-04 | 杭州视光半导体科技有限公司 | 一种三层堆叠结构晶圆的制备方法及应用 |
| US20230019747A1 (en) * | 2022-09-23 | 2023-01-19 | Richard Jones | Hybrid laser architecture with asymmetric metal shunt |
| JPWO2025013241A1 (https=) * | 2023-07-12 | 2025-01-16 | ||
| DE102024130762A1 (de) * | 2024-10-22 | 2026-04-23 | Aixtron Se | Verfahren zur Herstellung einer mit einer Wärmeableitschicht verbundenen CMOS-Struktur |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007173402A (ja) | 2005-12-20 | 2007-07-05 | Matsushita Electric Ind Co Ltd | 半導体レーザ装置 |
| US20090168821A1 (en) | 2007-12-31 | 2009-07-02 | Alexander Fang | Thermal shunt for active devices on silicon-on-insulator wafers |
| JP2013222844A (ja) | 2012-04-17 | 2013-10-28 | Nippon Telegr & Teleph Corp <Ntt> | 光半導体素子 |
| JP2016533027A (ja) | 2013-10-09 | 2016-10-20 | スコーピオズ テクノロジーズ インコーポレイテッド | シリコンフォトニックデバイスへの未処理直接バンドギャップチップの組込み |
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| US11181688B2 (en) * | 2009-10-13 | 2021-11-23 | Skorpios Technologies, Inc. | Integration of an unprocessed, direct-bandgap chip into a silicon photonic device |
| US9316785B2 (en) | 2013-10-09 | 2016-04-19 | Skorpios Technologies, Inc. | Integration of an unprocessed, direct-bandgap chip into a silicon photonic device |
| EP2539979B1 (en) | 2010-02-24 | 2018-05-23 | Universiteit Gent | Laser light coupling into SOI CMOS photonic integrated circuit |
| US8290014B2 (en) | 2010-03-11 | 2012-10-16 | Junesand Carl | Active photonic device |
| FR2967831B1 (fr) | 2010-11-18 | 2013-07-19 | Commissariat Energie Atomique | Laser heterogene a efficacite elevee et procede de fabrication du laser |
| US9442247B2 (en) | 2011-11-02 | 2016-09-13 | University Of Central Florida Research Foundation, Inc. | Branched shape optical isolator and optical apparatus, method and applications |
| US9360620B2 (en) * | 2012-08-29 | 2016-06-07 | Aurrion, Inc. | Thermal management for photonic integrated circuits |
| CN102904159B (zh) | 2012-10-26 | 2015-03-18 | 江苏尚飞光电科技有限公司 | 一种基于bcb键合工艺的混合集成激光器及其制作方法 |
| US20170214214A1 (en) * | 2013-04-25 | 2017-07-27 | The Board Of Regents Of The University Of Oklahoma | Hybrid semiconductor laser absent a top semiconductor cladding layer |
| EP2866316A1 (en) | 2013-10-23 | 2015-04-29 | Alcatel Lucent | Thermal management of a ridge-type hybrid laser, device, and method |
| JP6021118B2 (ja) * | 2014-03-27 | 2016-11-02 | インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation | 光デバイスおよびその製造方法 |
| KR102171268B1 (ko) * | 2014-09-30 | 2020-11-06 | 삼성전자 주식회사 | 하이브리드 실리콘 레이저 제조 방법 |
| US9397471B2 (en) | 2014-11-14 | 2016-07-19 | Intel Corporation | Heat removal from photonic devices |
| WO2016145310A1 (en) | 2015-03-12 | 2016-09-15 | Samtec, Inc. | Optical module including silicon photonics chip and coupler chip |
| US9583607B2 (en) | 2015-07-17 | 2017-02-28 | Mitsubishi Electric Research Laboratories, Inc. | Semiconductor device with multiple-functional barrier layer |
-
2017
- 2017-05-05 US US15/587,754 patent/US10283931B2/en active Active
- 2017-11-06 US US15/804,716 patent/US10256603B2/en active Active
-
2018
- 2018-05-02 DE DE112018000883.5T patent/DE112018000883B4/de active Active
- 2018-05-02 GB GB1916874.9A patent/GB2576844B/en active Active
- 2018-05-02 CN CN201880028675.3A patent/CN110574176A/zh active Pending
- 2018-05-02 WO PCT/IB2018/053033 patent/WO2018203246A1/en not_active Ceased
- 2018-05-02 JP JP2019558402A patent/JP7076470B2/ja active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007173402A (ja) | 2005-12-20 | 2007-07-05 | Matsushita Electric Ind Co Ltd | 半導体レーザ装置 |
| US20090168821A1 (en) | 2007-12-31 | 2009-07-02 | Alexander Fang | Thermal shunt for active devices on silicon-on-insulator wafers |
| JP2013222844A (ja) | 2012-04-17 | 2013-10-28 | Nippon Telegr & Teleph Corp <Ntt> | 光半導体素子 |
| JP2016533027A (ja) | 2013-10-09 | 2016-10-20 | スコーピオズ テクノロジーズ インコーポレイテッド | シリコンフォトニックデバイスへの未処理直接バンドギャップチップの組込み |
Also Published As
| Publication number | Publication date |
|---|---|
| US20180323575A1 (en) | 2018-11-08 |
| US10256603B2 (en) | 2019-04-09 |
| JP2020519011A (ja) | 2020-06-25 |
| DE112018000883T5 (de) | 2019-10-31 |
| GB2576844B (en) | 2022-03-16 |
| DE112018000883B4 (de) | 2022-01-05 |
| GB201916874D0 (en) | 2020-01-01 |
| US10283931B2 (en) | 2019-05-07 |
| WO2018203246A1 (en) | 2018-11-08 |
| CN110574176A (zh) | 2019-12-13 |
| GB2576844A (en) | 2020-03-04 |
| US20180323574A1 (en) | 2018-11-08 |
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