JP2020504304A5 - - Google Patents
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- JP2020504304A5 JP2020504304A5 JP2019536595A JP2019536595A JP2020504304A5 JP 2020504304 A5 JP2020504304 A5 JP 2020504304A5 JP 2019536595 A JP2019536595 A JP 2019536595A JP 2019536595 A JP2019536595 A JP 2019536595A JP 2020504304 A5 JP2020504304 A5 JP 2020504304A5
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- JP
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- Prior art keywords
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- illumination
- detector
- illumination beam
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005286 illumination Methods 0.000 claims 69
- 230000007547 defect Effects 0.000 claims 46
- 230000005855 radiation Effects 0.000 claims 39
- 238000007654 immersion Methods 0.000 claims 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 4
- 230000001427 coherent effect Effects 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 238000001514 detection method Methods 0.000 claims 3
- 230000003287 optical effect Effects 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- 238000010521 absorption reaction Methods 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 230000000712 assembly Effects 0.000 claims 2
- 238000000429 assembly Methods 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 239000003989 dielectric material Substances 0.000 claims 2
- 229910052732 germanium Inorganic materials 0.000 claims 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910052742 iron Inorganic materials 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000007769 metal material Substances 0.000 claims 2
- 229910052750 molybdenum Inorganic materials 0.000 claims 2
- 239000011733 molybdenum Substances 0.000 claims 2
- 239000011368 organic material Substances 0.000 claims 2
- 210000001747 pupil Anatomy 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- 235000012239 silicon dioxide Nutrition 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 2
- 229910052721 tungsten Inorganic materials 0.000 claims 2
- 239000010937 tungsten Substances 0.000 claims 2
- 239000007788 liquid Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762442838P | 2017-01-05 | 2017-01-05 | |
| US62/442,838 | 2017-01-05 | ||
| US15/480,206 | 2017-04-05 | ||
| US15/480,206 US10234402B2 (en) | 2017-01-05 | 2017-04-05 | Systems and methods for defect material classification |
| PCT/US2018/012103 WO2018128995A1 (en) | 2017-01-05 | 2018-01-02 | Systems and methods for defect material classification |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020504304A JP2020504304A (ja) | 2020-02-06 |
| JP2020504304A5 true JP2020504304A5 (https=) | 2021-02-12 |
| JP6906614B2 JP6906614B2 (ja) | 2021-07-21 |
Family
ID=62712307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019536595A Active JP6906614B2 (ja) | 2017-01-05 | 2018-01-02 | 欠陥材料分類のためのシステムおよび方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US10234402B2 (https=) |
| JP (1) | JP6906614B2 (https=) |
| KR (1) | KR102313412B1 (https=) |
| CN (1) | CN110301038B (https=) |
| DE (1) | DE112018000314T5 (https=) |
| IL (2) | IL267771B (https=) |
| TW (1) | TWI748034B (https=) |
| WO (1) | WO2018128995A1 (https=) |
Families Citing this family (35)
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| US10234402B2 (en) * | 2017-01-05 | 2019-03-19 | Kla-Tencor Corporation | Systems and methods for defect material classification |
| US10215714B1 (en) * | 2017-08-16 | 2019-02-26 | Siemens Energy, Inc. | Method and system for detecting defects on surface of object |
| US10192301B1 (en) * | 2017-08-16 | 2019-01-29 | Siemens Energy, Inc. | Method and system for detecting line defects on surface of object |
| US11017520B2 (en) * | 2018-09-04 | 2021-05-25 | Kla Corporation | Multi-wavelength interferometry for defect classification |
| TWI705242B (zh) * | 2018-10-08 | 2020-09-21 | 銓發科技股份有限公司 | 光學檢測設備及方法 |
| US11262591B2 (en) | 2018-11-09 | 2022-03-01 | Kla Corporation | System and method for pumping laser sustained plasma with an illumination source having modified pupil power distribution |
| US10942135B2 (en) * | 2018-11-14 | 2021-03-09 | Kla Corporation | Radial polarizer for particle detection |
| TWI689722B (zh) * | 2018-12-04 | 2020-04-01 | 台灣積體電路製造股份有限公司 | 辨識晶圓上微塵顆粒的方法、電子裝置及電腦可讀取記錄媒體 |
| KR102324622B1 (ko) * | 2018-12-12 | 2021-11-12 | 어플라이드 머티리얼즈 이스라엘 리미티드 | 프로세스 모니터링 |
| US11137350B2 (en) * | 2019-01-28 | 2021-10-05 | Kla Corporation | Mid-infrared spectroscopy for measurement of high aspect ratio structures |
| US11294162B2 (en) * | 2019-02-07 | 2022-04-05 | Nanotronics Imaging, Inc. | Fluorescence microscopy inspection systems, apparatus and methods with darkfield channel |
| US10948423B2 (en) | 2019-02-17 | 2021-03-16 | Kla Corporation | Sensitive particle detection with spatially-varying polarization rotator and polarizer |
| US11703460B2 (en) * | 2019-07-09 | 2023-07-18 | Kla Corporation | Methods and systems for optical surface defect material characterization |
| CN111007016A (zh) * | 2019-12-09 | 2020-04-14 | 暨南大学 | 一种检测透明材料表面微小颗粒杂质的装置及使用方法 |
| CN111406198B (zh) | 2020-02-24 | 2021-02-19 | 长江存储科技有限责任公司 | 用于半导体芯片表面形貌计量的系统和方法 |
| CN111356896B (zh) | 2020-02-24 | 2021-01-12 | 长江存储科技有限责任公司 | 用于半导体芯片表面形貌计量的系统和方法 |
| WO2021168611A1 (en) | 2020-02-24 | 2021-09-02 | Yangtze Memory Technologies Co., Ltd. | Systems and methods for semiconductor chip surface topography metrology |
| WO2021168610A1 (en) | 2020-02-24 | 2021-09-02 | Yangtze Memory Technologies Co., Ltd. | Systems having light source with extended spectrum for semiconductor chip surface topography metrology |
| US12379655B2 (en) * | 2020-04-24 | 2025-08-05 | Asml Holding N.V. | Contaminant identification metrology system, lithographic apparatus, and methods thereof |
| CN111879789A (zh) * | 2020-07-15 | 2020-11-03 | 深圳科瑞技术股份有限公司 | 金属表面缺陷检测方法及系统 |
| US12072267B2 (en) * | 2020-08-31 | 2024-08-27 | Applied Materials, Inc. | Method and hardware for post maintenance vacuum recovery system |
| CN111929310B (zh) * | 2020-09-25 | 2021-02-05 | 歌尔股份有限公司 | 表面缺陷检测方法、装置、设备及存储介质 |
| US20220139743A1 (en) * | 2020-11-04 | 2022-05-05 | Tokyo Electron Limited | Optical Sensor for Inspecting Pattern Collapse Defects |
| CN115248531A (zh) * | 2021-04-26 | 2022-10-28 | 上海微电子装备（集团）股份有限公司 | 颗粒度检测装置及其检测方法、光刻机 |
| US11664283B2 (en) * | 2021-08-20 | 2023-05-30 | Tokyo Electron Limited | Raman sensor for supercritical fluids metrology |
| TWI796791B (zh) * | 2021-09-16 | 2023-03-21 | 崇浩光電科技股份有限公司 | 二維掃描式拉曼光譜檢測系統 |
| CN113985592B (zh) * | 2021-09-24 | 2024-09-03 | 江苏锐精光电研究院有限公司 | 基于色散元件的多角度全内反射照明成像装置 |
| JP7604354B2 (ja) * | 2021-10-29 | 2024-12-23 | 株式会社ニューフレアテクノロジー | 検査装置及び焦点位置調整方法 |
| CN114815206A (zh) * | 2022-04-19 | 2022-07-29 | 中国工程物理研究院激光聚变研究中心 | 一种在线x光高分辨探测器 |
| KR20240100906A (ko) * | 2022-12-23 | 2024-07-02 | 엘지이노텍 주식회사 | 대상체의 불량 검출 장치 및 대상체의 불량 검출 방법 |
| US20250060324A1 (en) * | 2023-08-14 | 2025-02-20 | Tokyo Electron Limited | Hybrid x-ray and optical metrology and navigation |
| WO2025048706A1 (en) * | 2023-08-28 | 2025-03-06 | Semiconductor Technologies & Instruments Pte Ltd. | System and method for die inspections |
| EP4575468B1 (en) * | 2023-12-18 | 2026-04-01 | Unity Semiconductor | A method and a device for detecting crystalline defects in a substrate by dark field and photoluminescence |
| WO2026038098A1 (en) | 2024-08-16 | 2026-02-19 | Orbotech Ltd. | Thermal detection of internal defects in semiconductor |
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| JP6531108B2 (ja) | 2013-10-23 | 2019-06-12 | ナノヴィジョン・テクノロジー・（ベイジン）・カンパニー・リミテッド | 光子計数に基づく放射線結像システム、方法、及びそのデバイス |
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| US10234402B2 (en) * | 2017-01-05 | 2019-03-19 | Kla-Tencor Corporation | Systems and methods for defect material classification |
-
2017
- 2017-04-05 US US15/480,206 patent/US10234402B2/en active Active
-
2018
- 2018-01-02 KR KR1020197022835A patent/KR102313412B1/ko active Active
- 2018-01-02 CN CN201880011822.6A patent/CN110301038B/zh active Active
- 2018-01-02 WO PCT/US2018/012103 patent/WO2018128995A1/en not_active Ceased
- 2018-01-02 DE DE112018000314.0T patent/DE112018000314T5/de active Pending
- 2018-01-02 JP JP2019536595A patent/JP6906614B2/ja active Active
- 2018-01-04 TW TW107100280A patent/TWI748034B/zh active
-
2019
- 2019-03-18 US US16/357,025 patent/US10670537B2/en active Active
- 2019-07-01 IL IL267771A patent/IL267771B/en unknown
-
2021
- 2021-06-22 IL IL284286A patent/IL284286B/en unknown
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